SGS SEMICONDUCTOR TESTING SERVICE

ခޜ๬༹֪ڞSGSӷ

෢௮ܾྼஓ

କ঴߸ܠ႑တ

ࡽೕ ๫ࡽዚࠅ

ᇀSGS࠲

SGS๟ࡔाࠅණڦ๬֪ĂॠᄓࢅණኤऐࠓLj

ԥᇤྺ੗׼Ⴤ݀ቛĂዊଉ׵ࢅ႑ڦएጚă

݀ቛ዁ৃLj࿢்ڦᄽခԈࢻࡤ૴ᇑׂ೗Ă

߾ᄽᇑ࣍ৣĂᆐᄢᇑॳ੃Ăጲ඗ጨᇸĂኪ

๎ᇑ࠶૙Ăۉฆतຕጴࣅୃۇٴ୼቟Ӳ཮ă

࿢்ᆛᆶ98,000ܠఁጆᄽᇵ߾Ljݴքሞ

2,650ܠ߲ݴኧऐࢅࠓํᄓ๪ፇޜڦׯခ

ྪஏLjዂ૰ᇀӻዺඇ൰ਜ਼ࢽइڥฆᄽࠀׯ

ࢅ੗׼Ⴤ݀ቛLjᇑมࣷ߳হၻ๮ظሰ߸ெ

๘হăڦཚࢻ૴ࢻ߸ҾඇĂ߸Ăࡻ

SGSཚՔՔጚरຍޜခᆶ၌ࠅ)ິSGSཚՔ)

ᆯSGSणཷࢅ૯ຌᇀࡔׇ॔๨ॆ࠶۽૙ጺ

ਆဣཥڦዐࡔՔጚ੔रणཷࢇጨׯ૬ᇀ

1991౎ă࿢்૬ፁᇀणཷᄽခӱ੷Ljժཚ

ኧऐݴ߲ܠĂ90߾ఁጆᄽᇵܠ000,ᆯ16ࡗ

ࢅࠓ200ܠํ߲ᄓ๪ፇࡔڦׯాޜခྪஏLj

ྺ౫ׂ๋೗Ăၩݯ೗ĂઁׂĂ็ࣅĂ߾ᄽĂ

ీᇸĂഛכĂ࣍ৣĂิ࿿ᅅᄱڪဦݴႜᄽ

༵ࠃඇݛ࿋֪๬ĂॠᄓĂණኤĂಢჟࢅၯ

ጚڪዊଉ঴ਦݛӄă

We are SGS – the world’s leading testing, inspection and certification company. We

are recognized as the global benchmark for sustainability, quality and integrity. Today,

the SGS Group structure consists of 6 focused areas: Connectivity & Products,

Industries & Environment, Health & Nutrition, Natural Resources, Knowledge,

E-commerce & Digital Transformation. Our 98,000 employees operate a network of

2,650 offices and laboratories, helping businesses achieve success and sustainability,

working together to enable a better, safer and more interconnected world.

SGS-CSTC Standards Technical Services Co. Ltd. was founded in 1991 as a joint

venture between SGS Group and China Standard Science and Technology Group.

With an extensive network of 90 branches and more than 200 laboratories we have

more than 16,000 professionals serving our customers every day. We provide a fully

comprehensive range of integrated testing, inspection, certification, training and

calibration services across diverse industries such as agriculture & food, consumer

goods, minerals, petrochemicals, industrial, energy, automobile, environment, life

science and other sub-industries.

SGS Shenzhen Semiconductor and Reliability Laboratory provides one-stop quality

assurance services for electronic parts, electronic components, household appliances

and other electronic products. The lab is well equipped for general and specific tests

such as environmental simulation, mechanical durability, various types of electrical

performance, waterproof & dustproof, integrated stress and etc.

SGS Suzhou Semiconductor and Reliability Testing Laboratory provides AEC-Q101

Discrete Semiconductors and AQG 324 Power Module product testing and certification

services to meet the needs of device manufacturers and design companies in

automotive applications.

Now SGS is a member of the Automotive Electronics Council's Technical Committee,

able to offer a comprehensive range of AEC-Q test services, including AEC-Q100/101/

102/103/104/200, IPC, ISO, IEC, EIA, JEDEC, MIL and comprehensive failure analysis

and materials analysis used for the development and improvement of automotive

semiconductors.

SGS Shanghai Semiconductor Ultra Trace Analysis Lab provides a total solution services

for product quality and process contamination monitoring in the semiconductor and

panel industry. Its services include incoming material quality (silicon materials, PFA

materials, process chemicals and gases, cleanroom consumable.), FAB system quality

(cleanroom cleanliness air conduction system, airborne molecular contamination,

ultrapure water system, compressed dry air system). and particle emission testing of

equipment and components.

About SGS

ӷڞํ༹ᄓ๪

SGSศᒰӷڞ༹त੗੍Ⴀํᄓ๪ీࠕྺۉ

ጱፇॲĂۉጱᇮഗॲĂॆᆩۉഗۉڪጱׂ

೗༵ࠃᅃበ๕ዊଉԍቱޜခLj֪๬ၜణԈ

ઔ࣍ৣఇెĂऐႁఱ৳Ă߳ૌۉႠీĂݞ

ᄓă๬ڪ૰ᆌࢇĂጹࣅ઻ᇑࢺ

SGS໋ዝӷڞํ༹ᄓ๪ዷᄲ༵ࠃAEC-Q101

ݴ૬ӷڞ༹तAQG 324ࠀ୲ఇ੷ׂ೗֪๬

ණኤޜခLjᅜ஢ፁഗॲ׍ฆतยऺࠅິሞ

ഛכᆌᆩଶᇘڦႴ൱ă

ణമSGSᅙׯྺAECरຍ྿ᇵׯڦࣷᇵLjీ

༵ࠃඇ௬ڦAEC-Qဣଚ֪๬ޜခLjԈઔ

AEC-Q100/101/102/103/104/200, IPC, ISO,

IEC, EIA, JEDEC, MILᅜतᆩᇀਸ݀߀ࢅ৊

ဆăݴଙ֌ࢅဆݴቱࠤࢇጹڦ༹ڞӷכഛ

SGSฉ࡛ӷڞ༹࢓גଉݴဆํᄓ๪༵ࠃӷ

ڞ༹त௬ӱׂᄽׂ೗ዊଉᇑ዆ײ࿫ක॔੦

ڦඇݛ࿋ޜခLjԈઔ৊ଙዊଉॠᄓ(ࡂ֌ଙĂ

PFA֌ଙĂ዆ࣅײბ೗ᇑഘ༹Ăল৫๪ၩ

ࡼ(೗Ă׍ခဣཥዊଉ֪॔(੣ۙဣཥল৫

܈Ă੣ইݴጱ࿫කĂكג຤ဣཥĂუ໫੣

ഘဣཥ)ᅜतิׂยԢᇑևॲ݀פଉ֪๬ ă

ĂSemiconductor lab

01

02

ణ୤

Contents

੗੍Ⴀ֪๬

RELIABILITY TESTING

๬֪ৣ࣍ •

Environmental testing

• ऐႁఱ৳֪๬

Mechanical durability testing

• ىۉग़ඹ/EMC

Electromagnetic Compatibility

• โഘ௺ڪߌप֪๬

Moisture sensitivity level test

• ණኤ

Certification

ৢۉᇑឋ໮ၳᆌ֪๬

ESD & LATCH-UP TESTING

• ᇮഗॲESD֪๬ఇ႙

ESD test mode

• ยԢీ૰

Equipment capability

ᆩՔጚ׉ •

Common standards on

ESD test

ဆݴၳ฿

FAILURE ANALYSIS

ဆݴႠ࣋೦ݥ •

Non-destructive analysis

• ೦࣋Ⴀݴဆ

Destructive analysis

• ֌ଙݴဆ

Material analysis

• ӄ૩ݴၛ

Case study sharing

ມຐ਋ঋ૗ጱຐ

DUAL BEAM FIB

• ႊೌ၍ୟႪ߀

Circuit edit

• భ௝ൎೌ዆ᄣ

Nano cross-section

03

05

07

11

՗޹

SCHEDULE

• ഛۉכጱᇮഗॲ׉ᆩ֪๬Քጚ

Common test standards for

automotive electronic

components

• AEC-Q100֪๬ୁײ

AEC-Q100 test flow

• AEC-Q101֪๬ୁײ

AEC-Q101 test flow

• AQG 324֪๬ୁײ

AQG 324 test flow

13

Reliability testing

ໜጣۉጱۉഘႜᄽڦტ௓݀ቛLjׂ೗ڦ೗

ዊन੗੍Ⴀሁઠሁ๴ڟၩݯኁڦዘ๫Lj໲

ࢽᆌLjᆖၚጣਜ਼ݒথ኱ڦీ๑ᆩႠ๟ׂ೗

༹ᄓߌĂ஢ᅪ܈య዁Ҿඇ࿚༶ă

ڦ೗ׯڟም೗ׯӷڟଙ֌ᇱٗࠃ༵੗SGS

ᅃበ๕੗੍Ⴀ֪๬ĂݴဆޜခLjඓԍׂ೗

߾๕ݛڦ೺Ӏᇨీۼዐৣ࣍๺ᇑ༬ࡀ׉ሞ

ፕăۉഘۉࢅጱׂ೗ڦ੍੗Ⴀ֪๬੗ᅜӻ

੗ቱࠤۨంժඓ๱ڦ೗ׂࠚฆᇨ׍ׂิዺ

ీ݀ิڦᇱᅺǗ੗੍Ⴀᄓኤ੗ᅜӻዺ׍ฆ

ሞׂ೗৊෇๨ׇമ݀၄࿚༶Lj३ณቻޅ࣮

כࠃ༵੗࣏LjSGS้ăཞԨׯگ၃ᅜतই

ᆩۉጱྜኝڦ੍੗Ⴀೠࠚॠ֪ݛӄLjӻዺ

ጱႜᄽăۉᆩכ෇৊ິࠅऺICย

With the rapid development of the electrical and electronic industry, product reliability,

which directly reflects the product quality, is becoming more and more important for

the consumer. It is also a major factor affecting customer’s satisfaction and

sometimes even the safety perception of the product.

SGS provides one-stop reliability testing and analysis services from raw materials, to

semi-finished products to final products to ensure that products work as expected in

both conventional and more stringent environments. Moreover, reliability testing of

electrical and electronic products helps manufacturers to estimate the life of their

products and determine the cause of failures. In other words, our reliability verification

service helps the manufacturers to identify the problems of their products before they

enter the market. This reduces product recall risks and reduce costs. At the same

time, SGS can also provide complete reliability evaluation and testing solutions from IC

component to final automotive electronic products, helping IC design companies to

enter the automotive electronics industry.

੗੍Ⴀ֪๬

03

٪ئ࿒گ/ߛ •

High/low temperature storage

• ߛ๱໏ेం๬ᄓ

Highly accelerated life test

• ೋუ๱ం๬ᄓ Bias life test

• ࿒โ܈ೋუ๱ం๬ᄓ

Temperature and Humidity-Bias life test

• ߛ࿒ొၠೋუ๬ᄓ

High temperature reverse bias test

• ঍ୁፆ܏ۉუ

AC Blocking Voltage (ACBV)

• ߛ࿒ኟၠೋუ

High Temperature Forward Bias (HTFB)

• ࿘ༀ֡ፕ

Steady State Operational (SSOP)

࿒ቆटೋუߛ •

High Temperature Gate Bias (HTGB)

๬֪૰ᆌ܈໏ेߛ •

Highly Accelerated Stress Test (HAST)

ೋუၠݒโߛ࿒ߛ •

High Humidity High Temp. Reverse

Bias (H3TRB)

• ߛ࿒ߛโኟၠೋუ

High Temperature High Humidity Bias

(HTHHB)

• क़ၶሏႜ๱ం

Intermittent Operational Life (IOL)

Bakeੌ ࢞ •

• ৐โ Soaked

Reflowୁ ࣮ •

• גำ෢௮ Ultrasound scan

HTOL / Burn In

MCC LC-2 H1

LC-2܀૬࿒੦઻ࣅၒ

LC-2 INDEPENDENT TEMPERATURE CONTROL BURN-IN CHAMBER

Main Board for HTOL Program Board Socket Board

֪๬၄ׇ

TEST SITE

04

๬֪ৣ࣍

ENVIRONMENT TESTING

• ऐႁናۯ Mechanical vibration

• ऐႁ؋ऍ Mechanical shock

acceleration Constant ܈໏े࢛ۨ •

• ܋ጱഽ܈ Terminal strength

• ྖች Bending test

• ۚ஌ Drop test

• ӿ၍ઙ૰ Wire bond pull test

• ӿ၍२ൎ૰ Wire bond shear test

• ႊೌ२ൎഽ܈ Die shear test

࣍თ܈࿒ࢅ୲ࠀ •

Power and Temperature Cycle (PTC)

• ߛ࿒߾ፕ๱ం๬ᄓ

High temperature operating life test

• گ࿒߾ፕ๱ం๬ᄓ

Low temperature operating life test

• ੺໏࿒Վ

Rapid Temperature change test

• ࿒؋܈ऍ Thermal shock

• ాև຤ഛࡤଉ Internal water vapor

• ٚ୑/ဦ୑ Gross/fine leak

• ఱࡰথඤ Resistance to solder heat

• ဍႷิ׊ Tin whisker growth

์ޫ༹ൠഘࣅ଼ •

Hydrogen sulfide gas corrosion

• ंࢇഘ༹ޫ์ Mixed gas corrosion

ऐႁఱ৳

MECHANICAL DURABILITY

• ޖพ෡ඡ(ၭ๪݆ - TEM cell method)

Radiated Emissions (TEM - TEM cell

method)

• Standard: SAE J1752/3

ىۉग़ඹ/EMC

ELECTROMAGNETIC

COMPATIBILITY

โഘ௺ڪߌप֪๬

MOISTURE SENSITIVITY

LEVEL TEST

• AEC Q100

• AEC Q101

• AEC Q102

• AEC Q103

• AEC Q104

• AEC Q200

• AQG 324

• IEC 60747-17

• ණኤಢჟޜခ Certification training

ණኤ

CERTIFICATION

ESD & Latch-up testing

ৢۉᇑឋ໮ၳᆌ֪๬

੔ბरຍڦ݀໏੺ቛٝ๑ۉጱᇮॲוጣၭ

ቛăᆯᇀኄၵၠ݀ݛڦࣅሗްࠓ঳ࢅࣅ႙

ۉݣۉৢLjࠓ঳ߌ௺ۉৢሞ٪ጱᇮॲዐۉ

ă࣋໦ቱईࠤڦጱยԢۉዂ၎ᆌڞࣷ

SGSᆛᆶThermo Fisher MK 2TEĂOrion3

֪ጎހࡀ׉ଉۇٴยԢĂ֪๬ۉৢڦ৊ံڪ

ྜࠃ༵੗Ljܓྲཱྀरຍڦsocketᅜतጆᄽ๬

ኝڦESDतlatch-up֪๬ᄓኤăӻዺICย

LjՆీ૰ۉৢੇഄᄓኤ܎঩ऺሞยິࠅऺ

௨ESDੇৢڪۉपඍ။ܸ৊ႜଉׂڦࢫ໦

ฅLjཞ้ᄺ๟ӷڞ༹ഗॲ֑ݛࠔํ၄ੇৢ

ۉ૰ీᄓኤઠଙ࠶੦ࡻڦӻ๮ă

The fast development of science and technology has prompted the advancement of

electronic components towards miniaturization and structural sophistication. Due to the

existence of electrostatic sensitive structure in these electronic components, electrostatic

discharge will cause failure or damage of the corresponding electronic equipment.

SGS possesses advanced electrostatic testing equipment such as Thermo Fisher MK

2TE, Orion3, and many conventional package test sockets; together with a dedicated

technical team, we provide complete ESD and latch-up test validation services to our

customers. We help IC design companies to verify the ESD performance of their

products to avoid ESD related defects during mass production. We also help

semiconductor device buyers to source electronic components and products that meet

their needs.

05

• ට༹ఇ႙ HBM

• ऐഗఇ႙ MM

• ഗॲ؊ۉఇ႙ CDM

• ឋ໮ၳᆌ֪๬ Latch-up

• MM: Max. ±1kV

• CDM: Max. ±2kV

• V/I Power: 6 Power supplies

(30V/5A or 100V/1A)

1

2

3

4

5

6

7

8

9

10

ANSI/ESDA/JEDEC JS-002

AEC-Q101-005

AEC-Q100-011

ANSI/ESDA/JEDEC JS-001

AEC-Q100-002

MIL-STD-883-3

JEDEC JESD22-A115C

ESD SP5.2

AEC-Q100-004

JEDEC JESD78E

CDM

CDM

CDM

HBM

HBM

HBM

MM

MM

Latch Up

Latch Up

/

/

/

±1

±1

±3

±1

±3

/

/

/

/

/

0.3s

0.5s

1s

1s

1s

/

/

ۉጱᇮഗॲ Electronic components

ഛכᆩഗॲ Automotive devices

ഛכᆩഗॲ Automotive devices

ۉጱᇮഗॲ Electronic components

ഛכᆩഗॲ Automotive devices

ਬᆩྲۉጱ Military microelectronics

ۉጱᇮഗॲ Electronic components

ۉጱᇮഗॲ Electronic components

ഛכᆩഗॲ Automotive devices

ۉጱᇮഗॲ Electronic components

ࡽႾ

NO.

ࡽՔጚ

STANDARDS

ఇ๕ۉݣ

DISCHARGE MODE

ຕْۉݣ

NUMBER OF

DISCHARGES

ፌၭۉݣक़߰

MINIMUM DISCHARGE

INTERVA

ྷݔ๑ᆩ

SCOPE

ᇮഗॲESDॠ֪Քጚ COMPONENT ESD TEST STANDARDS

06

ESD

ESD-CDM ESD-HBM & LATCH-UP

ESDገথӱ-1

ESD KEYSETS-1 CDM-1

ᇮഗॲESD֪๬ఇ႙

ESD TEST MODEL

ยԢీ૰

EQUIPMENT CAPABILITY

• Vendor: Thermo Fisher

• Model: MK-2/Orion-3

• Spec:

• HBM: Max. ±8kV, Up to 512 pins

Failure analysis

ဆݴၳ฿

฿ၳݴဆሞ༵ߛ೗ׂዊଉĂरຍਸ݀Ăׂ೗

Ⴊްत฿ၳ๚ݛڪࠤ௬ਏᆶ࢔ഽڦํाᅪᅭ

ǖݥ೦࣋Ⴀݴဆፕྺ฿ၳݴဆዐڼڦᅃበLj

ీࠕ໏੺ᆶၳںӻዺਜ਼ࢽፔ؛օڦಒ܏Ljཞ

้ྺ৊ᅃօݴဆ๭ण߸ڦܠၳ฿႑တǗ೦࣋

Ⴀݴဆ๟ܔᇮഗॲᄣ೗৊ႜᅃဣଚლቴ฿ၳ

ऐ૙ݴဆᇑํᄓײࡗڦLjժྺਜ਼ࢽ༵ࠃඓۨ

฿ၳ๟౾඗Ⴀ಼࣏๟ଉႠڦᅈ਍Lj৊ܸᅈ਍

঳ஃྺਜ਼ࢽლቴ߀฀ٯแă

SGSᆛᆶྜኝݥڦ೦࣋Ⴀࢅ೦࣋Ⴀݴဆݛ

ӄࢅยԢLjሞࡗඁๆब౎ᅃ኱ศ߷ᇀPCB

ঢ়ᄓăڦ޷ݿକેဆLjओݴၳ฿ڦPCBAࢅ

SGSኝݴڦࡔڤࢅࡔࡣࢇဆरຍీ૰Ljे

ഽକྲ࠵֌ଙݴڦဆీ૰Ljӻዺਜ਼ࢽᄓኤĂ

ݴဆĂֱቴ฿ၳऐ૙Ljܸٗ໫܌ჺ݀ዜ೺Ă

বሀิׂׯԨă

Failure analysis has strong practical significance in improving product quality, technology

development, product repair and reducing failure incident. Non-destructive analysis, as

usually the first stop in failure analysis, can quickly and effectively help customers

make preliminary judgments, while collecting more failure information for further

analysis. Destructive analysis is usually the next step and involves a series of processes

in order to find out the failure mechanism and thus the root cause of failure of the

samples. This information will help to provide customers the basis for determining

whether the failure is random or systematic, and ultimately to find improvement measures

for customers to improve their products.

SGS has a complete range of non-destructive and destructive analysis equipment and

solutions, and has been working on electronic component, PCB and PCBA failure

analysis for more than a decade. SGS China works closely with the team from Korea

and Germany to provide a comprehensive analytical technology capabilities to help our

customers to verify, analyze and identify failure mechanisms, thereby shortening the

research and development cycle and saving production cost.

07

ဆݴႠ࣋೦ݥ

NON-DESTRUCTIVE ANALYSIS

ݥ೦࣋Ⴀݴဆ߾ਏ NON-DESTRUCTIVE ANALYSIS TOOL

༹๕၂ྲ৥

3D MICROSCOPE X-RAY SAT

• 3D Microscope

• VHX-5000

• 20~1000X zoom

• DAGE XD7500VR

• 2D/3D performance

• (0.5um) resolution

• Sonix ECHO-VS

• Scan mode: A, B, C, T-scan

• Scan area: 350 mm X 350 mm

• Step axis resolution: 0.25 um

3D၂ྲಆฝႊೌ߁ஸ

PHOTO OF A CHIP BY 3D OM

X-RAYॠֱ

X-RAY INSPECTION

SATݒพ෢௬

SAT C-SCAN OF CHIP SURFACE

3D၂ྲಆቷۇٴݣ཮

ZOOM-IN BY 3D OM

3D X-RAYॠֱ

3D X-RAY INSPECTION

SATۅ෢௬

SAT A-SCAN

VIྔ࠵ॠֱ X-rayॠֱ SATגำհ෢௮

ยԢీ૰ CAPABILITY

ݴဆఇ๕ ANALYSIS MODE ༑ཀྵೕ୲ PROBE FREQUENCY

T-Scan

A-Scan

C-Scan

B-Scan

Bulk-Scan

STARఇ๕

STAR mode

15MHzLjำհຐ኱০0.138mmLjݴՐ୲0.129mm

15MHz, 0.138mm diameter, 0.129mm resolution

30MHzLjำհຐ኱০0.122mmLjݴՐ୲0.086mm

30MHz, 0.122mm diameter, 0.086mm resolution

50MHzLjำհຐ኱০0.073mmLjݴՐ୲0.052mm

50MHz, 0.073mm diameter, 0.052mm resolution

75MHzLjำհຐ኱০0.049mmLjݴՐ୲0.036mm

75MHz, 0.049mm diameter, 0.036mm resolution

100MHzLjำհຐ኱০0.0366mmLjݴՐ୲0.0259mm

100MHz, 0.0366mm diameter, 0.0259mm resolution

15MHzLjำհຐ኱০0.138mmLjݴՐ୲0.129mm

15MHz, 0.138mm diameter, 0.129mm resolution

ፌۇٴᄣ೗ݴဆ؅٫ǖ312×312mmLj෢௮཮ೌፌၭ෉ॲݴՐ୲ǖ1μm

Maximum sample analysis size: 312×312mm, scan picture minimum software resolution: 1μm

08

09

೦࣋Ⴀݴဆ

DESTRUCTIVE ANALYSIS

֌ଙݴဆ

MATERIAL ANALYSIS

ۉႠݴဆ ELECTRICAL ANALYSIS

• I-V൸၍ଉ֪ I-V curve tracer

• LCR֖ຕଉ֪ LCR parameter test

฿ၳۨ࿋

FAULT LOCALIZATION ANALYSES

• EMMI/OBIRCH

• InGaAs

• Thermal

࿿૙೦࣋Ⴀݴဆ

PHYSICAL DESTRUCTIVE ANALYSIS

• ਸހ/ൽৗ૭ De-capsulation

• ႊೌඁ֫(ࣅბ์ਗ਼/RIE)

Chip delayer (chemical etching/RIE)

• ක෥ Staining

• ಆቷ Take photo

• ൎೌݴဆ Cross section

• ڪ૗ጱൎߪ዆ᄣ Ion Mill

• FIBൎೌ FIB cross section

ހਸ

DE-CAPSULATION

FIBኍܔBGAኲ൰ࢅPADൎೌ

FIB CROSS SECTION OF A BGA SOLDER BALL

FIBኍܔႊೌൎೌ

FIB CROSS SECTION OF A CHIP

TEM࠵ִႊೌ೪௬঳ࠓ

TEM OF A VIA STRUCTURE

֌ଙ঳ࠓႚༀݴဆ

ANALYSIS OF MATERIAL STRUCTURE

AND MORPHOLOGY

• ᇱጱ૰၂ྲݴဆ AFM

• ׇ݀พۉጱ෢௮၂ྲݴဆ FE SEM

• حཪۉጱ෢௮၂ྲ৥ݴဆ TEM

֌ଙᇮ໎ࡤଉᅜतݴݴׯဆ

MATERIAL ELEMENT CONTENT AND

COMPOSITION ANALYSIS

• ۉጱ༑ኍXพ၍၂ྲݴဆ EPMA

• ీଉ෥ොXพ၍࠼೷ݴဆ EDX

• Xพ၍ۉ࠼ጱీ೷ݴဆ XPS

• ܭၶۉጱీ೷ݴဆ AES

• ْܾ૗ጱዊ೷ SIMS

• ݧႜ้क़ْܾ૗ጱዊ೷ᅏ Tof-SIMS

IR-FT ဆݴ೷࠼ྔࢤ •

• Xพ၍ᄆพݴဆ XRD

ӷڞ֌༹ଙּሗݴဆ

SEMICONDUCTOR MATERIAL DOPING

ANALYSIS

• ቛፆݴဆ SRP

• ْܾ૗ጱዊ೷ᅏഗ D-SIMS

• ݧႜ้क़ْܾ૗ጱዊ೷ᅏ Tof-SIMS

• ࡂĂ༐ࢅࡂࣅෙ࿵ፃഗॲ Si, SiC, III-V

༬๺ጆӄݴဆ SPECIAL ANALYSIS

• ႊೌ዆߾ײᅝ঳ݴࠓဆ

Analysis of the process structure of

the chip

• ࿫ක࿿ࢅൣলݴ܈ဆ(੓૭Ljࣅბ೗Lj՗

௬Lj཮֫)

Pollutant and cleanliness analysis

(particles, chemicals, surfaces, layers)

• ހጎ֌ଙዐᅎۯ૗ጱݴဆ

Mobile ion analysis in packaged materials

• SiC/GaN/GaAsႎӷڞ֌༹ଙݴဆ

SiC/GaN/GaAs new semiconductor

material analysis

D-SIMS CAMERA IMS 7F

TOF-SIMS ION-TOF 5

10

D-SIMSኍܔSiCӷڞ֌༹ଙݴڦဆ

ANALYSIS OF SIC SEMICONDUCTOR

MATERIALS BY D-SIMS

• D-SIMSᆌᆩᇀӷڞ༹ࢇࣅ࿿ศݴ܈ဆ

D-SIMS is used for deep analysis of

semiconductor compounds

• ܔGaNՔۨ࿿ዊLj੗ۨଉݴဆ

Quantifiable analysis of GaN calibration

substances

• փৈᆩᇀࡂ֌ଙLjD-SIMSཞ้ᄺᆩᇀႎ

ӷڞ֌༹ଙසSiCࢅGaAsݴڦڪဆ

Not only for silicon materials, D-SIMS

is also used for the analysis of new

semiconductor materials such as SiC

and GaAs

Tof-SIMSኍܔGaNӷڞ֌༹ଙݴڦဆ

TOF-SIMS ANALYSIS FOR GAN

SEMICONDUCTOR MATERIALS

• Tof-SIMS੗ᅃْ֪๬֌ଙ՗௬ܠዖᇮ໎

Tof-SIMS tests a wide range of

elements on the material surface

• ॠ֪ศ܈ٗ੗భ௝प՚૶Ⴤݴဆڟ10ྲ௝

प՚

Detection depth can be continuously

analyzed from the nanoscale to the 10

micron level

ဆӄ૩ݴ

ANALYZE THE CASE

Dual beam FIB

ມຐ਋ঋ૗ጱຐ

11

Dual Beam FIB (ມຐ਋ঋ૗ጱຐ)ऐ໼ీሞ

๑ᆩ૗ጱຐൎߪᄣ೗ڦཞ้Ljᆩۉጱຐܔ

ᄣ೗܏௬(೪௬)৊ႜ࠵ִLjᅨ੗৊ႜEDX

ݴݴׯڦဆLjీኍܔᄣ೗ዐڦྲဦ঳ࠓ৊

ႜభ௝ڦ܈؅ۨ࿋त࠵ִă૗ጱຐፌۉۇٴ

܌໫ၳᆶీ܈໏ၥൎڦ໏੺65nALjٳ੗ୁ

ൽڥຕ਍ڦ้क़ă

Dual Beam FIB (Focused Ion Beam and Electron Beam) machine use its ion beam to

create a cross-section surface, and then the electron beam to observe the sample

cross-section using scanning electron microscope (SEM). It can also be used for EDX

elemental composition analysis, TEM sample preparation and circuit edit. The

maximum current of the ion beam is up to 65nA, and the fast cutting speed can

effectively shorten the time to obtain data.

12

਋ঋ૗ጱຐ(FIB)ဣཥ૧ᆩᰆ૗ጱᇸࢅມཪ

৥਋ঋዹLjᆩഽଜڦ਋ঋ૗ጱຐ࢜ऍՔԨ

՗௬Ljᅜ৊ႜ৛௢֌ଙඁأĂקओݴߛࢅ

Ր୲ׯၟă

The Focus Ion Beam (FIB) system uses a

Gallium ion source and a dual lens focus

column to bombard the specimen surface

with a strong focusing ion beam for

precision material removal, deposition,

and high-resolution imaging.

ऐ໼߁ஸ

OUTLOOK OF A FIB

FIBాև

FIB INTERNAL VIEW

໼ೝፕ߾

WORKING PLATFORM

ႊೌ၍ୟႪ߀

CIRCUIT EDIT

ඓණূຌ֌ଙ࿖૙

METAL TEXTURE VIEW

TEM዆ᄣ

TEM SAMPLE PREPARATION

ยԢ঳ࠓቛ๖

FIB EQUIPMENT SCHEMATIC

প௬዆ᄣ࠵ೌ཮ִ

FIB CROSS SECTION VIEW

ยԢ֖ຕ

EQUIPMENT PARAMETERS

Model Helios 5 CX

Spec

Electron beam resolution

• At optimum WD:

• 0.6 nm at 30 kV STEM

• 0.6 nm at 15 kV

• 1.0 nm at 1 kV

• 0.9 nm at 1 kV with beam deceleration*

• Coincident point:

• 0.6 nm at 15 kV

• 1.5 nm at 1 kV with beam deceleration* and DBS*

VENDOR THERMO FISHER (USA)

FIB߾ፕᇱ૙

HOW IT WORKS

• ႊೌ၍ୟႪ߀ Circuit Edit

• భ௝ൎೌ዆ᄣ Cross-section

• ݴߛՐۉጱ෢௮၂ྲ৥ & EDXీ೷ݴဆ

SEM & EDX

ยԢీ૰

EQUIPMENT CAPABILITY

13

޹՗ᅃǖഛۉכጱᇮഗॲ׉ᆩ֪๬Քጚ

APPENDIX 1: NORMALLY TEST STANDARDS FOR AUTOMOTIVE ELECTRONIC COMPONENTS

ײୁ๬֪Q100 ǖAEC՗ܾ޹

APPENDIX 2: TEST FLOW

ഛۉכጱᇮॲ

֪๬Քጚ ᆅᆩ֖੊Քጚ

AEC-Q100

(णׯႊೌ)

AEC-Q101

(༹ڞ૬ӷݴ)

AEC-Q200

(ԥۯᇮഗॲ)

MIL-STD-883

JEDEC JESD22

MIL-STD-202

MIL-STD-750

AEC-Q104

(ܠႊೌఇ੷)

AEC-Q102

(༹ڞӷۉ࠼૬ݴ)

** GL test for

information only

Die Design

PAT

WBS

SD

Test

@Room Test

@Room

Test

@Room

Test @

Room,

Hot,

Cold

Test @

Room,

Hot,

Cold

Test

@Room

& Hot

Test

@Room

Test & Hot

@Room

& Hot

Test

@Room

& Hot

Test

@Room

& Hot

Test @Room, Hot & Cold

HBM/

MM CDM LU GL**

WBF

HTSL

HTOL EDR ELFR

PTC* TC

THB

or

HAST

AC

or

UHST

Test

@Room

Test

@Room

Test

Test @Room

@Room

Test

@Hot

Test

@Hot

Test

@Hot

PC EMC SERSC GFL IWV

MS VFV CA DROP

LT DS

ED

CHAR

FG

SM

NBTI

HCI

TDDB

EM

LI

PD

SBS FC

WBP

SBA

Test Group F

Test Group A Test Group B Test Group G

Test Group C

Test Group D

Waler

Fabrication

Package

Assembly

Extemal

Visual

Defect Screening

(e.g., Burn-in)

Functional/Parametric

Electrical Verification Test

* PC 22pcs before PTC

Test Group E

Test Group E

AREA 1-DESIGN HOUSE

Group DڦArea 1-੗੍Ⴀํᄓമࢫ

ິࠅऺႷICยݴևُLjీ֪๬ࠀڦ

ᇑ֪๬ࠌ׍ཞ༪ஃኴႜݛ๕LjᇑIC

ᅃӯᄓኤዷᄲֶᅴሞࠀీڦยۨ(ᅃ

ӯ๟ෙ࿒)ă

AREA 2-WAFER FOUNDRY

Group Dڦ൶ᇘ2ྺৗᇶ׍ሞৗᇶप

(wafer Level)ڦ੍੗ႠᄓኤLj࿮ৗᇶ

(Fabless)ڦICᄺႴᇑ྿ྂ዆ሰڦৗ

ᇶ׍ൽڥ၎࠲ጨଙă

AREA 3-RELIABILITY TEST

ྺ੗੍Ⴀ๫ׂ೗ހጎ/༬ႠႴᄲኴႜ

ڦၜణLjAECॽഄݴྺGroup A (े

໏࣍ৣᆌ૰ํᄓ)LjGroup B (े໏߾

ፕ๱ంఇె)LjGroup C (ހጎྜኝႠ

֪๬)LjGroup E (ۉႠᄓኤ֪๬)Lj

Group G (੣ഹ/௢ހྜኝႠ֪๬)ă

AREA 4-DESIGN VERIFICATION

Group Eڦևݴ൶ᇘ4ྺยऺ঩ڦ܎

܎঩೗ׯࠚဆೠݴఇ๕ᇑᆖၚ฿ၳ

໙ă୲ऺ߃ࡥቱࠤ༬Ⴀᄓኤतڦ

AREA 5-PRODUCTION CONTROL

Group Fڦ൶ᇘ๟ิׂ঩ڦ܎ዊଉ࠶

੦LjԈࡤଆ୲/Binڦ๑ᆩཥऺ๮݆

৊ႜ࠶੦त዆ۨՔጚتୁ૙ײă

14

ײୁ๬༹֪ڞ૬ӷݴQ101 ෙǖAEC՗޹

APPENDIX 3: AEC Q101 TEST FLOW

ײୁ๬֪੷ఇ୲ࠀ324 ǖAQG՗຺޹

APPENDIX 4: AQG 324 TEST FLOW

PD

WBP

WBS

DS

TS

RTS

TR

SD

WG

EV

TEST

Group C

Group A Group B Group C Group E

DI

Group D ৗᇶ዆ሰ੗੍Ⴀ֪๬

TEST GROUP D - DIE FABRICATION

RELIABILITY TESTS

ހጎፇጎྜኝႠ֪๬

TEST GROUP C - PACKAGE ASSEMBLY

INTEGRITY TESTS

๬֪૰უৣ࣍໏े

TEST GROUP A - ACCELERATED

ENVIRONMENT STRESS TESTS

े໏๱ంఇె֪๬

TEST GROUP B - ACCELERATED

LIFETIME SIMULATION TESTS

ހጎፇጎྜኝႠ֪๬

TEST GROUP C - PACKAGE ASSEMBLY

INTEGRITY TESTS

๬֪ഘᄓኤۉ

TEST GROUP E - ELECTRICAL

VERIFICATION TESTS

Wafer

Fabrication

Die

Design

Package

Assembly

External

Visual

Functional/Parametric

Electrical Verification Test

Test@ Room Test@ Room

Test@ Room

PC

Test@ Room

HAST or

H3TRB*

IOL or

PTC*

UHAST

or AC* TC

Test@

Room

Test@

Room

TCHT or

TCDT*

DPA DPA

Test@ Room

Test@

Room

Test@

Room

Sequential tests for hermetic packages

Test@

Room

Test@

Room Test@

Room

Test@

Room

Test@

Room

Test@ Room SC UIS PV

RSH HER MS

CA

HTRB HTGB SSOP ACBV

VVF

HBM CDM

QL LIFETIME TESTS

Amount of modules depending on number

of current paths per module

Module test - PRE

according to Table 6.1

QL-01

Power Cycling (short)

PCsec

Test/EoL parameter + lifetime model

DRIFT documentation

DRIFT documentation

DRIFT documentation

DRIFT documentation

DRIFT documentation

Test/EoL parameter + lifetime model

Module test - POST according to Table 6.1

Module test - POST according to Table 6.1

Module test - POST according to Table 6.1

Module test - POST according to Table 6.1

Module test - POST according to Table 6.1

QL-02

Power Cycling (long)

PCmin

QL-03

High Temperature Storage

HTS

QL-04

Low Temperature Storage

LTS

QL-05

High Temperature Reverse Bias

HTRB

QL-06

High Temperature Gate Bias

HTGB

QL-07

High Humidity High Temperature Reverse Bias

H3TRB

2×6 topological switches (each min.3 modules) 30 modules

30+12

2x

3

2x

3

6

6

6

2x

3

6

ᆅᆩ֖੊Քጚ

• IEC 60749

• IEC 60747

• IEC 60068-2

09/23/SGS SEMICONDUCTOR TESTING SERVICE_CN#EN_V2 © SGS Société Générale de Surveillance SA. (2023)

WWW.SGS.COM

WWW.SGSONLINE.COM.CN

૴ဣ࿢்

Contact us

࠽ዝ GUANGZHOU

࠽ዝ๨ঢ়षरຍਸ݀൶੔ბ׭੔ዩୟ

ࡽ198

No.198 Kezhu Road, Scientech Park,

Economic & Technical Development

District, Guangzhou, China

ࣆۉǖ+86 (0)20 8215 5911

ᆰၒǖcncanrel@sgs.com

ศᒰ SHENZHEN

ศᒰ๨ୄߖ൶ᒶགྷञࣀୟ430ࡽॿᠲ߾ᄽ

ᇴ4۰SGSۇٴ୍2୍

2/F, SGS Bldg, No.4, Jianghao Industrial

Park, No.430 Jihua Road, Bantian,

Longgang District, Shenzhen, China

ࣆۉǖ+86 (0)755 2532 8888-6150

ᆰၒǖcnszxrel@sgs.com

ฉ࡛ SHANGHAI

ฉ࡛۫೶๨ႎ൶੃ྰୟ299ࡽ1ص313๪

Room 313, Building 1, No.299 Kangwei

Road, Shanghai, China

ࣆۉǖ+86 (0)21 2097 6018

ᆰၒǖcn.semichem@sgs.com

໋ዝ SUZHOU

໋ዝ๨߾ᄽᇴ൶ྸႎୟ69ࡽᅃీ੔रᇴ2

୍3ص

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Singapore Industrial Park, Suzhou, China

ࣆۉǖ+86 (0)512 6298 8235

ᆰၒǖcnsuzrel@sgs.com