NT6008B Smart USB Charging Port Controller General Description Features The NT6008 is a smart USB interface IC specifically o 3.4V ~ 13.4V Single Supply Operation designed for high voltage dedicated charging port o Smart USB Charger Identification Circuit applications (HVDCP) that complies with Qualcomm® n Compliant with Quick Charge 2.0/3.0 Class A n Support Apple 2.1A/2.4A Applications Quick ChargeTM 2.0/3.0 Class A specification. The n Support Samsung Galaxy Note 2.0A NT6008 accurately adjusts HVDCP output voltage according to request of the handheld devices so that the Applications charging time can be 75% faster. n Support BC1.2 \& YD/T 1591 Battery Charging The NT6008 automatically identifies the handheld devices Specifications attached to the USB port. Then it emulates the original o Output Voltage Discharge Function chargers accordingly so that the attached device can draw o Output Over Voltage Protection maximum current from the charging port. o 8kV High ESD The NT6008 supports Apple iPad, Apple iPhone, o -40OC ~ +125OC Operating Ambient Temperature Samsung Galaxy Note, BC1.2 or YD/T 1591 compliant o TSOT23-8L or MSOP-10L Package devices, and majority of modern portable devices. o RoHS Compliant and Halogen-Free The NT6008 is available in TSOT23-8L and MSOP-10L packages. Note: Qualcomm Quick Charge is a product of Qualcomm Ordering Information Technologies, Inc. Qualcomm is a trademark of Qualcomm Incorporated, Order Number Package Top Marking registered in the United States and other countries. Quick Charge is a trademark of Qualcomm Incorporated. All NT6008BMT8 TSOT23-8L N04 Qualcomm Incorporated trademarks are used with NT6008BRAA MSOP-10L NT6008B permission. Note: EOSMEM products are compatible with the cur- Note: Apple, iPad, iPhone, Samsung and Galaxy Note are trademarks belonging to their respective owners. rent IPC/JEDEC J-STD-020 requirement. They are halo- Applications gen-free, RoHS compliant and 100% matte tin (Sn) plat- ing that are suitable for use in SnPb or Pb-free soldering o CLA Car Chargers processes. Pin Configuration o Computer Peripherals o Wall Adaptors VCC 1 8 SEL o USB Power Plugs REG 2 7 GND o Portable Power Banks DP 3 6 IREF DM 4 5 OUT TSOT23-8 SEL 1 10 VCC IREF 29 REG OUT 38 DP 47 DM NC 56 GND NC MSOP-10L EOSMEM Corporation 1 File Name: NT6008B-DS-F0001

NT6008B Typical Application Circuit 3.6V~12V VBUS 100Ω HVDCP Rfb1 NT6008B FB RREF VCC DM VBUS To SEL DP D- Portable OUT D+ Device IREF GND REG GND 1uF Functional Pin Description Pin No. Pin Name Pin Function MSOP-10L SOT23-8L SEL Mode Selection. Logic low selects Apple 2.4A mode, logic high selects 18 Apple 2.1A mode. Do not let this pin floating. IREF Reference Current Setting 26 OUT Current Sink/Source Output 35 NC Not Internally Connected 4, 5 NA GND Ground 67 DM Negative Data Line 74 DP Positive Data Line 83 REG Bypass for Internal LDO Output. 92 VCC Supply Input 10 1 Functional Block Diagram VCC LDO Discharge Auto Citcuit Detection REG 1:N Current SEL Reference Mirror DM Voltage DP OUT IREF GND 2 EOSMEM Corporation File Name: NT6008B-DS-F0001

NT6008B Functional Description The NT6008 is a smart USB interface IC specifically Mode 1 Configuration designed for high-voltage dedicated charging port applications. The NT6008 automatically identifies the Mode 1 is the default configuration when supply input is handheld devices attached to the USB port. Then it above the power on reset (POR) level. The NT6008 leaves emulates the genuine chargers accordingly so that the mode 1 and enters mode 2 if one of the three conditions attached device can draw maximum current from the is true: 1.) VDP > VDP-0 for 2ms; 2.) VDM < VDM-1 for 10ms charging port with demanded output voltage. or 3.) VDP < VDP-1 for 10ms. DM/DP Configuration When entering mode 2, the NT6008 resets the internal 2- second counter. The DM/DP have four configurations, mode 1 ~ mode 4, as shown in Figure 1 ~ Figure 4. The NT6008 Mode 2 Configuration automatically selects configurations according to the DP/ DM status and pre-defined timing so that the attached The NT6008 leaves mode 2 under two conditions: portable devices can be quickly charged. 1.) enters mode 3 if VDP-3 < VDP < VDP-2 for one second. 2.75V DP 2.75V DP 30K 30K 2.) otherwise enters mode 1 when the 2-second counter expires. Mode 3 Configuration 2.75V DM 2.05V DM The NT6008 leaves mode 3 under two conditions: 30K 30K 1.) enters mode 4 if VDP-3 < VDP < VDP-2 for 0.2s. SEL = Low SEL = High 2.) otherwise enters mode 2. Figure 1. Mode 1 Configuration. Mode 4 Configuration 100K 10R DP The NT6008 leaves mode 4 and enter mode 2 if VDP-5 > VDP DM for 2ms or VCC overvoltage protection is triggered. 1.2V At mode 4, the NT6008 keeps monitoring VDM voltage. Once VDM < VDM-5 for longer than 2ms, the OUT pin will sink or Figure 2. Mode 2 Configuration. source a current IOUT according to DP/DM voltages and the reference current IREF set by the resistor connected to IREF 400K 10R DP pin. Table 1 illustrates the relationship between IOUT and 20K DM DP/DM voltages. Table 1. IOUT vs. DP/DM voltages relationship VDP V DM IOUT VDP < VDP-5 X Enter mode 1 Figure 3. Mode 3 Configuration. VDP-5 < VDP VDM < VDM-5 0A DP VDP-5 < VDP < VDP-4 VDM-5 < VDM < VDM-4 7 * IREF DM 400K VDP-5 < VDP < VDP-4 VDM > VDM-4 Continuous 20K mode VDP > VDP-4 VDM-5 < VDM < VDM-4 4 * IREF VDP > VDP-4 VDM > VDM-4 Keep last state Figure 4. Mode 4 Configuration. EOSMEM Corporation 3 File Name: NT6008B-DS-F0001

NT6008B Functional Description Reference Current \& Current Sink Over Voltage Protection Use a resistor RIREF connected to IREF pin to set the If VCC is higher than 13.5V for 100us, over voltage protection reference current as: (OVP) is triggered. OVP turns off the current sink and resets the DP/DM to mode 1 configuration. IREF = 1.0V RREF Output Voltage Discharge When selected by VDM/VDM, the OUT pin will ramp up/ When the current sink decreases, theNT6008 sinks a 10mA down the sinking current to its target level with steps of current from the VCC pin for 500ms to discharge the output 1/10*IREF incremental, 50us per step. voltage of HVDCP to a safe level. Incremental IOUT When VDP-5 < VDP < VDP-4 and VDM > VDM-4, the NT6008 enters continuous mode. Upon each DP positive pulse with 150us delay time, the NT6008 increases output sinking current by 0.2 x IREF as shown in Figure 5. Pulsewidth (both tL and tH) shorter than 150us will be skipped. The maximum output sinking current is limited at 7.0 x IREF that will set the HVDCP output voltage 7V higher than nominal level. DM tH 2.0V 0.2xIREF DP tL IOUT tD Figure 5. Incremental IOUT. Decremental IOUT Upon each DM negative pulse with 150us delay time, the NT6008 decreases output sinking current (increases output sourcing current) by 0.2 x IREF as shown in Figure 6. Pulsewidth (both tL and tH) shorter than 150us will be skipped. The minimum output sinking current is limited at -1.4 x IREF (1.4 x IREF sourcing) that will set the HVDCP output voltage 1.4V lower than nominal level. DM tL 2.0V 0.2xIREF DP tH IOUT tD Figure 6. Decremental IOUT. EOSMEM Corporation 4 File Name: NT6008B-DS-F0001

NT6008B Absolute Maximum Rating (Note1) Supply Input Voltage, VCC -------------------------------------------------------------------------------------------------- -0.3V to +15V Other Pins ---------------------------------------------------------------------------------------------------------------------- +0.3V to 7V Storage Temperature Range -------------------------------------------------------------------------------------------- -55oC to +150oC Operation Temperature Range ------------------------------------------------------------------------------------------- -40oC to +125oC Lead Temperature Range (Soldering 10sec) --------------------------------------------------------------------------------------- 260oC ESD Rating (Note2) MM (Machine Mode), DP and DM ------------------------------------------------------------------------------------------------ 800V MM (Machine Mode), other pins -------------------------------------------------------------------------------------------------- 200V HBM (Human Body Mode), DP and DM ---------------------------------------------------------------------------------------- 8kV HBM (Human Body Mode), other pins ------------------------------------------------------------------------------------------ 2kV Thermal Information Package Thermal Resistance (Note3) TSOT23-8L qJA ------------------------------------------------------------------------------------------------------------ 250OC/W MSOP-10L qJA ------------------------------------------------------------------------------------------------------------- 160OC/W TSOT23-8L qJC ------------------------------------------------------------------------------------------------------------ 100OC/W MSOP-10L qJC -------------------------------------------------------------------------------------------------------------- 45OC/W Power Dissipation, PD @ TA = 25°C TSOT23-8L --------------------------------------------------------------------------------------------------------------------------- 0.4W MSOP-10L ------------------------------------------------------------------------------------------------------------------------ 0.625W Recommended Operating Conditions Operating Junction Temperature Range (Note4) --------------------------------------------------------------------- -40oC to +125oC Operating Ambient Temperature Range -------------------------------------------------------------------------------- -40oC to +125oC Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. Devices are ESD sensitive. Handling precaution recommended. Note 3. qJA is measured in the natural convection at TA = 25OC on a high effective thermal conductivity test board of JEDEC 51-7 thermal measurement standard. Note 4. The device is not guaranteed to function outside its operating conditions. EOSMEM Corporation 5 File Name: NT6008B-DS-F0001

NT6008B Electrical Characteristics (VCC = 5V, TA = +25oC unless otherwise specified.) Parameter Symbol Test Conditions Min Typ Max Unit Supply Input Supply Voltage Range VCC 3.4 -- 13.4 V Input Over Voltage Protection VOVP -- 13.5 -- V Quiescent Current ICC -- 0.35 0.5 mA DP/DM at Mode 1 DP Floating Voltage VDP 2.70 2.75 2.80 V 2.70 2.75 2.80 DM Floating Voltage VDM SEL = Low SEL = High V DP Pin Output Impedance ZDP 2.00 2.05 2.10 ZDM Delta from initial VDP 24 30 36 kW DM Pin Output Impedance VDP-0 24 30 36 kW SEL = Low 100 125 150 mV DP Rising Threshold for Exiting VDP-1 SEL = High Mode 1 VDP > VDP-0 2.0 2.1 2.2 V VDM-1 VDM < VDM-1 or VDP < VDP-1 2.0 2.1 2.2 V DP Falling Threshold for Exiting 1.4 1.5 1.6 V Mode 1 VDM = 1.2V 1.5 2.0 2.5 ms 8 10 12 ms DM Falling Threshold for Exiting Mode 1 5 10 20 W 1.1 1.2 1.3 V Debounce Time for Exiting Mode 1 ZDM 70 100 130 kW VDP-2 1.6 2.0 2.4 s DP/DM at Mode 2 VDP-3 1.0 1.05 1.1 V DP and DM Short Circuit Switch VDP-2 0.35 0.40 0.45 V DP/DM Terminal Voltage VDP-3 0.8 1.0 1.2 s DM Pin Output Impedance Recycle Time for Entering Mode 1 16 20 24 kW DP Upper Threshold Level for 320 400 480 kW Entering Mode 3 1.0 1.05 1.1 V DP Lower Threshold Level for Entering Mode 3 0.35 0.40 0.45 V Debounce Time for Entering Mode 3 0.16 0.20 0.24 s DP/DM at Mode 3 DM Pull Low Resistance DM Pull Low Resistance DP Upper Threshold Level for Entering Mode 4 DP Lower Threshold Level for Entering Mode 4 Debounce Time for Entering Mode 4 EOSMEM Corporation 6 File Name: NT6008B-DS-F0001

NT6008B Electrical Characteristics Parameter Symbol Test Conditions Min Typ Max Unit DP/DM at Mode 4 DP Pull Low Resistance VDM-4/VDP-4 VDM, VDP rising 320 400 480 kW DM Pull Low Resistance VDM-5/VDP-5 VDM, VDP rising 16 20 24 kW DM/DP Forth Threshold Level 1.95 2.05 2.15 V DM/DP Forth Level Hysteresis -- 100 -- mV DM/DP Fifth Threshold Level 0.325 0.350 0.375 V DM/DP Fifth Level Hysteresis -- 50 -- mV Debounce Time for DM Low 1.6 2 2.4 ms Debounce Time for DP Low 1.6 2 2.4 ms Current Sink IREF Pin Voltage RIREF = 100kW -- 1.00 -- V Output Current Accuracy RIREF = VDP-5 < VDP < VDP-4 69 70 71 uA 100kW VDM-5 < VDM < VDM-4 39 40 41 uA Glitch Time for VDP/VDM Change VDP > VDP-4 ; 32 40 48 ms VDM-5 < VDM < VDM-4 Duration for Current Step Quick Charge 2.0 Mode Output Current Incremental or Decremental with RIREF = 100kW Quick Charge 3.0 (Continuous) 120 150 180 us Mode Output Voltage Discharge Discharge Current Quick Charge 2.0 Mode 40 50 60 us Discharge Duration Quick Charge 2.0 Mode -- 1 -- Quick Charge 3.0 (Continuous) -- 2 uA Mode -- -- 10 -- mA -- 500 -- ms EOSMEM Corporation 7 File Name: NT6008B-DS-F0001

0.45 ± 0.05 TSOT23-8L NT6008B 0.65 ± 0.05 Package Information 1.50 - 1.70 2.80 - 3.00 2.60 - 3.00 1.00 ± 0.10 1.60 ± 0.10 2.60 ± 0.10 3.60 ± 0.10 0.65 BSC 0.22 - 0.38 0.00 - 0.15 Recommended Solder Pad Layout 0.08 - 0.22 1.45 MAX 0.30 - 0.60 1.95 BSC Note 1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm. EOSMEM Corporation 8 File Name: NT6008B-DS-F0001

MSOP-10L NT6008B 0.30 REF 1.00 REF Package Information 2.90 - 3.10 0.50 REF 2.90 - 3.10 4.80 - 5.00 3.50 REF 4.50 REF Recommended Solder Pad Layout 0.50 BSC 0 .1 7- 0 . 33 0.08-0.23 0.40 - 0.80 1.10 MAX 0.00 - 0.15 Note 1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm. EOSMEM Corporation 9 File Name: NT6008B-DS-F0001