JNO8-BPS027-A

防水TYPEC-卧贴L6.35后柱2脚插板定位锌合金

防水TYPEC-沉板0.8L6.7双耳半圆角半金露锡锌合金

防水TYPEC-沉板0.8L8.93双耳带锁孔2脚插板定位锌合金

防水TYPEC-立贴H7.853脚插板带柱

NOTES

NOTES

防水TYPEC-沉板1.6L6.8舌片外露0.8双壳点焊4脚插板

NOTES

Laser Welding
Point1.60 n 中 PINSIGNALNAMEPINSIGNALNAME DO8 A4 VBUS B9 VBUS Silicone- A5 CC1 B8 SBU2 A6 DP1 B7 DN2 6.69+8.855 A7 DN1 B6 DP2 中0.10 A8 SBU1 B5 CC2
00 A9 VBUS B4 VBUS A12 GND B1 GND C 8.348.82 0000000 4.40 553 1 中 2
4-0.30±0.05 553 Mating Bottom T 4-1.30 5.65 Face 2.954.00 11.30 1.75 2-3.275 9.54 7-0.50 2-0.85
80 1 20000 旺 册 S0 059 3069 14 8 明 8.200 R0.25 4-0.65 55450030 4 2-00.50 0 400 Conn.jEDGE FCBEDGE 4-1.00 7-0.50 2-0.85 9.05 1.75 2-3.275 11.30 RECOMMENDEDPCBLAYOUT TOLERANCE:±0.05 STENCIL THICKNESS:0.12mm

5.RECOMMENDEDPROCESS:THEPEAKTEMPERATUREONTHEBOARD SHALLMAINTAIN10±1SECONDSAT260±5℃.

JN16-BPF004-A

防水TYPEC-沉板1.4L7.45双壳4脚插板

防水TYPEC-卧贴L6.456脚插板带柱CH1.63

JN16-BPS005-A

防水TYPEC-卧贴L7.312脚插板带前柱

JN16-BPF021-A

防水TYPEC-卧贴L5.4舌片外露1.16脚插板带柱锌合金

防水TYPEC-卧贴L7.64脚插板双壳点焊

NOTES

A mmnnnnnnmm R ® 9 0 A 8.75 9.93

THICKNESS 1.0±0.10MM; DEFAULT TOLERANCE:±0.05

防水TYPEC-沉板L7.43舌片外露1.5双耳带锁孔锌合金CH0.35

防水TYPEC-立插H7.1双排4脚插板有底座

JN16-BDF024-A

防水TYPEC-立贴H6.85半包型2插2贴定位

防水TYPEC-立插H15.0三排4脚插板有底座

NOTES

3.ENVIRONMENTALPERFORMANCE:OPERATINGTEMPERATURE:-25°C\~+85°C.THEPEAKTEMPERATUREONTHEBOARDSHALLBEMAINTAINEDFOR10SECONDSAT260°C

防水TYPEC-立插H15.3双排4脚插板有底座

防水TYPEC-沉板1.4SMT+DIPL9.65双壳点焊4脚插板

防水TYPEC-板上双排贴L7.55舌片外露1.1双壳点焊4脚插板

JN24-BPS020-A

9.50±0.2>IPX81Hour/2m激光焊9.8540.158.34+0.020 PCB LAYOUT(TOLERANCE:±0.05)TNOTES 6.69 130010 1000Betor 0.90 02AefreIR0.12AfterIR1.ELECTRICAL CHARACTERISTICS: PINSIGNALNAME PIN SIGNALNAME1-1.CONTACT CURRENT RATING: A1 SSNDP1 B11 GNDP15.0AFORVBUSPINANDITSCORRESPONDINGGNDPIN. A3 SSTXN1 B10 SSRXN1A4 VBUS B9 VBUS1-2.CONTACT RESISTANCE: A5 CC1 B8 SBU2A6 DP1 B7 DN230MILLIOHMSMAXFORVBUSANDGNDCONTACTS. 888880 24–0.20±0.05 A7 A8 SBU1 DN1 B5 B6 CC2 DP240 MILLIOHMS MAXFOR ALL OTHER CONTACTS. 2–0.25±0.05 A9 VBUS B4 VBUSA10 SSRXN2 B3 SSTXN21-3.DIELECTRICWITHSTANDINGVOLTAGE:100VRMSACMIN. A11 SSRXP2 B2 SSTXP2A12 GND B1 GND1-4.INSULATIONRESISTANCE:100MEGOHMS MIN.2.MECHANICALCHARACTERISTICS: 2-3.DURABILITY:10000CYCLES.2-1.CONNECTOR INSERTIONFORCE:5\~20N. 2-4.OPERATING TEMPERATURE:-55CTO +85CATAMAXIMUNRATEOF12.5MMPERMINUTE 3.SALTSPRAY:48HOURS.2-2.CONNECTOREXTRACTIONFORCE: 4.DIMENSIONSAREINMILLIMETERS,BRACKETEDDIMENSIONSAREINCHESEQUIVALENTS.8\~20NATAMAXIMUNRATEOF12.5MMPERMINUTE. 5.RECOMMENEDPROCESS:IRREFLOW260°C,3\~5SECONDS.6\~20NAFTERDURABILITYTEST. 6.THECONNECTOR ISROHSCOMPLIANTAND HALOGENFREECOMPLIAN.

防水TYPEC-板上双排贴L7.55舌片外露1.1双壳点焊TID+ENIEC62680认证

JX24-BPS054-A

8 75 ,A1 18.3400+0.06 A12F.65 3.09 8.65-1.10 01Hour/2m 可6CLOF 2-1.30±0.5 S2-1 1ILI8.90±0.1nn 4PICK AREA14588888888激光焊24-0.20±0.053.003.00 2-0.25±0.05 u--u--U3.053.053.55 9.84±8:15
NOTESUMID PLATE (GND)
1ELECTNALARACEISTIS: 0.5 5 5-0.30 0.5UMIDPLATE(GND) PINSIGNALNAME PIN SIGNALNAME5.0AFORVBUSPINANDITSCORRESPONDINGGNDPIN. 800 00 2 1 A SSTXP1 B11 SSXP11-2.CACHUSANGNTC N 10-0.50 3.00 00L 23 中 24 A45A6 o 89887 U240MILLIOHMSMAXFORALLOTHER CONTACTS. RECOMENDED PCBLAYOUT 2 -24×0.25 2-890 XEDGE A7 A8 SBU1 DN1 B5 B6 CC2 DP21-3.DIELECTRICWITHSTANDINGVOLTAGE:100VRMSACMIN. A9 VBUS B4 VBUSA10 SSRXN2 B3 SSTXN21-4.INSULATIONRESISTANCE:100MEGOHMSMIN. A11 SSRXP2 B2 SSTXP2A12 GND B1 GND
2.MECHANICALCHARACTERISTICS:2-1.CONNECTOR INSERTIONFORCE:5\~20N. 6\~20NAFTER DURABILITYTEST.ATAMAXIMUNRATEOF12.5MMPERMINUTE 2-3.DURABILITY:10000CYCLES.2-2.CONNECTOREXTRACTIONFORCE: 2-4.OPERATINGTEMPERATURE:-55°CTO+85C8\~20NATAMAXIMUNRATEOF12.5MMPERMINUTE. 3.SALTSPRAY:48HOURS.

8.65A1 8.34+0.02 −A12 8.10 5．70 51111111 Hur/2m CLOF 0.65 激光焊 1.10REF15058同CLOF6.69 2-1.30±0.05 N2-1.10±05B12 2690.15 2 2-320±0.10 N10100.15±0.03 SMT TALS(Before IR)9.41□A-AAAN AAAA)PICK AREA000090000008888888888 激光焊122533 22220 □ □NOTES 3.883.80 2-020±005 9.35±0.151.ELECTRICAL CHARACTERISTICS: 4.45 3.55 3.55 9.848181-1.CONTACT CURRENT RATING: PINSIGNALNAME PINSIGNALNAMEUMIDPLUATE 3.55 3.55 A1 GND B12 GND5.0AFORVBUSPINANDITSCORRESPONDINGGNDPIN.2-0 AOAIE1-2.LNTACASTAUSANDGONCS 50 3445 VOON 8 SEUN008000000000 320 7540MILLIOHMSMAXFORALLOTHER CONTACTS. 15 3.003.000 0 2445 A6 DP1 B7 DN285 L 44 18480 DN1 6858488 o1-3.DIELECTSTANDGTAGE:0CN 2同 SBU14X0.95VBUSPCB EDGESSRXN22.MECHANICALCHARACTERISTICS: RECOMMENDED PCB LAYOUT A11 SSRXP2 B2 SSTXP22-1.CONNECTOR INSERTIONFORCE:5\~20N. (TOLERANCE:±0.05) A12 GND B1 GNDATAMAXIMUNRATEOF12.5MMPERMINUTE.2-2.CONNECTOR EXTRACTIONFORCE:8\~20NATAMAXIMUN 2-3.DURABILITY:10000CYCLES.RATEOF12.5MMPERMINUTE.6\~20NAFTERDURABILITYTEST. 2-4.OPERATINGTEMPERATURE:-55CTO+85C

JX24-BPS056-A

防水TYPEC-板上双排贴L7.55舌片外露1.1双耳带螺孔TID+ENIEC62680认证

防水TYPEC-板上双排贴L8.65双壳点焊双耳带螺孔 \scriptstyle \mathsf { T I D } + ENIEC62680认证

JX24-BPS057-A

8 A1 8.340.06 −A12 8.65 91 IPX8 CL OF 0.65 激光焊 1.10FE 5 1Hour/2m 151 B12 6.69 G0 2-8.90±0.15 FO 2 出 2-1.30±0.05 2-320±0.10 2-1.10±0.05 0.15±0.03 SMT TAILS(Before IR) 17.52±0.25 0.10 14.52±0.15 R-01.60±0.10 G PICK AREA 988888888 ? T
NO.TESTICLCHARACTERSTCS 115535 1222550 003.00 24-020+005 □ 激光焊 3.053.05 9.35±0.15 9.84±818 1-1.CONTACT CURRENT RATING: 5.0AFORVBUSPINANDITSCORRESPONDINGGNDPIN. UMDPLATE 3.53.55 PINSIGNALNAME PIN SIGNALNAME 1-2.CONTACT RESISTANCE: 4.50 0.50\*9=4.50 A1 GND B12 GND 30MILLIOHMSMAXFORVBUSANDGNDCONTACTS. 15 2-0.30 CUMDPLATE A SSTXP1 B11 SSRXP1 40MILLIOHMSMAXFORALLOTHER CONTACTS. 5 00430 252244 45 VBUS B8 VBUS 1-3.DIELECTRICWITHSTANDINGVOLTAGE:100VRMSACMIN. 15 10-0.50 2 A6 DP1 B7 DN2 25
21-4UC0 2 4-24025 X8EDGE A7 BU 886584 Ves A9 RECOMMENDED PCB LAYOUT 2-1.CONNECTOR INSERTIONFORCE:5\~20N. (TOLERANCE:±0.05) A10 SSRXN2 B3 SSTXN2 A11 SSRXP2 B2 SSTXP2 ATAMAXIMUNRATEOF12.5MMPERMINUTE A12 GND B1 GND 2-2.CONNECTOREXTRACTIONFORCE: 8\~20NATAMAXIMUNRATEOF12.5MMPERMINUTE. 2-3.DURABILITY:10000CYCLES. 6\~20NAFTERDURABILITYTEST. 2-4.OPERATINGTEMPERATURE:-55CTO+85C 8 Vacuum area PINSIGNALNAME PINSIGNALNAME 1H2m 2x01. 1.10 185 A TX1- BT RX1- 1.50±0.0 H.BAARABBABD 1X- A4 VBUS B8 VBUS ? . 595) A6 D B7 D 2 595 2xR1 T A8 A8 SBU1 B VCs 2 45 A10 RX2- B3 TX2- A11 RX2+ B2 TX2+ ShelxR1 20 A12 GND B1 GND -A12 0∠0 8820 355 0000800
NOTES B12 −B1 2x0.70±0.10 55 8.34±8.82 50 -9.35±0.10
1.MECHANICALPERFORMANCE: 1-1.INSERTIONFORCE: 0.5\~2.0kgf. Laser spot(2x) Laser weld 11x0.5050 7.50 h 1-2.EXTRACTIONFORCE:8\~20NINITIAL,6\~20NAFTERTEST. 2-T/Hx0.300.03 2x0.40 2.875 0∠0 A1 A12 1-3.DURABILITY: 10000 CYCLES. 10 18 1 8080 1
2.ELECTRICALPERFORMANCE: 2-1.CURRENTRATING:5AMINFORVBUS,0.25AMINFOROTHERS 2x0.40±0.10→ 5.50 0.10 N 广 os VOLTAGERATING:20VMAX. 2x0.30±0.05 5.500.10 9.35 24×0.20±0.05 2.625±0.10 RECOMMENDED PCB LAYOUT 2-2.LLCR:VBUS&GNDPINSAND OTHER PINS:40mΩ/PINMAX. 7.50±0.102875±0.1 DEFAULT TOLERANCE:±0.05
2-3.INSULATIONRESISTANCE:100MΩMIN 2-4.DIELECTRICWITHSTANDVOLTAGE,AC100VFOR1MINUTE. 5.Environmental Characteristics:5-1.Salt Spray: 48H 5-5. Relative Humidity: 15\~70%RH
3.Thewaterproof grade is IPX8(1.5mdepthof water). 5-2.IRReflow:PeakTemperature245±5°C(Time:30S) 5-6.StorageLife:6Months
4.PIN DEFINITION: (GND pins(A1,A12,B1,B12)and Mid Plate 5-3. Operating Temperature Range:-30°C to +85C. 6.Comply to Rohs2.0 & HF. should connecttogetherinPCBcircuit.) 5-4.StorageTemperatureRange: - 2 0 ^ { \circ } C to+60C. Vacuum area PINSIGNALNAME PIN SIGNALNAME 1 Hour/2m 1.501 W A GN1+ B12 B11 GN1+ A3 TX1- B10 RX1- LAPAARRA A4 VBUS B9 VBUS A5 CC1 B8 SBU2 2 A6 D+ B7 D? A7 D- B6 D+ A8 SBU1 B5 CC2 2 H 01008 A10 VBUS B VXUS 2x2.50±0.15 9.65±0.10 50 A11 RX2+ B2 TX2+ 32 A12 GND B1 GND 2 A12 2x8.92±0.15 000000000
NOTES B12 8.34÷0.02 −B1 2x0.70±0.10 2550 -9.25±0.10 - 1.MECHANICALPERFORMANCE: Laser spot(2x) Laser weld 1-1.INSERTIONFORCE:0.5\~2.0kgf. 11x0.50±0.03 900 1-2EA 2-T −2.875 LXZ 中 T + eohoe
2ELCF 1111 8 2 VOLTAGERATING:20VMAX 2030-0 5.50±0.10 2.625±0.10 0x RECOMMENDED PCB LAYOUT 2-2.LLCR:VBUS&GND PINSAND OTHER PINS:40mΩ/PIN MAX. 7.50±0.102875±0.10 DEFAULT TOLERANCE:±0.05 2-3.INSULATIONRESISTANCE:100MΩMIN 2-4.DIELECTRICWITHSTANDVOLTAGE,AC100VFOR1MINUTE. 5.Environmental Characteristics:5-1.Salt Spray: 24H 5-5.Relative Humidity:15\~70%R 3.Thewaterproof grade is IPX8(1.5mdepthof water). 5-2.IRReflow:PeakTemperature240±5°C(Time:30S) 5-6.StorageLife:6Months 4.PIN DEFINITION: (GND pins(A1,A12,B1,B12) and Mid Plate 5-3.Operating Temperature Range:-30°C to+85C. should connecttogetherinPCBcircuit.) 5-4.StorageTemperature Range:-20°Cto+60℃.

防水TYPEC-板上SMT+DIPL10.65双壳4脚插板带柱

防水TYPEC-沉板双排贴L7.52舌片外露1.38双壳双耳带螺孔

JN24-BPS029-A

Vacuum area 0 中 1.10818 8 PNSGNAMW PNSIGNAME 1 Hour/2m NAARABAA A VX1s B10 VX1s 8 99' A5 CC1 B8 SBU2 A6 D+ B7 D0/1X 353) 4718A9 BUs 66584 8 9.65.0.10 A1 RX2+ B TX2 10. A12 GND B1 GND (8.90)- 0∠0- mo NOTES B12 -8.340.02 2x0.70±0.10 22.0-5 9.35±0.10 1.MECHANICALPERFORMANCE: 1-1.INSERTIONFORCE: 0.5\~2.0kgf Laser spot(2x) aser weld .50 1-2.EXTRACTIONFORCE:8\~20NINITIAL,6\~20NAFTERTEST a 11x0.50±0.03 2x0.40→ -5.50 -2.875 1-3.DURABILITY:10000CYCLES. 10 2–T/H2x,300.03 A12 2.625 2.ELECTRICALPERFORMANCE: o 出 1.CUENT 2x0.30.1.05 24 1500 2701.10)PC8Edge 5.50±0.10 20 2-2.LLCR:VBUS& GND PINS AND OTHER PINS:40mQ/PIN MAX. 24×02052251 REFAMLTDLEPCLAYOUT 2-3.INSULATIONRESISTANCE:100MΩMIN 2-4.DIELECTRICWITHSTANDVOLTAGE,AC100VFOR1MINUTE 5.Environmental Characteristics:5-1.Salt Spray: 48H 5-5. Relative Humidity: 15\~70%RH 3.Thewaterproof gradeis IPX8(1.5mdepthofwater). 5-2.IRReflow:PeakTemperature245±5C(Time:30S) 5-6.StorageLife:6Months 4.PIN DEFINITION: (GND pins(A1,A12,B1,B12)and Mid Plate 5-3. Operating Temperature Range:-30°C to +85C. 6.Comply to Rohs2.0 & HF. should connect together in PCBcircuit.) 5-4.Storage Temperature Range:-20°Cto+60°C.

防水TYPEC-沉板双排贴L9.37舌片外露2.41双耳带螺孔

8 16.40±0.08 1Hour/2m 1015 13.34±0.05 D v 00006 智 品 2-0.20±0.05 221.60±0.05 9.04±0.10 H 0.05 1.55±0.05 2-1.00 品 10–0.30 −2-0.501e 900 2 Gnd 180028 22 800
NOTES 0 10.34±0.08 16-0.25 0008800080
1.ELECTRICALCHARACTERISTICS: 200 00 A1 8.340.02 A12 1-1: CURRENT RATING: 3A. LL 10-0.50 PCB 8 1-2CONTCTAETAE3VAC EDGE B12 1.24 13.30
1-4:CONTACTRESISTANCE:40MILLIONHMMAX. 1 PCB HOLES(TOP VIEW)t=0.7mm 15:LETT 2008 PINSIGNAL NAME PINSIGNALNAME
2.MECHANICAL CHARACTERISTICS A2 TXT+ B11 RX1+ A3 TXT- B10 RX1- 2-1:INSERTIONFORCE:5\~20N 5 A4 VBUS B9 VBUS 2 5464748 88876665 3
3.IRREFLOW: THEPEAK TEMPERATURE ON THE BOARD SHALL 8.58 4.50 10-0.25±0.05 A9 VBUS B4 VBUS A10 RX2- B3 TX2-
BEMAITAIEF0SECOA6C 65 A12 RX2+ B TX2

JX24-BPS059-A

防水TYPEC-双排立贴H5.2舌片外露1.04脚插板锌合金底座

JX24-BPF060-A

防水TYPEC-沉板单排贴L5.95舌片外露1.456脚插板支持USB4.0高速传输

JN16-BPD066-A

TYPEC立插 H = 1 0 . 2 防水IPX7铁壳带弹片(脚长1.72.0)

TYPEC24PIN立贴H6.38

JN16-SPD065-A

TYPEC16P立贴6.5母座 (脚长0.95小脚)

TYPEC24PIN前插后贴

NOTES

防水USB-卧插L11.44脚插板前柱A母

JN08-BPD036-A

防水USB-立插H11.42脚插板定位A母

JN06-BPD040-A

防水USB-沉板3.23L11.42脚插板定位A母

JNO6-BPD041-A

防水USB-沉板/焊线L11.2双耳带锁孔A母

NOTES

JN06-BPD042-A

防水USB-焊线L11.2双耳带锁孔A母

防水Micro连接器是一种具有防水功能的小型连接器，主要用于需要在潮湿、多尘或其他恶劣环境下保证可靠连接的电子设备中，如智能手机、平板电脑、可穿戴设备、医疗器械、工业自动化设备等

WaterproofMicroconnectorisasmallconnectorwithwaterprooffunction,mainlyusedinelectronicdevices thatrequirereliableconnectioninumiddustyorotherharshnvironments,suchassmartphonestablets wearabledevices,medicalequipment,industrialautomationequipment,etc.

防水性能好
连接稳定
体积小巧
③坚韧耐用的材质

③Goodwaterproofperformance
③Stableconnection
③Compact in size
③Durableandtoughmaterial

防水Micro系列

WATERPROOFMICRO series

JV05-BPS001-A

防水Micro-卧贴L7.04脚插板带中柱

JV05-BPS002-A

防水Micro-卧贴L5.252脚插板带后柱

防水Micro-立贴H6.253脚插板定位

8
1Hour/2m

NOTES

1.Currentrating:15PIN2.0AMax/234PIN1AMax.
2. Dielectric withstanding voltage:10o V(ac) for1 min.
3.Contactresistance:30mΩMax.
4. Insulation resistance: 100 MΩ Min.
5.Totalmating force:3.57KgfMax.
6.Total unmating force: 1.0 Kgf Min.
7.Temperature range:-30°C\~80°C.
8.Waterproof: IPX8.

防水Micro-卧贴L6.104脚插板定位

JV08-BPS004-A

8 IPX7 30min/1m

NOTES

1.Currentrating:15PIN2.0AMax/2,3,4PIN1AMax.
2. Dielectric withstanding voltage:1oo V(ac) for 1 min.
3.Contactresistance:30mΩMax
4. Insulation resistance:100 MΩ Min.
5.Totalmatingforce:3.57KgfMax.
6.Total unmating force:1.0 Kgf Min.
7.Temperaturerange:-30°℃\~80°℃.
8.Waterproof: IPX7.

防水Micro-卧贴L6.35双耳半圆角带前柱锌合金

NOTES

1.Currentrating:15PIN18AMax/234PINax.
2. Dielectric withstanding voltage:10o V(ac) for 1 min.
3.Contactresistance:30mΩMax.
4. Insulation resistance:100 MΩ Min.
5.Totalmatingforce:3.57KgfMax.
6.Total unmating force: 1.0 Kgf Min
7.Temperaturerange:-30°C\~80℃
8.Waterproof: IPX7.

防水Micro-卧贴L6.502插2贴定位

JV06-BPS006-A

NOTES

1.Currentrating:15PIN2.AMax/2,3,4PINAax.
2.Dielectric withstanding voltage: 10o V(ac) for1min.
3.Contactresistance:30mΩMax.
4.Insulation resistance:100 MΩ Min.
5.Totalmating force:3.57KgfMax.
6.Total unmating force: 1.0 Kgf Min.
7.Temperaturerange:-30°℃\~80°℃.
8.Waterproof: IPX7.

防水Micro-卧贴L6.106脚插板定位

JV05-BPS008-A

防水Micro-板上全贴L6.0双耳带锁孔

防水Micro-板上全贴L7.0双耳带螺孔A/B型

JM05-BPF010-A

防水Micro-立插L6.35双排针2脚插板

USB4.0Type-C连接器制造商
支持USB4高速传输
传输速度高达40Gbit/s
可承受10，000次反复插入和拔出

USB4.0Type-CConnectorsManufacturer SupportUSB4high-speedtransmission. Transmissionspeedsupto40Gbit/s. Canwithstand1O,Ooorepeatedinsertionsandwithdrawals

③正向和反向插入 ForwardandReverseInsertion 双向输出 ③Bi-directional output 向下兼容 ③Downwardcompatible 耐高温 ③Hightemperatureresistance 高使用寿命 High life time

精确连接，成就智能未来满足各类客户的不同需求

Accurateconnectioncontributestointelligentfuture.
Meetthedifferentneedsofallkindsofcustomers.

USBTYPEC系列USB/TYPECseries

JX08-BPD042-A

USBTYPEC-立插H6.1双排针6脚插板定位<br>USBTYPEC-焊板公头L13.6

小 . RECOMMENDED P.C.B. LAYOUT 8.64 TOLERANCE UNSPECIFIED ±0.05mm 5.30 0.55 60.30 0.50 4\*0.30 8460.22 南 H Hen TnLen N.TESILSPECIFICATONI 09 1.HOUSING:PA9TBLACK 2.TERMINAL:COPPERALLOY 3.16 8.96 3.MIDPLATE:STAINLESSSTEEL 8.36 0.04 PIN SIGNALNAME PIN SIGNALNAME 4.SHELL:STAINLESSSTEEL A1 GND B4 VBUS 2. PLATING SPECIFICATION: A5 DP1(D+) B5 VUS A7 DP1(D-) 2-1.CONTACTS:Ni50u”MIN.UNDERPLATEDOVERALL B9 /B5 B4 A12 GND Contactarea:Reference tableSolderingarea:Reference table 2-2.SHELL:Ni plating 50uMin CURRENTRATING:3AMPS.FORTOTALVBUS/GNDPINS;1.25AMPSFORCCPIN,0.25AMPS.FORALLOTHERCONTACT. 2-3.MID PLATE:Ni plating 50u"Min 4-2.LLCR:VBUS&GND PINSAND OTHER PINS:40mQ/PINMAX. 3.MECHANICALPERFORMANCE: SHIELD:50mΩ/MAX.LLCRMAX.CHANGEOFALLPINS:10mΩ 3-1.INSERTIONFORCE:5N\~20N. 4-3.INSULATIONRESISTANCE:100MQMIN 3-2.REMOVALFORCE:8N\~20N 4-4.DIELECTRICWITHSTANDVOLTAGE,AC100VFOR1MINUTE 3-3.DURABILITY: 10000CYCLES. 5.ENVIRONMENTALPERFORMANCE:OPERATINGTEMPERATURE:-30°C\~+85°C. 4.ELECTRICALPERFORMANCE: 6.IRREFLOW:THEPEAKTEMPERATUREONTHEBOARDSHALL 4-1.VOLTAGERATING:5VDC/AC (RMS.max) BEMAINTAINEDFOR10SECONDSAT260C.

10.10 7.151.30(2x) 0 0.50（2X)□有11.388.25±0.03 RECOMMENDLPCLEYOUTTOPVIEW)10.078150（22X B12 11.2509±0.04] （端子、铁壳、卡钩）NOTESPIN SIGNALNAME N SIGNALNAME1.MATERIALSPECIFICATION: A1 GND B12 GNDA2 SSTXP1 B11 SSRXP11-1.HOUSING: HIGHTEMPERATURERESISTANT PLASTIC,UL94V-0. A3 SSTXN1 B10 SSRXN1A4 VBUS B9 VBUS1-2.CONTACTS:COPPERALLOY A5 CC1 B8P0.50（11X） A6 DP1 B71-3.MIDPLATE:STAINLESSSTEEL 5.50=0.5X11 A DN1 B1-4.FRONTSHELL:STAINLESSSTEEL 7.15 A9 B4A10 B31-5.EMI PLATE:STAINLESSSTEEL A11 B22.PLATING SPECIFICATION: A12 GND B12-1.CONTACTS:Ni 50u"MIN. UNDER PLATED OVER ALL 3-1.INSERTIONFORCE:0.5\~2.0kgf.3-2.REMOVALFORCE:0.8kgf\~2.0kgf.3-3.DURABILITY:10000CYCLES.AuPLATEDONTHEFUNCTIONALAREAOFCONTACT. 4.ELECTRICALPERFORMANCE:4-1.CURRENTRATING:5.0A VOLTAGERATING:5.0V(GOLD PLATING THICKNESS FOLLOWTHE P/N) 4-2.LLCR:VBUS&GNDPINS AND OTHER PINS: 40mQ/PINMAX80u"MINTINPLATEDONSOLDERAREA SHIELD:50mQ/MAX.LLCRMAX.CHANGEOFALLPINS:10mΩ2-2.FRONT SHELL: Ni30u"MIN.UNDERPLATED OVER ALL 4-3.INSULATIONRESISTANCE:100MQ MIN4-4.DIELECTRICWITHSTANDVOLTAGEAC100VFOR1MINUTE.2-3.MIDPLATE:Ni50uMIN.UNDERPLATEDOVERALL. 5.ENVIRONMENTALPERFORMANCE:OPERATINGTEMPERATURE:-25°C\~+125°C.2-4.EMIPLATE: CLEAR ONLY 6. IR REFLOW: THE PEAK TEMPERATURE ON THE BOARD SHALL3.MECHANICALPERFORMANCE: BEMAINTAINEDFOR10SECONDSAT260°℃C.

USBTYPEC-卧贴L8.354脚插板带柱

1.0U16–0.20±0.05 8–0.30man.nn.nnnm A1/B124/BBB A9B1/A12□ 中Q0.60中 出0.600.90 PCB EDGE5 8.34+0.0 MEND P MPONENTSIDE)A A12 TOLERANCE FOR PCB LAYOUT IS ± 0.05B12- 0.10NOTES 2–1.101.MATERIALSPECIFICATION: PINSIGNALNAME PIN SIGNALNAME1-1.HOUSING: HIGH TEMPERATURERESISTANT PLASTIC,UL94V-0. A1 GND B12 GNDA4 VBUS B9 VBUS1-2.CONTACTS:COPPERALLOY A5 CC1 B8 SBU21-3.MID PLATE: STAINLESS STEEL A6 DP1 B7 DN2ww\* A7 DN1 B6 DP22.PLATINGSPECIFICATION: A8 SBU1 B5 CC22-1.CONTACTS:Ni50u"MIN.UNDERPLATED OVER ALL 4.55 A9 VBUS B4 VBUS8.15 -5.05 A12 GND B1 GNDAuPLATEDONTHEFUNCTIONALAREAOFCONTACT.(GOLDPLATINGTHICKNESSFOLLOWTHEP/N) 4. ELECTRICAL PERFORMANCE,GOLDFLASHPLATINGONSOLDERAREA 4-1.CURRENTRATING:5AVOLTAGERATING:20V2-2.FRONT SHELL: Ni 30u"MIN. UNDER PLATED OVER ALL 4-2.INSULATIONRESISTANCE:100MΩMIN3.MECHANICALPERFORMANCE, 4-3.DIELECTRICWITHSTANDVOLTAGE,AC100VFOR1MINUTE.3-1.INSERTIONFORCE:0.5\~2.0kgf. 4-4.LOWCONTACT RESISTANCE: INITIAL 40MΩ3-2.REMOVALFORCE:0.8kgf\~2.0kgf. 5.ENVIRONMENTALPERFORMANCE:AFTER50MΩOPERATINGTEMPERATURE:-30°C\~+80°C.3-3.DURABILITY:10000 CYCLES. 6. IRREFLOW:THEPEAK TEMPERATURE ONTHEBOARD SHALLBEMAINTAINEDFOR 10 SECONDSAT260

USBTYPEC-卧贴L7.35带弹4脚插板带柱

NOTES

USBTYPEC-卧贴L6.80 4脚插板CH2.17

0.20±0.05(16X)0(8X).60(48.94.60[4X8.34-0.0 0.90（4X] 8.64 PRODUCT EDGE6.69 RECOMMENDED PCB LAYOUT(TOP VIEW)A1A12 THICKNESS 0.6OMM;DEFAULT TOLERANCE:±0.05OF 2.56NOTESB2 B1.MATERIALSPECIFICATION: .640.80 0.801.HOUSING: HIGHTEMPERATURERESISTANT PLASTIC,UL94V-0(LCP). 3.15 3.202.CONTACTS:COPPERALLOY(C18150) D PINSIGNALNAME NSIGNALNAMEA1 GND B12 GND3.MID PLATE:STAINLESS STEEL(SUS301) A4 VBUS B9 VBUS4.FRONTSHELL:STAINLESSSTEEL(SUS304) A5 DC1 B8 DN22.PLATING SPECIFICATION: A7 DN1 B6 DP2A8 SBU1 B5 CC22-1.CONTACTS:Ni50u"MIN.UNDERPLATEDOVERALL A9 VBUS B4 VBUSAu3u"ONTHEFUNCTIONALAREA OFCONTACT A12 GND B1 GNDPLATINGSPECIFICATIONSOFTHESOLDERAREA 4-1.CURRENTRATING:5.0AVOLTAGERATING:5.0V2-2.FRONT SHELL: Ni30u"MIN. UNDER PLATED OVER ALL 4-2.LLCR:VBUS&GNDPINSAND OTHER PINS:40mQ/PINMAX2-3.MIDPLATE:CLEARONLY SHIELD:50mΩ/MAX.LLCRMAX.CHANGEOFALLPINS:10mΩ.3.MECHANICALPERFORMANCE: 4-3.INSULATIONRESISTANCE:100MΩMIN3-1.INSERTIONFORCE:0.5\~2.0kgf. 4-4.DIELECTRICWITHSTANDVOLTAGE，AC100VFOR1MINUTE3-2.REMOVALFORCE:0.8kgf\~2.0kgf. 5.ENVIRONMENTALPERFORMANCE:OPERATINGTEMPERATURE:-25°C\~+85°C.3-3.DURABILITY:10000CYCLES. 6.RREFLOW:THEPEAKTEMPERATUREONTHEBOARDSHALL4.ELECTRICALPERFORMANCE: BEMAINTAINEDFOR10SECONDSAT260°C.

USBTYPEC-三排立插H8.8-24.54脚插板带底座

NOTES

NOTES

JX24-BPS014-A

USBTYPEC-板上双贴L7.904脚插板