Maiman Laser Series Catalog
CONTENTS
01.Company Profile
02.Maiman Laser Development History
04.Enterprise Qualification
06.Products&Applications
23.Marketing& Service
24.Customers & Cases
Maiman Laser Company Profile
Company Introduction
MaimanLaserwasestablishedin2010.Aleading industrialsolid-statelasermanufacturerandanationalhigh-techenterprise.
Core Business
Solid-state lasers (Infraredto UV,ns-fs) Eco-friendlymarking (Food traceability/Anti-counterfeiting) Customized solutions (Optical design- Process optimization)
Core Advantages
High precision Stability Integrated services
European Business
MaimanLasertechnikGmbHisanindependentcompanyregisteredinGermanynotabranchofTianjinMaimanLaserechology
Co., Ltd. Importand Sales
Official importer in Europe,ensuring product compliance and distribution. Service Support
Local service center in Germany,providing technical support,repairs,and after-sales.
Research and Development Strength
Ourfactoryis located inTianjin,China.We havea highlyprofessional technical team.
AcademicianYaoJianquan-ChiefTechnologyAdvisor.
Keymembers:PhDs fromTianjin University,with ^ { 2 0 + } years'experiencein lasers.
Universityand Research Partnerships
TsinghuaUeitigesityjsitygteofticeesitol hun Universityof Technology,Tianjin Universityof Technology.
Maiman Laser Development History
2014
·Maiman's first 20W1064nmactively Q-switched end-pumped laseris launched on the market.
2010
MaimanLaserwasestablished.
2017
·Wonthe honorary titleof Tianjin Key New Product. ·The cumulative number of lasers delivered exceeded 10,000 units.
2013
·It pioneered the commercial technology solution based on passive Q-switched laser technology in the world and launched the (204号 1 0 6 4 \mathsf { n m } fiber-type end-pumped laser for the first time in China. ·More than160 lasershave beensold.
2015
·Maiman entered the diamond processing industry and launched 1064nm diamond planning lasers. ·Launchedaseriesof productsincluding high-power532nm activelyQ-switched greenlasersand fiber-type greenlasers. ·Carried out research and development of ultraviolet lasers, creating a new technology routeand product route. ·The cumulative number of lasers delivered exceeded 5,000 units.
2019
·After fouranda half years of research and development,we launcheda completely independent UV laser.The new technical route solved the problems of laser power attenuation and low power. ·Became the designated laser supplier of Sanquan Food. · UV lasers were included in the procurement list of companiessuchasMasterKongandMengniu.
2021
2025
·Completed SeriesAfinancing.
●Cumulativedeliveryof32,0o0 lasers.
·MaimanLasertechnikGmbHis founded in Karlsruhe,Germany.
2020
2024
Launched27WUVlaser,thehighestpowerlevel in China. ·Won the title of Tianjin Gazelle Enterprise.
·Green laserpower > 60Wunderdevelopment. ·High-energy UV laser under development,single pulseenergy > 3mJ@10kHz.
Superb Technology & Optimum Quality
Qualificationcertification
Products & Applications
Maimanprovidesmultipleseriesof laserproductsforthefieldsofindustrymedicaltreatment,scientificresearchetc, andalsoprovidescustomizedservices.Thewavelengthscoverfrominfraredtodeepultraviolet,thepulsewidthcoversfrom nanoseconds to ultrafast,and the power covers from milliwatts to hundredsof watts.
·Psultrafastlaser (IR/Green/UV,10-70W) Hundred ps high powerlaser (IR/Green/UV,10-40W) ·Minihighenergylaser(IR/Green/UV,0.5-5J)
| Application field | Elite series lasers | Diamond series lasers | Stone series lasers |
| FPC & PCB cutting | MMEPU-355-18/20/25/30 | MMEPG-532-15/20 | |
| Solarcell scribing | MMEPU-355-20/25 | MMEPG-532-10/15/20 | |
| Wafer annealing | MMEPG-532-30 | ||
| Wafer scribing | MMEPU-355-15-HE MMEPU-355-18/20 | MMEPG-532-15/20 | |
| Highreflectivemetalmarking | MMEPF-1064-8L | ||
| Ultrahardmaterial processing | MMEPU-355-10/16/20-HE-D30 MMEPG-532-16/20-HE-D70 | ||
| Diamond processing | MMEPU-D-355-1 MMD-YAG-1064-2 MMEPU-355-10-HE-D30 MMEPG-532-16/20-HE-D30 MMEPA-1064-18/25-HE-D30 MMEPA-1064-18/25-HE-D70 | ||
| Translucent product markings | MMEPU-D-355-1 | MMEPU-355(Plus)-5/8/10 MMEPU-AC-355(PIus)-5/8 MMEPU-AC-355-3/5-M MMEPU-355-3/5/8-SM | |
| Day&night marking | MMEPA-1064-12/20/25/30/50 | ||
| Packagingmaterial marking | MMEPU-355(Plus)-3/5/8 MMEPU-AC-355(Plus)-3/5/8 MMEPU-AC-355-3/5-M MMEPU-355-3/5/8-SM MMEPG-532-5L | ||
| Glass interior marking | MMEPU-355(Plus)-5 MMEPU-AC-355(Plus)-5 MMEPU-AC-355-5-M MMEPU-355-5-SM | ||
| Glass marking | MMEPU-355-10-ZRS2 | ||
| Jade processing | MMEPU-355(Plus)-12/15 |
Elite series high energy UV laser
Introduction
ThehighnergyUVlaserfeaturesawavelengthofnm,asinglepulseenergyof1.5mJandastrongpeakpower.Itsunquensliesin itshighiciidadslintdaliid less than 2 \mu { m }
Features
·Laser power15W.
·Single pulseenergyisashighas1.5mJ,stableinuse.
· Excellent beam quality N ^ { 2 } < 1 . 3 ,simple process and higher efficiency.
·UV-clean patented technology is used to solve powerattenuationand worry-free in use.
●3-layer protection,protection level IP65,more adaptable to harsh working environment.
| Model No. | MMEPU-355-15-HE |
| Optical Characteristics | |
| Wavelength (nm) | 355nm |
| Average Power (W) | >15W@10kHz |
| Single Pulse Energy (uJ) | ~1500uJ@60kHz |
| Pulse Width (ns) | ~30ns@60kHz |
| Frequency Range | 10-20kHz |
| Pulse Stability | |
| Long Term Stability | |
| Beam Characteristics | |
| Polarization Ratio | Horizontal; >100:1 |
| Beam Diameter | ~1mm (at exit) |
| Beam Circularity | >90% |
| Spatial Mode | TEM00,M² |
| Operating Specifications | |
| Warm-up Time | |
| Electrical Requirement | DC17.5V,350W |
| Ambient Temperature | 10-35C,RH |
| Storage Conditions | -10-40°℃,RH |
| Physical Characteristics | |
| Cooling System | Water-cooled |
| Water Temperature (laser inlet) | 25℃ |
Application
• SiC,diamond wafer grinding,scribing,drilling.
● Ceramic scribing,drilling.
Introduction
ThehighpowerUVlasereffectivelysolestheproblemofpoweattenuationandasexcellentbeamqualityndpulsestabilityakingit worry-free to use.
Features
·Laserpower18-30W.
●Durable,easy to install and integrate.
·Excellent beam quality N ^ { 2 } < 1 . 3 ,simple processand higher efficiency.
·Lifespan exceeds 20,ooo hours,maintenance-free,no need for regular debugging.
●Use UV-clean technology to solve the problem of power attenuation,worry-free use.
| Model No. | MMEPU-355-18 | MMEPU-355-20 | MMEPU-355-25 | MMEPU-355-30 |
| Optical Characteristics | ||||
| Wavelength (nm) | 355nm±1nm | |||
| Average Power (W) | >18W@50kHz | >20W@50kHz | >25W@50kHz | >30W@50kHz |
| Single Pulse Energy (uJ) | ~350uJ@50kHz | ~400uJ@50kHz | ~500uJ@50kHz | ~600uJ@50kHz |
| Pulse Width (ns) | 12ns@50kHz | |||
| Frequency Range | 50-500kHz | |||
| Pulse Stability | ||||
| Long Term Stability | ||||
| BeamCharacteristics | ||||
| Polarization Ratio | Horizontal; >100:1 | |||
| Beam Diameter | ~1mm (at exit)/~6mm (10X beam expander) | |||
| Beam Circularity | >90% | |||
| Spatial Mode | TEM00,M² | |||
| Operating Specifications | ||||
| Warm-up Time | ||||
| Electrical Requirement | DC24V,600W | |||
| Ambient Temperature | 10-35C,RH | |||
| Storage Conditions | -10-40°C,RH | |||
| Physical Characteristics | ||||
| Cooling System | Water-cooled | |||
| Water Temperature (laser inlet) | 25℃ | |||
Application
Elite series high power green laser
Introduction
Ithasexcelntowertabilitsuringlonteerationdigsingleueeergyhaproduceeeeity short time,soas to beter cope with materials with higher hardness such as silicon carbide.
Features
·Laser power 30W.
·Durable,easyto install and integrate.
·Excellent beam quality M ^ { 2 } < 1 . 3 ,simple processand higher efficiency.
·Lifespan exceeds 20,ooo hours,maintenance-free,no need for regular debugging.
·Use UV-clean technology to solve the problem of power attenuation,worry-free use.
| Model No. | MMEPG-532-30 |
| Optical Characteristics | |
| Wavelength (nm) | 532nm |
| Average Power (W) | >30W@60kHz |
| Single Pulse Energy (uJ) | ~500uJ@60kHz |
| Pulse Width (ns) | 20ns@60kHz |
| Frequency Range | 50-500kHz |
| Pulse Stability | |
| Long Term Stability | |
| Beam Characteristics | |
| Polarization Ratio | Vertical; >100:1 |
| Beam Diameter | 6mm (Build in beam expander) |
| Beam Circularity | >90% |
| Spatial Mode | TEM0D,M2 |
| Operating Specifications | |
| Warm-up Time | |
| Electrical Requirement | DC24V,600W |
| Ambient Temperature | 10-35C,RH |
| Storage Conditions Physical Characteristics | -10-40C,RH |
| Cooling System | |
| Water-cooled | |
| Water Temperature (laser inlet) | 25℃ |
Application
·Wafer annealing ·Wafer drilling and scribing
Diamond series high energy 30ns laser
Introduction
Lowprocessingaatcothliytldtin qualityaeedterossgredtainrdealsod diamond;resonant cavityself-cleaning systemto solvethepowerattenuation problemand maintaina long life.
Features
·Laser power 10-25W. ·Single pulse energy > 2 m J ·Long life,maintenance-free. ●Excellent beam quality N ^ { 2 } < 1 . 3 ·All-n-one laser,highly integrated.
| Model No. | MMEPU-355-10-HE-D30 | MMEPG-532-16-HE-D30 | MMEPG-532-20-HE-D30 | MMEPA-1064-18-HE-D30 | MMEPA-1064-25-HE-D30 | |
| Optical Characteristics | ||||||
| Wavelength (nm) | 355nm | 532nm | 1064nm | |||
| Average Power (W) | >10W@10kHz | >16W@10kHz | >20W@10kHz | >18W@10kHz | >25W@10kHz | |
| Single Pulse Energy (uJ) | ~1000uJ@10kHz | ~1600uJ@10kHz | ~2000uJ@10kHz | ~1800uJ@10kHz | ~2500uJ@10kHz | |
| Pulse Width (ns) | ~30ns@10kHz | |||||
| Frequency Range | 10-100kHz | |||||
| Pulse Stability | ||||||
| Long Term Stablity | ||||||
| Beam Characteristics | ||||||
| Polarization Ratio | Horizontal; >100:1 | |||||
| Beam Diameter | Vertical; >100:1 ~0.9mm (at exit) | |||||
| Beam Circularity | >90% | |||||
| Spatial Mode | TEM00,M² | |||||
| Operating Specifications | ||||||
| Warm-up Time | ||||||
| Electrical Requirement | DC17.5V,350W | |||||
| Ambient Temperature | 10-35℃C,RH | |||||
| Storage Conditions Physical Characteristics | -10-40°C,RH | |||||
| Cooling System | ||||||
| Water Temperature (laser inlet) | Water-cooled | |||||
| 25℃ | ||||||
Application
· SiC wafer scribing.
•Superhard material cutting-PcBN,PCD,SCD and CVD,SiC,etc.
·Diamond Cuting-Slicing,Coring,Faceting,Sawing and 4P
Diamond series high energy 70ns laser
Introduction
Highpeakoslonllrdds andmaintenaneithitegaedtrolndprotectioicuitintealsoatorisppditf-aingsystemdable design to solve the powerattenuation problemand ensure long-term use of the laser.
Features
·Laserpower 16-25W. ·Single pulse energy > 2 m J ·Long lifeandmaintenance-free. ·Excellent beam quality M ^ { 2 } < 1 . 5 ·All-n-one laser,highly integrated.
| Model No. | MMEPG-532-16-HE-D70 | MMEPG-532-20-HE-D70 | MMEPA-1064-18-HE-D70 | MMEPA-1064-25-HE-D70 |
| Optical Characteristics | ||||
| Wavelength (nm) | 532nm | 1064nm | ||
| Average Power (W) | >16W@10kHz | >20W@10kHz | >18W@10kHz | >25W@10kHz |
| Single Pulse Energy (uJ) | ~1600uJ@10kHz | ~200uJ@10kHz | ~1800uJ@10kHz | ~2500uJ@10kHz |
| Pulse Width (ns) | ||||
| Frequency Range | 7-100kHz | |||
| Pulse Stability | ||||
| Long Term Stability | ||||
| BeamCharacteristics | ||||
| Polarization Ratio | Vertical; >100:1 | |||
| Beam Diameter | ~0.9mm (at exit) | |||
| Beam Circularity | >90% | |||
| Spatial Mode | TEM00,M² | |||
| Operating Specifications | ||||
| Warm-up Time | ||||
| Electrical Requirement | DC24V,500W | |||
| AmbientTemperature | 10-35C,RH | |||
| Storage Conditions | -10-40°C,RH | |||
| Physical Characteristics | ||||
| Cooling System | Water-cooled | |||
| Water Temperature (laser inlet) | 25℃ | |||
Application
• SiC wafer scribing.
•Superhard material cutting-PcBN,PCD,SCDand CVD,SiC,etc.
●Diamond Cuting-Slicing,Coring,Faceting,Sawing and 4P.
Introduction
Itismallinszeandcanbeheldnonehand;thepulsewidthis-nsandtheultraighpeakpowerperfectlyrealizestheapparance marking of electronic products.
Features
·Laser power 1W.
●Fancooling,easy to integrate.
·Splitmachine, laser head compatiblewith fiber laseroptical path.
●Solve power attenuation and meet 7 ^ { \star } 2 4 hours working conditions.
·Lifespan exceeds 20,ooo hours,maintenance-free,no need for regular debugging.
| Model No. | MMEPU-D-355-1 |
| Optical Characteristics | |
| Wavelength (nm) | 355nm±1nm |
| Average Power (W) | >1W@20kHz |
| Single Pulse Energy (uJ) | ~50uJ@20kHz |
| Pulse Width (ns) | ~7ns@20kHz |
| Frequency Range | |
| Pulse Stability | Uncontrollable,range15-20kHz |
| Long Term Stability | |
| Beam Characteristics | |
| Polarization Ratio | |
| Beam Diameter | Vertical; >100:1 |
| Beam Circularity | 7mm >90% |
| Spatial Mode | TEM,,M² |
| Operating Specifications | |
| Warm-up Time | |
| Electrical Requirement | DC12V,>200W |
| Ambient Temperature | 10-35°C,RH |
| Storage Conditions | -10-40°C,RH |
| Physical Characteristics | |
| Cooling System | Air-cooled |
Application
·Diamond waist code marking ●Material marking-fim packaging,stones,electronic devices,3C products,medical equipment,etc.
Introduction
Superior beamqualityand peak power ensure clearand shallow marks on diamonds,minimizing damage to diamonds.
Features
·Laser power2W.
·Lifespan exceeds 20,000 hours.
·Excellent beam quality,minimum spot size < 2 0 upmu { m } ·High-precision temperature control to ensure long-term stableoperation of the laser.
●2lightoutput modes,paralellightoutputand direct focusing,to meet the needsofdifferent planning machines.
| Model No. | MMD-YAG-1064-2 |
| Optical Characteristics | |
| Wavelength (nm) | 1064nm±1nm |
| Average Power (W) | >2W@25kHz |
| Single Pulse Energy (uJ) | ~80uJ@25kHz |
| Pulse Width (ns) | |
| Frequency Range | ~6ns@25kHz |
| Pulse Stability | ~25kHz |
| Long Term Stability | |
| Beam Characteristics | |
| Polarization Ratio | Random |
| Beam Diameter | ~0.8mm |
| Beam Circularity | >90% |
| Spatial Mode | TEM00,M2 |
| Operating Specifications | |
| Warm-up Time | |
| Electrical Requirement | DC12V,>200W |
| Ambient Temperature | 10-35C,RH |
| Storage Conditions | -10-40℃C,RH |
| Physical Characteristics | |
| Cooling System | Air-cooled |
Application
·Gem planning · Diamond marking
Introduction
Integratedcompactlasersource,excellentbeamquality M 2 < 1 . 3 canprocessmorethan 9 0 % ofindustrialmaterialswithextremelyhigh precision.Narrower pulsewidth,only\~13ns@30kHz.
Features
·Laser power 3-8W.
·Narrower pulsewidth\~13ns@30kHz.
●Solve the power attenuation problem and meet 7 ^ { \ast } 2 4 hours of work.
●Service life exceeds 20,ooo hours,maintenance-free,no need for regular debugging.
·3-layer protection,protection level IP65,more adaptable to harsh working environment.
| Model No. | MMEPU-355-3-M | MMEPU-355-5-M | MMEPU-355-8-M |
| Optical Characteristics | |||
| Wavelength (nm) | 355nm±1nm | ||
| Average Power (W) | >3W@30kHz | >5W@30kHz | >8W@40kHz |
| Single Pulse Energy (uJ) | ~100uJ@30kHz | ~160uJ@30kHz | ~200uJ@40kHz |
| Pulse Width (ns) | ~13ns@30kHz | ||
| Repitition Rate | 20-500kHz | ||
| Pulse Stability | |||
| Long Term Stability | |||
| Beam Characteristics | |||
| Polarization Ratio | Horizontal; >100:1 | ||
| Beam Diameter | ~0.8mm(at exit)/~5mm(10X beam expander) | ||
| Beam Circularity | >90% | ||
| Spatial Mode | TEM00,M² | ||
| Operating Specifications | |||
| Warm-up Time | |||
| Electrical Requirement | DC12V,350W | ||
| Ambient Temperature | 10-35C,RH | ||
| Storage Conditions | -10-40°C,RH | ||
| Physical Characteristics | |||
| Cooling System | Water-cooled | ||
| Water Temperature (laser inlet) | 25℃ | ||
Application
● Film cutting ·Material marking-plastic,glass,metal molds,wood,packaging bags,jade,etc.
● Crystal engraving •3D printing
面 新
Introduction
ItperfectlyineritstexcelentpeformanceofimanwaterooledUVaseerooledolingmetoddostrequireaooler It ismoreadaptable to complexand harshworking environments.
Features
·Laser power 3-8W.
·Solve the powerattenuationproblemandmeet 7 ^ { \ast } 2 4 hours of work.
·Lifespan exceeds 20,ooo hours,maintenance-free,no need for regular debugging.
●Fujing crystals are used throughout the line,anda tenfold penaltyis imposed for fake products.
•All-in-one laser,direct installation of galvanometer,compatible with fiber laser marking rack.
| Model No.Stone Series | MMEPU-AC-355-3-M | MMEPU-AC-355-3 | MMEPU-AC-355-5-M | MMEPU-AC-355-5 | MMEPU-AC-355-8 |
| Model No.StonePlusSeries | MMEPU-AC-355Plus-3 | MMEPU-AC-355Plus-5 | MMEPU-AC-355Plus-8 | ||
| Optical Characteristics | |||||
| Wavelength (nm) | 355nm±1nm | ||||
| Average Power (W) | >3W@30kHz | >5W@30kHz | >8W@40kHz | ||
| Single Pulse Energy (uJ) | ~100uJ@30kHz | ~160uJ@30kHz | |||
| Pulse Width (ns) | ~15ns@30kHz | ~15ns@40kHz | |||
| Frequency Range | 20-500kHz | 40-500kHz | |||
| Pulse Stability | |||||
| Long Term Stability | |||||
| Beam Characteristics | |||||
| Polarization Ratio | Horizontal; >100:1 | ||||
| Beam Diameter | ~0.8mm(at exit)/~5mm(10X beam expander) | ||||
| Beam Circularity | >90% | ||||
| Spatial Mode | TEMo0,M² | ||||
| Operating Specifications | |||||
| Warm-up Time Electrical Requirement | |||||
| Ambient Temperature | DC12V,350W 10-35°C.RH | ||||
| Storage Conditions | |||||
| Physical Characteristics | -10-40℃C,RH | ||||
| Cooling System | |||||
| Air-cooled | |||||
Application
• Film cutting •Material marking-plastic,glass,metal molds,wood,packaging bags,jade,etc.
·3D printing
Stoneserieswater-cooledUVlaser
Introduction
The Stone series has a very high cost-effectivenessand can meet 7 ^ { \ast } 2 4 hours production needs; the Stone Plus series has stronger performanceand canbetteradapt tocomplexand harsh environments.
Features
·Solvepowerattenuationandmeet 7 ^ { \star } 2 4 hoursworking conditions.
●Lifespan exceeds 20,ooo hours,maintenance-free,no need for regular debugging.
·3-layer protection,IP65waterproof,moreadaptable to harshworking environment.
•All-in-one laser,direct installation of galvanometer,compatible with fiber laser marking rack.
| Model No.Stone Series | MMEPU-355-3 | MMEPU-355-5 | MMEPU-355-8 | MMEPU-355-10 | MMEPU-355-15 | |
| Model No.Stone Plus Series | MMEPU-355Plus-3 | MMEPU-355Plus-5 | MMEPU-355Plus-8 | MMEPU-355Plus-10 | MMEPU-355Plus-15 | |
| Optical Characteristics | ||||||
| Wavelength (nm) | 355nm±1nm | |||||
| Average Power (W) | >3W@30kHz | >5W@30kHz | >8W@40kHz | >10W@40kHz | >15W@40kHz | |
| Single Pulse Energy (uJ) | ~100uJ@30kHz | ~160uJ@30kHz | ~200uJ@40kHz | ~250uJ@40kHz | ~375uJ@40kHz | |
| Pulse Width (ns) | ~15ns@30kHz | ~15ns@40kHz | ||||
| Frequency Range | 20-500kHz | 40-500kHz | ||||
| Pulse Stability | ||||||
| Long Term Stability | ||||||
| Beam Characteristics | ||||||
| Polarization Ratio | Horizontal; >100:1 | |||||
| Beam Diameter | ~6mm(10X beam expander) | |||||
| Beam Circularity | >90% | |||||
| Spatial Mode | TEM0,M² | |||||
| Operating Specifications | ||||||
| Warm-up Time | ||||||
| Electrical Requirement | DC12V,350W | |||||
| AmbientTemperature | 10-35C,RH | |||||
| Storage Conditions Physical Characteristics | -10-40°C,RH | |||||
| Cooling System | ||||||
| Water Temperature (laser inlet) | Water-cooled | |||||
| 25℃ | ||||||
Application
· Jewelry marking and etching ● Crystal engraving · Film cutting •Material marking-plastic,glass,metal molds,wood,packaging bags,jade,etc. ●3D printing
Stone series glass marking UV laser
Introduction
Designedspecifcalyforsaringianeeteproceingqremetsfriosassaterials.Isxcelltaqai M 2 < 1 . 3 peakpower is 3 0 % higher than ordinary 10W,processing time is 30 % faster than ordinary 10W,and the processing effect is more delicate.
Features
·Laser power10W.
·Solve power attenuationand meet 7 ^ { \ast } 2 4 hours working conditions.
·Lifespan exceeds 20,ooo hours,maintenance-free,no need for regular debugging ●3-layer protection,IP65waterproof,moreadaptable to harshworking environment.
·Allin-one laser,direct instalationof galvanometer,compatiblewith fiber lasermarking rack.
| Model No. | MMEPU-355-10-ZRS2 |
| Optical Characteristics | |
| Wavelength (nm) | 355nm |
| Average Power (W) | >10W@40kHz |
| Single Pulse Energy (uJ) | ~250uJ@40kHz |
| Pulse Width (ns) | ~10ns@40kHz |
| Repitition Rate | 40-500kHz |
| Pulse Stability | |
| Long Term Stability | |
| Beam Characteristics | |
| Polarization Ratio | Horizontal; >100:1 |
| Beam Diameter | ~0.8mm(at exit)/~5mm(10X beam expander) |
| Beam Circularity | >90% |
| Spatial Mode | TEM,M² |
| Operating Specifications | |
| Warm-up Time | |
| Electrical Requirement | DC15V,350W |
| Ambient Temperature | 10-35°℃,RH |
| Storage Conditions | -10-40℃C,RH |
| Physical Characteristics | |
| Cooling System | Water-cooled |
| Water Temperature (laser inlet) | 25℃ |
Application
●Glassmarking-quartz,borosilicate,K9,etc.
Thenewlyudlreeoditaitibis andcaneasily handle tasks such as marking of light-transmiting productsand etching of ITO thin films
Features
·Laser power12-50W.
·Solve the powerattenuationproblemandmeet 7 ^ { \star } 2 4 hours of work.
●Service life exceeds 20,ooo hours,maintenance-free,no need for regular debugging.
●3-layer protection,protection level IP65,more adaptable to harsh working environment.
·Pulse width,powerand frequencyare adjustable to meet diferent process requirements.
| Model No. | MMEPA-1064-12 | MMEPA-1064-20 | MMEPA-1064-25 | MMEPA-1064-30 | MMEPA-1064-50 |
| Optical Characteristics | |||||
| Wavelength (nm) | 1064nm | ||||
| Average Power (W) | >12W@CW | >20W@CW | >25W@CW | >30W@CW | >50W@CW |
| Single Pulse Energy (uJ) | ~270uJ@40kHz | ~450uJ@40kHz | ~550uJ@40kHz | ~600uJ@40kHz | ~1000uJ@50kHz |
| Pulse Width (ns) | ~16ns@40kHz | ||||
| Repitition Rate | ~15ns@50kHz 20-500kHz | ||||
| Pulse Stability | |||||
| Long Term Stability | |||||
| Beam Characteristics | |||||
| Polarization Ratio | Horizontal; >100:1 | ||||
| Beam Diameter | 6mm(Built-in beam expander) | ||||
| Beam Circularity | ~8mm(Built-in beam expander) | ||||
| Spatial Mode | >90% | ||||
| Operating Specifications | TEM0,M² | ||||
| Warm-up Time | |||||
| Electrical Requirement | DC12V,350W DC15V,350W | ||||
| Ambient Temperature | 10-35C,RH | ||||
| Storage Conditions | -10-40°℃C,RH | ||||
| Physical Characteristics | |||||
| Cooling System | Water-cooled | ||||
| Water Temperature (laser inlet) | 25℃ | ||||
Application
● Day and night marking.
● ITO thin film etching.
Stone series high power green laser
Introduction
Superiorbeamqualityandhigh laserpowercaneasily handlePCB/FPCcutting and marking withmore stableperformance.
Features
·Laserpower10-20W.
●High power stability ensures long-term processing consistency.
·Superior beam quality,can provide smaller focus spot and faster processing efficiency.
·Integrated structure,no need for regular debugging,maintenance-free and easier to integrate.
●Watercooling,3-layerprotective shell,protection level IP65,competent for harsh working environment.
| Model No. | MMEPG-532-10 | MMEPG-532-15 | MMEPG-532-20 |
| Optical Characteristics | |||
| Wavelength (nm) | 532nm | ||
| Average Power (W) | >10W@40kHz | >15W@40kHz | >20W@40kHz |
| Single Pulse Energy (uJ) | ~250uJ@40kHz | ~370uJ@40kHz | ~500uJ@40kHz |
| Pulse Width (ns) | ~15ns@40kHz | ||
| Repitition Rate | 20-500kHz | ||
| Pulse Stability | |||
| Long Term Stability | |||
| Beam Characteristics | |||
| Polarization Ratio | Vertical; >100:1 | ||
| Beam Diameter | 6mm(Built-in beam expander) | ||
| Beam Circularity | >90% | ||
| Spatial Mode | TEM00,M2 | ||
| Operating Specifications | |||
| Warm-up Time | |||
| Electrical Requirement | DC12V,350W | ||
| Ambient Temperature | 10-35°℃,RH | ||
| Storage Conditions | -10-40°℃,RH | ||
| Physical Characteristics Cooling System | |||
| Water-cooled | |||
| Water Temperature (laser inlet) | 25℃ | ||
Application
• Precision cutting.
● Solarcell scribing.
·PCB&FPC marking.
Introduction
Therepetitionfecystlsethslwataindtstroesingattk and the processing capacity is better.
Features
·Laser power5W.
·Lifespan exceeds 20,000 hours.
●Air-cooled structure,compact laser head,compatible with fiber laseroptical path.
●Narrow pulse width,low processing heat effect,less likely to cause plastic surface burning.
●High peak power,strong processing capability,competentfor processing a variety of materials.
| Model No. | MMEPGF-532-5L |
| Optical Characteristics | |
| Wavelength (nm) | 532nm±1nm |
| Average Power (W) | >5±0.5W@20kHz |
| Single Pulse Energy (uJ) | 200-250uJ@20kHz |
| Pulse Width (ns) | ~7ns@20kHz |
| Frequency Range | |
| Pulse Stability | Uncontrollable,range20-30kHz |
| Long Term Stability | |
| Beam Characteristics | |
| Polarization Ratio | Linear; >100:1 |
| Beam Diameter | 6mm |
| Beam Circularity | >90% |
| Spatial Mode | TEM00,M2 |
| Operating Specifications | |
| Warm-up Time | |
| Electrical Requirement | DC12V,>200W |
| Ambient Temperature | 10-35C,RH |
| Storage Conditions | -10-40°C,RH |
| Physical Characteristics | |
| CoolingSystem | Air-cooled |
Application
●Filmpackagingmark.
·Gold-plated surface blackening treatment. ·Metal marking.
●3C product surface marking.
Introduction
Thefrequencyis2O-3OkHzandthepulsewidthisalwaysmaintainedat6-8ns.Withlowerprocesingheatandhigherpeakpower aluminum oxide blackening can be easily achieved,and the processing capacity is more powerful.
Features
·Laserpower5-10W.
●Ultra-highstability,lifespanover20,o0hours.
·Peakpower > 30kW,10times thatoffiber lasers,withmore powerful processingcapabilities.
●Anti-reflection function,easilyhandles highlyreflective materialssuchasgold,silver,andcopper.
·Pulse width 6-8ns,processing heatis1/10of thatoffiberlasers,and willnot cause plastic to burn.
| Model No. | MMEPF-1064-5 | MMEPF-1064-8L | MMEPF-1064-8 | MMEPF-1064-10 | |
| Optical Characteristics | |||||
| Wavelength (nm) | 1064nm±1nm | ||||
| Average Power (W) | >5W@20kHz | >8±1W@20kHz | >8W@20kHz | >10W@20kHz | |
| Single Pulse Energy (uJ) | ~150uJ@20kHz | ~400uJ@20kHz | ~400uJ@20kHz | ~500uJ@20kHz | |
| Pulse Width (ns) | ~7ns@20kHz | ||||
| Frequency Range | Uncontrollable,range 20-30kHz | ||||
| Pulse Stability | |||||
| Long Term Stability | |||||
| Beam Characteristics | |||||
| Polarization Ratio | Random | ||||
| Beam Diameter | 7mm | ||||
| Beam Circularity | >90% | ||||
| Spatial Mode | TEM00,M2 | ||||
| Operating Specifications | |||||
| Warm-up Time | |||||
| Electrical Requirement | DC12V,>200W | ||||
| Ambient Temperature | 10-35C,RH | ||||
| Storage Conditions Physical Characteristics | -10-40C,RH | ||||
| Cooling System | |||||
| Air-cooled | |||||
Application
●Material marking-automotive parts,high reflective materials,plasticcasings,etc.
Marketing&Service
Layoutdomesticand international markets
Basedntheobalarketdderingtoteervieoneptof"professioal,timelyiientndguality,iae hasestablishedanumberofprofessionalandeficientserviceteamsindomesticandoverseasmarkets,likeTianjin(ChinaHeadquarter)))))ba)ratia)it as to provide customers with better processtesting,sales service,after-sales supportand otherrelatedservices.
Headquarters:ZhuhaiMaimanLaserTechnologyCo.,Ltd. Productionbase:Tianjin MaimanLaserTechnology Co.,Ltd. ApplicationcentersinChina:Suzhou,Shenzhen
MaimanLasertechnikGmbH:Karlsruhe,Germany
365 day
24hours
Overseasservicecenters:ndia,Turkiye Overseassalescenters:ndia,Turkiye,Poland
365day 24-hour full-time guaranteeservice
2000 Global customers
MaimanLasertechnikGmbH
Address:Am Sandfeld 18,76149 Karlsruhe,Germany
Phone: + 4 9 15231604755
Web:www.maimanlaser.de
E-mail:info@maimanlaser.de




