ESDSLVU2.8-4

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Low Capacitance ESD Protection -ESDSLVU2.8-4

Description

The ESDSLV2.8-4 of transient voltage suppressors

are designed to protect low voltage, the features

integrated low capacitance compensation diodes that

reduce the typical capacitance to 3pF per line.

This .combined with low leakage current, means signal

integrity is preserved in high-speed applications such as

10/100 Ethernet. The SLVU2.8-4 is in an SO-8 package

and may be used to protect two high-speed line pairs.

The “flow-thru” design minimizes trace inductance and

reduces voltage overshoot associated with ESD events.

The low clamping voltage of the SLVU2.8-4 minimizes

the stress on the protected IC

Feature

 Case :JEDEC SOP-8 package

 Low clamping voltage

 Small packaging options saves board space

 Low capacitance :3 pF typical

 Protection for 4 Lines

 Compatible with IEC 61000-4-2(ESD) :Air 15KV ,

Contact 8KV

 Compatible with IEC 61000-4-4(EFT) :40A ,5/50 nS

 Compatible with IEC 61000-4-5(Surge):24A

Applications

 WAN/LAN Equipment

 10/100 Ethernet

 Personal digital assistants

 LAN devices

 Switching Systems

 Desktops, Servers, and Notebooks

 Instrumentation

 Analog Inputs

Schematic and PIN Configuration

Functional Block Diagram

10/100 Ethernet Protection Circuit

ESDSLVU2.8-4

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Absolute Maximum Ratings

Parameter Symbol Value Units

Peak Current (tp =8/20μ s) PPK 400 W

Peak Current (tp =8/20μ s) IPP 24 A

IEC61000-4-2 (Contact) VESD 8 kV

IEC61000-4-2 (Air) VESD 15 kV

Lead Soldering Temperature TL 260 (10 sec) °C

Operating Temperature TJ -50 to 125 °C

Storage Temperature Range TSTG -50 to 150 °C

Electrical Characteristics (T =25°C)

Parameter Symbol Conditions Min. Typ. Max. Units

Reverse Stand-off Voltage VRWM 2.8 V

Reverse Breakdown Voltage VBR It = 1mA 3 V

Reverse Leakage Current IR VRWM =2.8V, T=25℃ 1 μ A

Clamping Voltage VC IPP = 2A, tP = 8/20μs 5.5 V

Clamping Voltage VC IPP=5A, tP = 8/20μs 8.5 V

Junction Capacitance CJ VR=0V, f = 1MHz 3 5 pF

ESDSLVU2.8-4

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Rating & Characteristic Curves

Figure 1- Power Derating Curve

Figure 2- Clamping Voltage vs Current

Peak Pulse Current (A)

Figure 3- Typical Junction Capacitance

Figure 5- Peak Power Derating Curve

Figure 6- Insertion Loss

Figure 4- Pulse Waveform

ESDSLVU2.8-4

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PACKAGE OUTLINE DIMENSIONS SO-8

Disclaimer

Specifications are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device

performance may vary over time.

Users should verify actual device performance in their specific applications.

DIMENSIONS

SYMBOL INCHES MILLIMETERS

MIN MAX MIN MAX

A 0.053 0.069 1.35 1.75

A1 0.004 0.010 0.10 0.25

A2 0.050 0.065 1.25 1.65

B 0.012 0.020 0.31 0.51

c 0.007 0.010 0.17 0.25

D 0.189 0.197 4.80 5.00

E 0.228 0.244 5.80 6.20

E1 0.150 0.157 3.80 4.00

e 0.050BSC 1.27BSC

L 0.016 0.050 0.40 1.27