KAYTUS V3系列服务器宣传册 - 电子画册在线预览、各类电子画册在线制作-云展网平台

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For detailed product specifications and prices, please consult KAYTUS local resellers.

www.kaytus.com

World-leading

IT Infrastructure

Provider

KAYTUSTM

Servers Brochure

Four key design principles:

High performance and agility

Compute Power

Defines Productivity

Intelligence and efficiency

KAYTUS

V3 Series Servers

Brochure

KAYTUS, at the forefront of IT infrastructure innovation, proudly presents a suite of groundbreaking, open, and eco-friendly

infrastructure solutions tailored for cloud, AI, and enterprise applications. With an agile 'platform + modularization' development approach and a robust global service network, we are adept at swiftly aligning with the evolving demands of our users.

KAYTUS is dedicated to pushing the boundaries of data centre technology and applications, ensuring that our customers not

only keep pace with but lead in the race towards digitalization, intelligentization, and sustainability. We empower our users to

transform their digital landscapes with confidence and efficiency.

Experience the future of computing with our advanced server solutions that decouple computing units, providing you with the

flexibility to tailor diversified computing power to your specific needs. With leading specifications, our servers set the benchmark for flagship performance, ensuring that your operations run at peak efficiency. Embrace CXL implementation for a

high-speed interconnectivity between storage and compute, revolutionizing data center speeds and capabilities.

Unleash the power of our servers with a multi-dimensional intelligent design that revolutionizes system management and

O&M, delivering the precision and intelligence customers’ demand. Our cloud-based O&M platform, coupled with an exceptional online diagnostic accuracy reaching up to 95%, simplifies the intricacies of data center operations. Experience a new

level of efficiency and control as we transform the complexity of data center O&M into a streamlined, intuitive process.

Eco-friendliness and energy saving

Open ecosystem

KAYTUS servers’ performance meets environmental responsibility. Our critical components are crafted to be lead-free,

compliant with the stringent ROHS standards, and our packaging is fully recyclable, underscoring our dedication to a greener

tomorrow. Moreover, KAYTUS is at the forefront of data center cooling technology, offering comprehensive liquid-cooling

solutions that enhance efficiency. Equipped with full-stack liquid-cooling, our servers are designed to drive the Power Usage

Effectiveness (PUE) of data centers below 1.1, setting a new standard in energy conservation and operational excellence.

Redefining open computing, the KAYTUS V3 servers transcend the boundaries of traditional open-source offerings. We

integrate a diverse array of industry-standard open software protocols and hardware designs, creating a synergy that

enhances performance and flexibility. Committed to fostering an open computing ecosystem, KAYTUS is dedicated to

expanding the reach of open ecology through innovative product development, active involvement in standardization, and

leadership in key projects. With KAYTUS, embrace the future of open computing that not only adheres to open standards but

also pushes the envelope of what's possible.

KR2280V3

Full-scenario

adaptable dual-socket

rack server

Computing Servers

Storage Server

KR4266V3

4U general-purpose storage

rack server

04 KR1280V3

High-density

dual-socket computing

rack server

10 12

KAYTUS

V3 Series Servers

KR2280V3

KR1180V3

High-density

single-socket cost-effective

rack server

KR1180V3

KR4266V3

KR2190V3

World's first OCM-based

rack server

KR2190V3

KR1280V3

KR2180V3

High-scalability

single-socket cost-effective

rack server

KR2180V3

Multi-node Servers

K24V3

High-density multi-node server

Core Application Server

KR4480V3

4U4S core application

rack server

KAYTUS

V3 Series Servers

Brochure

K22V3

Innovative architecture-optimized

high-efficiency server

K24V3 (dual-socket)

KR4480V3

K24V3 (single-socket) K22V3

V3 V3

Full-scenario Adaptable Dual-socket Rack Server

KR2280V3

The KR2280V3, a high-end 2U2S rack server series, harnesses the power of Intel® Xeon® 6 or 5th Gen AMD EPYC™ 9005 series

processors. This series embodies an ultimate design in computing and storage performance, scalability, and supports a

range of deployment options including front I/O and liquid cooling. It integrates advanced technologies such as CXL 2.0,

delivering computing power with differentiated optimal efficiency ratios tailored for various application scenarios. Its versatility

ensures comprehensive coverage of common deployment needs.

Overview

Features

Specifications

KR2280V3

■ Efficient computing, powerful performance

Compatible with Intel Scalable

Processor (SP) and Advanced

Processor (AP) platforms, supporting

16 MCR DIMMs at 8,800MT/s.

Expandable to 24 DDR4/DDR5 DIMMs

with CXL AIC, delivering 30% greater

memory bandwidth than RDIMMs to

satisfy demanding memory

performance needs.

■ Extreme design, versatile configurations

Delivering top-tier computing, storage,

and networking performance with a

modular design for flexible configurations.

Fully upgraded to PCIe 5.0.

Supporting up to 45 2.5-inch drives or

22 3.5-inch drives, supporting 48 E3.S

SSDs, and offering optional rear

SATA/NVMe M.2 SSD modules to

meet diverse storage needs.

Offering intelligent O&M with innovative

features including early warning of

memory faults through MUPR,

seamless firmware updates with IRUT,

fault diagnosis via DMPU, and load

status LEDs, simplifying management

and O&M processes.

OpenBMC-oriented BMC systems

facilitating automated, refined, and

secure O&M management.

■ Agility, openness, security, and intelligence

KR2280-X3-A0-R0-00

KR2280-X3-A0-F0-00

KR2280-X3-C0-R0-00

KR2280-X3-A0-R0-H0

(AP Platform)

Model Maintenance Cooling

Rear I/O

Front I/O

Rear I/O

Air cooling

Cold-plated liquid cooling

Air cooling

Processor 1 or 2 Intel® Xeon® 6 processors

Memory SP Platform: 32x DDR5-5600/6400 DIMM slots, accommodating up to 16x MCR DIMMs at 8,000MT/s (GNR).

AP Platform: 24x DDR5-5600/6400 DIMM slots, supporting up to 12x MCR DIMMs at 8,800MT/s (GNR).

Expands to 24x additional DDR4/DDR5 DIMMs with the CXL AIC module

8x CXL 2.0 E3.S SSDs in SRF / 12 CXL 2.0 E3.S SSDs in GNR

Front:12x 3.5-inch SAS/SATA/NVMe drives | 24x 2.5-inch SAS/SATA/NVMe drives | 25x 2.5-inch SAS/SATA drives (with support for 4x

NVMe drives) | 24 (1/2TB)x / 48 (1TB)x E3.S SSDs | 9x 3.5-inch SAS/SATA/NVMe drives | 8/16x 2.5-inch SAS/SATA/NVMe drives in front

I/O configuration

Internal:1× TF card and 2× SATA M.2 SSDs | 2× NVMe M.2 SSDs | 6× 3.5-inch SAS/SATA drives | 10 × 2.5-inch SAS/SATA drives | 8× E3.S SSDs

Rear:4× 3.5-inch SAS/SATA drives and 4× 2.5-inch SAS/SATA/NVMe drives | 4× 3.5-inch SAS/SATA drives and 2× SATA M.2/NVMe M.2

SSDs (hot-swap) | 4× 3.5-inch SAS/SATA drives and 8× E1.S SSDs | 10× 2.5-inch SAS/SATA/NVMe drives

Storage

Rear I/O: up to 15x PCIe 5.0 slots, including 2x slots for hot-swap OCP 3.0 NICs

Front I/O: up to 21x PCIe 5.0 slots (Front: 6x PCIe expansion cards and 1 OCP 3.0 NIC; Rear: 12x PCIe expansion cards and 2x OCP 3.0 NICs)

Liquid cooling: up to 11x PCIe 5.0 slots, including 2x slots for hot-swap OCP 3.0 NICs

Supporting 4x DW / 8x SW GPUs

PCIe Expansion

Power Supply 1+1 redundant Titanium/Platinum CRPS PSUs with an output power of 800W/1,300W/1,600W/2,000W/2,700W/3,200W

Operating Temperature 5°C to 50°C (Refer to the White Paper for details)

Intel Processors

Computing Server Storage Server Multi-node Server Core Application Server

Features

Specifications

KR2280V3 Powered by

AMD Processors

■ Exceptional performance

Featuring 2 AMD EPYC™ 9005 series

processors with up to 192 cores and

384 threads, offering a maximum boost

frequency of 5.0GHz and an L3 cache

up to 384MB per CPU.

Boasting up to 24 DDR5 DIMMs,

delivering superior speed, high

availability, and a memory capacity of

up to 6TB.

■ Flexible configurations

Offering up to 20 3.5-inch SATA/SAS

drives, or 28/29 2.5-inch SATA/SAS

drives, or 28 NVMe SSDs, or 24 E3.S

SSDs.

Including two optional OCP 3.0 NICs,

providing multiple network interface

options for a more flexible network

structure in applications.

Supporting up to 8 standard PCIe 5.0

expansion cards to further enhance

I/O performance.

■ Intelligent O&M

Featuring a user-friendly design, the

system facilitating tool-less maintenance.

Quick assembly and disassembly of

enhanced and optimized structural

components enabling significant

reduction of O&M time.

Unique intelligent control technology,

in conjunction with the advanced

cooling system, ensuring an optimal

working environment for the server,

maintaining stable system performance.

KR2280-E3-A0-R0-00

Model Maintenance Cooling

Rear I/O Air cooling

KR2280-E3-C0-R0-00 Rear I/O Cold-plated liquid cooling

Processor 1 or 2 AMD EPYC™ 9005 series processors

Memory Up to 24x DDR5 DIMMs

Front: 12× 3.5-inch SATA/SAS/NVMe drives | 24× 2.5-inch SATA/SAS/NVMe/E3.S SSDs | 25× 2.5-inch SATA/SAS drives (with support

for 4x NVMe drives)

Internal: 2× SATA M.2 SSDs or 2× NVMe M.2 SSDs |4× 3.5-inch SATA/SAS drives

Storage

PCIe Expansion Up to 8x (air cooling) and 7x (liquid cooling) PCIe slots | 2x OCP 3.0 NICs | Up to 4x dual-width GPUs

Power Supply 1+1 redundant hot-swap PSUs

Operating Temperature 10°C to 35°C (Refer to the White Paper for details)

Rear: 4× 3.5-inch SAS/SATA drives | 4× 2.5-inch SAS/SATA/NVMe drives

Computing Server Storage Server Multi-node Server Core Application Server

High-density Dual-socket Computing Rack Server

KR1280V3

The KR1280V3, a 1U2S high-density computing server series, accommodates 2 Intel® Xeon® 6 or 5th Gen AMD EPYC™ 9005

series processors with the highest TDP in a 1U form factor. It boasts an exceptional design in computing performance,

storage density, and scalability, and provides the industry's widest range of multi-layer storage matrices, ideal for

compute-intensive scenarios like high-performance computing, high-frequency transactions, and virtualization. To optimize

the PUE, it incorporates varied heat dissipation methods, including EVAC and cold-plated liquid cooling, meeting the low PUE

requirements of data centers.

Overview

Features

KR1280V3

■ Ultimate flash storage, versatile

experiences

Supporting up to 12 front 2.5-inch

SAS/SATA/NVMe drives, and innovatively

offering 32 PCIe 5.0 E1.S SSDs directly

connected to the motherboard,

achieving an ultimate flash memory

density of 512TB in a 1U space. Ideal

for large language model scenarios

with rapidly expanding data volumes

and the need for higher processing

efficiency. Storing data quickly,

computing faster.

■ Innovative architecture, hassle-free

O&M

Featuring innovative front I/O,

facilitating O&M operations in the cold

aisle, reducing maintenance challenges,

extending the service life of

thermo-sensitive components like

optical modules and smart NICs, and

enhancing data transmission stability.

· Offering efficient cooling solutions like

EVAC and cold-plated liquid cooling,

delivering comprehensive liquid

cooling solutions for data centers.

With full-stack liquid cooling capabilities,

the server minimizing PUE to below

1.1.

Adhering to environmental protection

principles, the server's key components

complying with lead-free (RoHS)

standards, and all packaging materials

being recyclable.

■ Efficient carbon reduction,

eco-friendly and energy saving

Specifications

KR1280-X3-A0-R0-00

Model Maintenance Cooling

Rear I/O Air cooling

Air cooling

Processor 1 or 2 Intel® Xeon® 6 processors

Memory 32x slots for DDR5-5600/6400 DIMMs, allowing for the installation of up to 16x MCR DIMMs (8,000MT/s) (GNR)

4× CXL 2.0 E3.S SSDs

Storage

PCIe Expansion

Power Supply 1+1 redundant Titanium/Platinum CRPS PSUs with an output power of 800W/1,300W/1,600W/2,000W/2,700W/3,200W

Operating Temperature 5°C to 50°C (Refer to the White Paper for details)

KR1280-X3-A0-F0-00

KR1280-X3-C0-R0-00

Front I/O

Rear I/O Cold-plated liquid cooling

Front:8/10/12× 2.5-inch SAS/SATA/NVMe drives | 4× 3.5-inch SAS/SATA/NVMe drives + 4× E3.S SSDs | 32× E1.S SSDs | 4× 1/2TB

E3.S SSDs/4× 2.5-inch SAS/SATA/NVMe drives/12× E1.S SSDs (front I/O)

Internal:1× TF card and 2× SATA M.2 SSDs | 2× NVMe M.2 SSDs

Rear:2× 2.5-inch SAS/SATA drives

Rear I/O: Up to 7x PCIe slots. (Front: 2x PCIe cards; Rear: 3x PCIe cards and 2x hot-swap OCP 3.0 NICs)

Front I/O: Up to 7x PCIe slots. (Front: 2x PCIe cards and 1x hot-swap OCP 3.0 NICs; Rear: 2x PCIe cards and 2x hot-swap OCP 3.0 NICs)

Liquid cooling: Up to 5x PCIe slots, including 1x slot for a hot-swap OCP 3.0 NIC

Intel Processors V3

Computing Server Storage Server Multi-node Server Core Application Server

Features

KR1280V3 Powered by

AMD Processors

■ Exceptional performance

Equipped with 2 AMD EPYC™ 9005

series processors, offering up to 192

cores and 384 threads, a maximum

boost frequency of 5.0GHz, and an L3

cache capacity of up to 384MB per CPU.

Supporting up to 24 DDR5 DIMMs,

ensuring superior speed, high

availability, and a memory capacity

reaching up to 6TB .

■ Flexible configurations

Offering up to 4 3.5-inch and 4

2.5-inch SAS/SATA/NVMe drives or

12 2.5-inch SAS/SATA/NVMe drives.

Including 2 optional OCP 3.0 modules,

providing multiple network interface

options for a more flexible network

structure in applications.

Supporting up to 3 standard PCIe 5.0

expansion cards to further enhance

I/O performance.

■ Intelligent O&M

Featuring a user-friendly design, the

system facilitating tool-less maintenance.

Enabling quick assembly and

disassembly of enhanced and

optimized structural components,

significantly reducing O&M time.

Unique intelligent control technology,

combined with an advanced cooling

system, ensuring an optimal working

environment for the server, maintaining

stable system performance.

Specifications

KR1280-E3-A0-R0-00

Model Maintenance Cooling

Rear I/O Air cooling

KR1280-E3-C0-R0-00 Rear I/O Cold-plated liquid cooling

Processor 1 or 2 AMD EPYC™ 9005 series processors

Memory Up to 24x DDR5 DIMMs

Front: 4× 3.5-inch + 4× 2.5-inch SAS/SATA/NVMe drives | 4 × 3.5-inch SAS/SATA/NVMe drives + 2× E1.S SSDs + 2× M.2 SSDs

| 10/12× 2.5-inch SAS/SATA/NVMe drives

Storage

PCIe Expansion Up to 3x (air cooling) and 2x (liquid cooling) PCIe slots | 2x OCP 3.0 NICs

Power Supply 1+1 redundant hot-swap PSUs

Operating Temperature 10°C to 35°C (Refer to the White Paper for details)

Internal: 2× SATA M.2 SSDs or 2× PCIe M.2 SSDs

Computing Server Storage Server Multi-node Server Core Application Server

08 Computing Server Storage Server Multi-node Server Core Application Server

World's first OCM-based Rack Server

KR2190V3

The KR2190V3, KAYTUS's new-generation 2U single-socket/dual single-socket general-purpose server, pioneers the

commercialization of Open Compute Modules (OCM) and leads the industry. Featuring the Intel® Xeon® 6 processor or 5th Gen

AMD EPYC™ 9005 series processor, it supports full decoupling along with on-demand replacement and asynchronous

upgrade of compute/management/storage modules. Ideal for container cloud and big data applications, it delivers robust

computing power while limiting the data blast radius to enhance system stability for users.

Overview

KR2190V3 Powered by

Intel Processors

Specifications

KR2190-X3-A0-R0-00

Model Maintenance Cooling

Rear I/O Air cooling

Form Factor Up to 2 half-width single-socket computing nodes, with optional single-socket or dual single-socket systems

Processor 1 or 2 Intel® Xeon® 6 processors (SRF-AP/GNR-AP), up to 500W TDP

Memory Up to 12x DDR5 RDIMMs (6,400MHz) or MCR DIMMs (8,800MHz)

12-drive configuration:

12× 3.5-inch SAS/SATA/NVMe drives (hot-swap and compatible with 2.5-inch drives) |

12× E3.S SSDs (16.8mm)/E1.S SSDs (15mm) (x4, x8, or x16)

24-drive configuration:

24× 2.5-inch SAS/SATA/NVMe drive (hot-swap) | 32 × E1.S SSD (15mm)/16 × E3.S SSD (16.8mm) (x4, hot-swap)

Rear configuration 1:

6× FH3/4L PCIe 5.0 slots or 4× 3.5-inch SAS/SATA drives (hot-swap) | 4× HHHL PCIe 5.0 slots or 4× 2.5-inch SAS/SATA/NVMe drives

(hot-swap) | 1× PCIe 5.0 OCP NICs

Rear configuration 2:

6× FH3/4L PCIe 5.0 slots or 4 × 3.5-inch SAS/SATA drives (hot-swap) | 2× FH3/4L PCIe 5.0 slots | 1× PCIe 5.0 OCP NIC

Rear configuration 3:

4× FH3/4L 450W DW GPU + 1× 300W DW Smart NIC + 1x FH3/4L PCIe 5.0 card

Storage

PCIe Expansion

Power Supply Two 1+1 redundant hot-swap Platinum/Titanium PSUs with an output power of 1,600W/2,000W/2,700W/3,200W

Operating Temperature 5°C to 35°C (Refer to the White Paper for details)

Features

■ Streamlined design, security and reliability

Featuring fewer components on the motherboard: minimizing potential fault points and enhancing motherboard reliability.

Offering straightforward cable routing: preserving signal integrity and ensuring accurate, swift data transmission.

Incorporating proper cooling airflow design: boosting cooling efficiency and lessening cooling challenges, as well as mitigating the

adverse effects of parasitic capacitance and inductance to optimize the motherboard's electrical performance.

Employing a reasonable layout: diminishing noise interference from PSUs on other components and reducing signal transmission latency,

thereby improving the motherboard's overall performance.

■ Latency optimization, rapid response

The single-socket architecture

eliminating mutual socket access, UPI

interconnection, and cross-NUMA

access, resulting in reduced latency,

which enhancing user experience,

increasing system efficiency, improving

interactivity, decreasing package loss

rate, and supporting a higher number

of concurrent users.

■ Complete decoupling, flexible scalability

Minimizing data blast radius with

single-socket/dual single-socket

system design; narrowing the impact

range during failures; reducing data

migration time; improving system

reliability by lessening failure impact;

boosting fault tolerance; curbing

security vulnerability impact for secure

management and repair.

· Modular design for flexible

single-socket/dual single-socket

configurations to meet varying user

needs.

Enabling chassis decoupling for

adaptable I/O expansion, catering to

computing, storage, and GPU

application demands.

■ High fault tolerance, strong manageability

09 Computing Server Storage Server Multi-node Server Core Application Server

KR2190V3 Powered by

AMD Processors

Features

■ Streamlined design, security and reliability

Featuring fewer components on the motherboard: minimizing potential fault points and enhancing motherboard reliability.

Offering straightforward cable routing: preserving signal integrity and ensuring accurate, swift data transmission.

Incorporating proper cooling airflow design: boosting cooling efficiency and lessening cooling challenges, as well as mitigating the

adverse effects of parasitic capacitance and inductance to optimize the motherboard's electrical performance.

Employing a reasonable layout: diminishing noise interference from PSUs on other components and reducing signal transmission latency,

thereby improving the motherboard's overall performance.

■ Latency optimization, rapid response

The single-socket architecture

eliminating mutual socket access, UPI

interconnection, and cross-NUMA

access, resulting in reduced latency,

which enhancing user experience,

increasing system efficiency, improving

interactivity, decreasing package loss

rate, and supporting a higher number

of concurrent users.

■ Complete decoupling, flexible scalability

Minimizing data blast radius with

single-socket system design;

narrowing the impact range during

failures; reducing data migration time;

improving system reliability by

lessening failure impact; boosting fault

tolerance; curbing security vulnerability

impact for secure management and

repair.

· Modular design for flexible configurations

to meet varying user needs.

Enabling chassis decoupling for

adaptable I/O expansion, catering to

computing, storage, and GPU application

demands.

Supporting all-flash configuration.

■ High fault tolerance, strong manageability

Specifications

KR2190-E3-A0-R0-00

Model Maintenance Cooling

Rear I/O Air cooling

Processor One 5th Gen AMD EPYC™ 9005 series processor, up to 500W TDP

Memory Up to 12x DDR5 RDIMMs (6,400MHz)

12-drive configuration:

12× 3.5-inch SAS/SATA/NVMe drives (hot-swap and compatible with 2.5-inch drives) |

12× E3.S SSDs (16.8mm)/E1.S SSDs (15mm) (x4)

24-drive configuration:

24× 2.5-inch SAS/SATA/NVMe drives (hot-swap) |

24× E1.S SSDs (15mm) (x4)

Rear configuration 1:

6× FH3/4L PCIe 5.0 slots or 4× 3.5-inch SAS/SATA drives (hot-swap) |

4× HHHL PCIe 5.0 slots or 4× 2.5-inch SAS/SATA/NVMe drives (hot-swap) |

1× PCIe 5.0 OCP NIC

Rear configuration 2:

4× FH3/4L 450W DW GPUs/4× 3.5-inch drives (compatible with 2.5-inch drives)/3× FHHL PCIe 5.0 slots + 1× 300W DW Smart NIC + 1

× FH3/4L PCIe 5.0 card

Storage

PCIe Expansion

Power Supply Two 1+1 redundant hot-swap Platinum/Titanium PSUs with an output power of 1,600W/2,000W/2,700W/3,200W

Operating Temperature 5°C to 35°C (Refer to the White Paper for details)

10 Computing Server Storage Server Multi-node Server Core Application Server

High-density Single-socket Cost-effective

Rack Server

KR1180V3

KR1180V3 is a 1U1S rack server series that sets a new standard for cost-effective computing and storage, featuring the Intel

Birch Stream platform and the AMD EPYC™ 9005 series processor. It offers a balance of low to medium computing needs

with high core counts, base frequency, and cache, all within a 1U form factor. With its rich I/O SKUs and full configuration

support from all-flash to GPU, the KR1180V3 provides expansion capabilities on par with dual-socket servers, addressing

TCO and cross-NUMA access challenges while conserving data center space. Ideal for all-flash distributed storage, bare

metal cloud services, video transcoding, and data processing, it presents an optimal performance-to-power ratio and a

cost-efficient upgrade solution.

Overview

KR1180V3

Features

■ Optimized latency, rapid response

The single-socket architecture

eliminating mutual socket access, UPI

interconnection, and cross-NUMA

access, resulting in reduced latency,

which enhancing user experience,

increasing system efficiency, improving

interactivity, decreasing package loss

rate, and supporting a higher number

of concurrent users.

■ Ultimate design, agile architecture

Modular design in a flexible layout,

significantly optimizing chassis depth

for various application scenarios.

Separated boards for independent

development, flexible matching, and

replacement, enhancing architecture

flexibility and ensuring maintenance

ease for customers.

System compatibility with a range of

rich and non-rich I/O SKUs, eliminating

the need to replace the motherboard.

Supporting up to 6 I/O extensions for

flexible satisfaction of high I/O

expansion scenarios, including

all-flash and GPU resource pools.

Featuring superior cooling design,

accommodating CPUs with the

highest TDP within a 1U space.

■ Efficient expansion, robust cooling

Specifications

KR1180-X3-A0-R0-00

Model Maintenance Cooling

Rear I/O Air cooling

KR1180-X3-C0-R0-00 Rear I/O Cold-plated liquid cooling

Processor 1 Intel® Xeon® 6 processor (SRF-AP/GNR-AP), up to 350W TDP

Memory Up to 8x DDR5 RDIMMs (6,400MHz) or MCR DIMMs (8,000MHz)

10-drive configuration:

10× 2.5-inch SAS/SATA/NVMe drives (hot-swap)

4-drive configuration:

4× 3.5-inch SAS/SATA/NVMe drives (hot-swap) | 4× E3.S SSDs (7.5mm) (x4, hot-swap)

12-drive configuration:

12× 2.5-inch SAS/SATA/NVMe drives (hot-swap)

Front:

2× HHHL PCIe 5.0 x8 slots for SAS/RAID card expansion

Internal:

1× HHHL PCIe 5.0 x8 slot for SAS/RAID card expansion |

2× SATA/PCIe M.2 SSDs

Rear configuration 1:

1× FH PCIe 5.0 slot | 2× HHHL PCIe 5.0 slots | 1× PCIe 5.0 x8/x16 OCP 3.0 NIC

Rear configuration 2:

2× FH PCIe 5.0 slots | 1× PCIe 5.0 x8/x16 OCP 3.0 NIC

Storage

PCIe Expansion

Power Supply Two 1+1 redundant hot-swap Platinum/Titanium PSUs with an output power of 800W/1,300W/1,600W/2,000W

Air cooling: 5°C to 40°C

Liquid cooling: 5°C to 45°C (Refer to the White Paper for details)

Operating Temperature

Intel Processors

11 Computing Server Storage Server Multi-node Server Core Application Server

KR1180V3 Powered by

AMD Processors

Specifications

KR1180-E3-A0-R0-00

Model Maintenance Cooling

Rear I/O Air cooling

Processor 1 AMD EPYC™ 9005 series processor

Memory Up to 24x DDR5 DIMMs

Front: 4× 3.5-inch SAS/SATA/NVMe drives + 4× 2.5-inch SAS/SATA/NVMe drives |10× 2.5-inch SAS/SATA/NVMe drives | 16× E1.S

SSDs (pass-through)

Up to 5x PCIe 5.0 slots | 2x OCP 3.0 NICs

Storage

PCIe Expansion

Internal: 2× SATA/PCIe M.2 SSDs

Power Supply 1+1 redundant hot-swap PSUs

Operating Temperature 10°C to 35°C (Refer to the White Paper for details)

Features

■ Powerful performance

Equipped with 1 AMD EPYC™ 9005 series processor, offering

up to 192 cores and 384 threads, a maximum boost frequency

of 5.0GHz, and an L3 cache capacity of up to 384MB per CPU.

Supporting up to 24 DDR5 DIMMs, providing a memory

capacity comparable to dual-socket servers.

■ Ultimate density

Offering up to 4 3.5-inch and 4 2.5-inch SAS/SATA/NVMe

drives or 10 2.5-inch SAS/SATA/NVMe drives for maximized

storage density.

Including 2 optional OCP 3.0 modules, providing multiple

network interface options for a more flexible network

structure in applications.

Supporting up to 5 standard PCIe 5.0 expansion cards to

further enhance I/O performance.

Featuring optional internal SATA/PCIe M.2 SSD modules to

meet diverse storage requirements.

■ Intelligence and security

Achieving BIOS/BMC chip-level redundancy to enhance

firmware security; enabling secure erasure of drive data to

protect against malicious firmware tampering.

Facilitating intelligent fault diagnosis through the KSManage

management platform and tool-less operation and maintenance.

Utilizing AMD SEV technology to ensure more secure data

transmission.

■ Eco-friendliness and cost effectiveness

Offering intelligent fan speed control to effectively reduce fan

noise and power consumption.

Providing Titanium PSUs for higher power conversion

efficiency.

Employing an innovative 1U1S design to effectively save on

server procurement costs, power consumption, and server

room space while ensuring server performance.

12 Computing Server Storage Server Multi-node Server Core Application Server

High-scalability Single-socket Cost-effective Rack Server

KR2180V3

The KR2180V3, a 2U1S rack server series, is powered by the latest AMD EPYC™ 9005 series processor. It boasts more cores,

a high base frequency, large cache, and high scalability, maximizing performance per CPU for ultimate storage and expansion

within a 2U form factor. Ideal for cloud computing/virtualization, big data, distributed storage, video transcoding, and

inference and training applications, this series effectively enhances TCO benefits.

Overview

Specifications

KR2180-E3-A0-R0-00

Model Cooling

Air cooling

Processor

Memory

Storage

Maintenance

Rear I/O

1x AMD EPYC™ 9005 series processor

Up to 24x DDR5 DIMMs

Front: 12× 3.5-inch SAS/SATA/NVMe drives | 24× 2.5-inch SAS/SATA/NVMe/E3.S SSDs | 25× 2.5-inch SAS/SATA drives

( with the support of 4 NVMe drives)

PCIe Expansion Up to 8x PCIe 5.0 slots | 2x OCP 3.0 NICs | Up to 4x DW GPUs

Power Supply

Operating Temperature

1+1 redundant hot-swap PSUs

10°C to 35°C (Refer to the White Paper for details)

Internal: 2× SATA/PCIe M.2 SSDs | 4× 3.5-inch SATA drives

Rear: 4× 3.5-inch SAS/SATA drives | 4× 2.5-inch SAS/SATA/NVMe drives

Features

■ Powerful performance

Equipped with 1 AMD EPYC™ 9005 series processor, offering up

to 192 cores and 384 threads, a maximum boost frequency of

5.0GHz, and an L3 cache capacity of up to 384MB per CPU.

Supporting up to 24 DDR5 DIMMs, delivering a memory capacity

comparable to that of dual-socket servers.

■ Ultra-high scalability

Offering up to 128 PCIe 5.0 lanes in a single-socket configuration,

along with 24 3.5-inch SATA/SAS drives, 28/29 2.5-inch

SATA/SAS drives, or 24 NVMe/E3.S SSDs.

Featuring up to 8 standard PCIe expansion slots, supporting

2 hot-swap OCP 3.0 x8/x16 NICs.

Accommodating up to 4 dual-width GPUs.

■ Eco-friendliness and cost effectiveness

Offering intelligent fan speed control to effectively reduce fan

noise and power consumption.

Providing Titanium PSUs for higher power conversion

efficiency.

Utilizing a single-socket design to offer significant TCO

benefits in the scenarios such as big data and virtualization.

Providing BIOS/BMC chip-level redundancy to enhance

firmware security; enabling secure erasure of drive data to

prevent malicious firmware tampering.

Offering intelligent fault diagnosis through the KSManage

management platform and facilitating tool-less operation and

maintenance.

Supporting AMD SEV technology to ensure more secure data

transmission.

■ Intelligence and security

4U General-purpose Storage Rack Server

KR4266V3

The KR4266V3, a 4U2S server designed for storage optimization, boasts high-density storage, potent computing capabilities,

smart operational management, and outstanding energy efficiency. This makes it perfectly suited for a variety of applications,

including warm and cold data archiving, video content storage, big data repositories, cloud storage pool deployments, CDN

caching solutions, and data migration and backup processes.

Overview

Features

KR4266V3

■ High storage capacity

Offering support for up to 48 3.5-inch HDDs, delivering a

massive storage capacity of up to 1PB to address cost-effective

local data storage needs.

Supporting 48 all-flash NVMe drives and high-capacity QLC

SSDs, ensuring ultimate all-flash storage capacity and

performance for applications such as big data, CDN, and

high-performance cloud storage solutions.

■ Powerful computing performance

Featuring new-generation Intel processors on the Birch

Stream platform, with a 24% boost in computing performance

over the previous generation and a 14% bandwidth increase

with 8-channel DDR5 DIMMs (6,400MT/s), meeting the

escalating demand for computing power in big data analytics.

Enabling support for 2 dual-width GPUs or 8 single-width GPUs

to fulfill the requirements of IVA scenarios, offering efficient local

data analysis and intelligent data processing capabilities.

■ Intelligent O&M

Innovative features implemented include MUPR for early

warning of memory faults, IRUT for seamless firmware

updates, DMPU as a fault diagnosis module, refined early

warning systems for power failures, and load status LEDs.

Supporting cloud-based O&M and online diagnostic

functions, reducing O&M complexity and costs.

Professional software and hardware design adopted for

monitoring air temperature, airflow, and air pressure, along

with intelligent thermal control strategies, enhancing disk

service lifecycle and ensuring optimal operating conditions

for the storage server. Further supporting intelligent fault

prediction for storage media and recommending repair

solutions, ensuring stable system performance.

■ High efficiency and energy saving

Offering efficient, energy-saving, green, and low-carbon

cold-plated liquid cooling, which reducing the power consumption

of air conditioning units in data centers, optimizing O&M

costs, and lowering the PUE of data centers below 1.1.

KAYTUS' power management technology facilitating

one-click energy efficiency matching across 17 service

modes, covering multi-service modes in scenarios focusing

on performance, load balancing, and energy saving.

Combined with KAYTUS's drive hibernation technology, the

server supporting deep sleep customization for disk groups

and refined control of overall power consumption, achieving a

70% reduction in overall power consumption.

Specifications

KR4266-X3-A0-R0-00

Model Cooling

Air cooling

KR4266-X3-C0-R0-00 Cold-plated liquid cooling

Processor

Memory

Storage

PCIe Expansion

Power Supply

Operating Temperature

Maintenance

Rear I/O

1 or 2 Intel® Xeon® 6 processors

Up to 350W TDP

Up to 32x DDR5 DIMMs (6,400MT/s)

Up to 16x DIMMs per CPU and 32x DIMMs for 2 CPUs; RDIMMs supported; up to 16x MCR DIMMs (8,000MT/s) for the GNR CPU configuration

Front: 24× 3.5-inch drives (hot-swap) | 12× 3.5-inch drives + 12× U.2 SSDs | 48 × QLC SSDs

Internal: 8× 3.5-inch drives + 2× SATA 3.0/PCIe 3.0/4.0/5.0 x4 M.2 SSDs

Rear: 16× 3.5-inch drives + 4× 2.5-inch drives, supporting 8× E1.S SSDs

Up to 12x PCIe 5.0 expansion slots, including 2 slots for hot-swap OCP 3.0 NICs

1+1 redundant Titanium/Platinum CRPS PSUs with an output power of 1,300W/1,600W/2,000W/2,700W

5°C to 45°C (Refer to the White Paper for details)

Intel Processors

Computing Server Storage Server Multi-node Server Core Application Server

High-density Multi-node Server

K24V3

The K24V3, a new-generation high-density multi-node server, supports both Intel and AMD platforms. Featuring compatibility

with 3 types of single-socket/dual-socket compute nodes, it is tailored for high-performance computing optimization. The

dual-socket configuration accommodates both air cooling and liquid cooling, with cold plates covering CPUs, DIMMs, and VR

within a node. This approach achieves a high liquid cooling ratio, effectively reducing system power consumption and

operating noise, and meeting the low PUE demand, assisting customers in building a new generation of green high-density

data centers.

Overview

K24V3-2S

Features

■ Leading performance

Delivering industry-leading CPU computing power, accommodating

8 Intel® Xeon® 6 processors (AP) within a 2U space.

Featuring a disruptive system architecture design, enabling

multi-host mode for high-bandwidth node interconnection.

■ High-density deployment

Quadrupling deployment density compared to traditional rack

servers, efficiently accelerating server deployment.

Enhancing cabinet utilization amidst insufficient space in

users' data center; supporting integrated cabinet delivery,

greatly simplifying the deployment procedure.

■ Efficient liquid cooling

Highly reliable integrated cold plate design covering CPUs,

DIMMs, and VR supporting 50°C (medium and high temperature)

water inlet cooling, meeting the low PUE demand.

Efficient, energy-saving, green, and low-carbon liquid cooling

greatly reducing fan speed, optimizing the O&M environment

of the data center and maintaining a moderate noise level.

■ Security and reliability

Precise leak detection solution for real-time leakage node

location and automatic power cut-off, effectively reducing risks.

Liquid-cooled cabinets with detection and alarm functions

for temperature, humidity, liquid leakage, and smoke,

equipped with intelligent management platform for dynamic

environment monitoring.

Specifications

K24-X3-A0-R0-00

Chassis Model Cooling

Air cooling

K24-X3-C0-R0-00 Cold-plated liquid cooling

Form Factor

Storage

Power Supply

Maintenance

Rear I/O

2U rack chassis, including 4 independent hot-swap dual-socket computing nodes

Configuration 1: 8× 2.5-inch SATA/NVMe SSDs (7mm) | Configuration 2: 4× 2.5-inch SATA/NVMe SSDs (15mm) |

No-drive configuration (optional)

4x N+N redundant hot-swap 2,700W/3,200W Titanium PSUs

System Cooling

Operating Temperature

4x or 5x front 8086 system cooling fans with N+1 redundancy

Air cooling: 5°C to 40°C | Liquid cooling: 5°C to 45°C (Refer to the White Paper for details)

KM1290-X3-A0-R0-00

Node Model Cooling

Air cooling

KM1290-X3-C0-R0-00 Cold-plated liquid cooling

Form Factor

Processor

Memory

Maintenance

Rear I/O

1U half-width dual-socket compute node

2 Intel® Xeon® 6 processors (AP) per node, up to 500W TDP, with 6 UPI links

Up to 24x DDR5 RDIMMs (6,400MHz) or MCR DIMMs (8,800MHz) per node

PCIe Expansion

Multi-host Network

Air cooling: 2 PCIe 5.0 x8 slots | 1 PCIe 5.0 x16 slot per node | Liquid cooling: 1 PCIe 5.0 x16 slot per node

Supporting the multi-host mode, enabling uniform access and management of 2 nodes with 1 multi-host NIC

Storage Configuration 1: 2× 2.5-inch SATA/NVMe SSDs (7mm) per node | Configuration 2: 1× 2.5-inch SATA/NVMe SSDs (15mm) per node |

2× internal SATA/PCIe M.2 SSDs per node

Intel Processors

Computing Server Storage Server Multi-node Server Core Application Server

K24V3-2S Powered by

AMD Processors

Features

■ Leading performance

Delivering industry-leading CPU computing power, supporting 8

5th Gen AMD EPYC™ 9005 series processors within a 2U space.

Featuring a disruptive system architecture design, enabling

multi-host mode for high-bandwidth node interconnection.

■ High-density deployment

Quadrupling deployment density compared to traditional rack

servers, efficiently accelerating server deployment.

Enhancing cabinet utilization in the face of insufficient space

in users' server rooms; supporting integrated cabinet delivery,

greatly simplifying the deployment procedure.

■ Security and reliability

Precise leak detection solution for real-time location of

leakage nodes and automatic power cut-off, effectively

reducing risks.

Liquid-cooled cabinets with support for temperature,

humidity, liquid leakage, and smoke detection and alarm

functions, equipped with intelligent management platform for

dynamic environment monitoring.

Specifications

K24-E3-A0-R0-00

Chassis Model Cooling

Air cooling

K24-E3-C0-R0-00 Cold-plated liquid cooling

Form Factor

Storage

Power Supply

Maintenance

Rear I/O

2U rack chassis, including 4 independent hot-swap dual-socket compute nodes

Configuration 1: 8× 2.5-inch SATA/NVMe SSDs (7mm) | Configuration 2: 4× 2.5-inch SATA/NVMe SSDs (15mm) |

No-drive configuration (optional)

4x N+N redundant hot-swap 2,700W/3,200W Titanium PSUs

System Cooling

Operating Temperature

4x or 5x front 8086 system cooling fans with N+1 redundancy

Air cooling: 5°C to 40°C | Liquid cooling: 5°C to 45°C (Refer to the White Paper for details)

KM1280-E3-A0-R0-00

Node Model Cooling

Air cooling

KM1280-E3-C0-R0-00 Cold-plated liquid cooling

Form Factor

Processor

Memory

Maintenance

Rear I/O

1U half-width dual-socket compute node

2x 5th Gen AMD EPYC™ 9005 series processors per node, up to 500W TDP

Up to 24x DDR5 RDIMMs (6,400MHz) per node

PCIe Expansion

Multi-host Network

Air cooling: 1 PCIe 4.0 x16 slot + 1 PCIe 5.0 x16 slot per node | Liquid cooling: 1 PCIe 5.0 x16 slot per node

Supporting the multi-host mode, enabling uniform access and management of 2 nodes with 1 multi-host NIC

Storage Configuration 1: 2× 2.5-inch SATA/NVMe SSDs (7mm) per node

Configuration 2: 1× 2.5-inch SATA/NVMe SSDs (15mm) per node

1× internal SATA/PCIe M.2 SSDs per node

Highly reliable integrated cold plate design covering CPUs,

DIMMs, and VR, supporting 45°C (medium and high-temperature)

water inlet cooling, meeting the demand for low PUE.

Efficient, energy-saving, green, and low-carbon liquid cooling

significantly reducing fan speed, optimizing the O&M

environment of the server room and maintaining a moderate

noise level.

■ Efficient liquid cooling

Computing Server Storage Server Multi-node Server Core Application Server

Specifications

K24-E3-A0-R0-01

Chassis Model Cooling

Air cooling

Form Factor

Storage

Power Supply

System Cooling

Operating Temperature

KM1160-E3-A0-R0-00

Node Model Cooling

Air cooling

Maintenance

Rear I/O

2U rack chassis, including 4 independent hot-swap single-socket computing nodes

Configuration 1: 24× 2.5-inch SATA/SAS/NVMe drives

Configuration 2: No drives

4x N+N redundant hot-swap 2,000W/2,200W Platinum/Titanium PSUs

6x front 6056 system cooling fans with N+1 rotor redundancy

5°C to 40°C (Refer to the White Paper for details)

Maintenance

Rear I/O

Form Factor

Processor

Memory

PCIe Expansion

Storage

1U half-width single-socket compute node

One 5th Gen AMD EPYC™ 9005 series processor per node

Up to 12x DDR5 RDIMMs (6,400MHz) per node

2x PCIe 5.0 x16 slots per node

Configuration 1: 6× 2.5-inch SATA/SAS/NVMe drives per node

Configuration 2: No drives

2× internal SATA/PCIe M.2 SSDs per node

K24V3-1S

Features

■ Leading performance ■ Flexible configurations ■ Energy efficiency optimization

Industry-leading CPU computing

power provided, supporting 4 5th Gen

AMD EPYC™ 9005 series processors in

a 2U space.

Supporting high-speed IB NDR

network for high-bandwidth node

interconnection.

Supporting up to 24 SFF NVMe/SAS/

SATA drives or configurations without

drives and backplanes.

Offering optional internal SATA/NVMe

M.2 SSD modules to accommodate

diverse storage configurations.

Power capping feature provided,

achieving system-level efficiency and

energy saving.

Utilizing EVAC heatsinks to significantly

optimize fan speed and reduce

system power.

AMD Processors

Computing Server Storage Server Multi-node Server Core Application Server

Innovative Architecture-optimized

High-efficiency Server

K22V3

The K22V3, an architecture-optimized high-efficiency rack server, is powered by the 5th Gen AMD EPYC™ 9005 series

processors. Deployed with 2 horizontal nodes into an innovative 2U2N architecture, it offers exceptional performance, cooling

efficiency, and energy consumption. Requiring less cabinet space, energy consumption, and deployment cost, it provides

flexible storage solutions, making it suitable for container, virtualization, and other compute-intensive application scenarios.

Overview

K22V3

Features

■ Leading performance, optimized architecture

Industry-leading CPU computing power provided, supporting

2 latest-generation AMD EPYC™ 9005 series processors in a

2U space, up to 500W TDP.

Deployed with 2 horizontal nodes into an innovative 2U2N

architecture and equipped with 2U efficient heatsinks,

improving cooling efficiency by 40%.

Achieving optimal balance between single-server performance

and data blast radius, lowering data migration costs after

server failures.

Sharing chassis, backplanes, fans, and PSUs between both

nodes, achieving higher system cost-performance.

■ Intelligent management, stability and reliability

BMC dual-flash redundant backup provided for automatic

switch to the standby image upon boot failure, ensuring

remote O&M operation safety.

Power capping supported for overall high efficiency and

energy saving in conjunction with more efficient power

control.

Independent management network port equipped per node,

enabling local ISBMC O&M and improving O&M efficiency.

Intelligent management software equipped, fulfilling

centralized intelligent server management.

Specifications

K22-E3-A0-R0-00

Chassis Model Cooling

Air cooling

Form Factor

Storage

Power Supply

Maintenance

Rear I/O

2U rack chassis, including 2 independent hot-swap single-socket computing nodes

12× SATA/NVMe SSDs

No-drive configuration (optional)

Two 1+1 redundant hot-swap 2,000W/2,220W Platinum/Titanium PSUs

System Cooling

Operating Temperature

6x 6056 fans with N+1 redundancy

10°C to 35°C (Refer to the White Paper for details)

KM2160-E3-A0-R0-00

Node Model Cooling

Air cooling

Form Factor

Processor

Memory

Maintenance

Rear I/O

2U half-width single-socket compute node

One 5th Gen AMD EPYC™ 9005 series processor per node, up to 500W TDP

Up to 12x DDR5 RDIMMs (6,400MHz) per node

PCIe Expansion Up to 2 PCIe 5.0 x16 slots + 2 PCIe 5.0 x8 slots per node

Storage 6× SATA/NVMe SSDs per node

2× internal SATA/PCIe M.2 SSDs per node

AMD Processors

Computing Server Storage Server Multi-node Server Core Application Server

4U4S Core Application Rack Server

KR4480V3

The KR4480V3, a high-end quad-socket rack server, is powered by Intel® Xeon® 6 processors. Delivering powerful computing

performance, featuring a flexible modular design, superior scalability, and enhanced reliability and security, it is optimized for

customers' critical data-intensive services. Making it suitable for application scenarios such as large transaction databases,

in-memory databases, virtualization integration, server clusters, deep learning, and ERP.

Overview

Features

KR4480V3

■ Powerful computing performance

Supporting 2 or 4 latest-generation

Intel® Xeon® 6 processors and 64

DDR5 RDIMMs (6,400MT/s), delivering

superior speed, high availability, and a

memory capacity of up to 16TB.

· · ·

■ Diverse storage configurations

Supporting up to 24 front-accessible

2.5-inch SAS/SATA/NVMe drives plus

12 3.5-inch SAS/SATA drives, or

accommodating 50 2.5-inch SAS/SATA

drives and 2 internal M.2 SSDs to

accommodate diverse storage

requirements.

Supporting up to 22 PCIe expansion

slots or 20 PCIe expansion slots and 2

dedicated OCP 3.0 NICs, offering

multiple network interface options for

a more flexible network structure in

applications.

■ Ultra-high expansion capabilities

Specifications

KR4480-X3-A0-R0-00

Model Maintenance Cooling

Rear I/O Air cooling

Processor 2x or 4x Intel® Xeon® 6 processors

Memory Up to 64x DDR5 DIMMs

Storage

PCIe Expansion

Power Supply 4x standard CRPS PSUs with N+M (M≤N) redundancy

Operating Temperature 5°C to 45°C (Refer to the White Paper for details)

Front: 24x 2.5-inch SAS/SATA/NVMe drives + 12x 3.5-inch SAS/SATA drives | 50x 2.5-inch SAS/SATA drives

Up to 22x PCIe expansion slots | 20x PCIe expansion slots + 2x OCP 3.0 NICs

Internal: 2× M.2 SSDs

Intel Processors

Computing Server Storage Server Multi-node Server Core Application Server

KAYTUS' Product Naming Nomenclature

Product Form

KR: Rack-optimized system

KE: Edge server

KM: Nodes for Multi node system

KN: Dedicated Nodes for 21\"Rack

KT: Tower system

Generation Code

Intel: Birch Stream(AP/SP）

AMD: Turin

Chassis Attribute

KR/KT/KE:

Chassis height

KL/KM/KN:

Node u height

System Grade

0: low model

within segment

9: Upper model

within segment

System

Characteristics

0 for computing

optimized

6 for storage

optimized

8 for GPU

optimized

General purpose

server

Socket Count

1:1 CPU socket

4:4 CPU socket

2:2 CPU socket

8:8 CPU socket

K R 2 2 8 0 V 3

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