THERMAL INTERFACE MATERIALS
旭立科技股份有限公司
PROFESSIONAL TIM
MANUFACTURER
SHIU LI TECHNOLOGY
INNOVATIVE
THERMAL SOLUTIONS
LiPOLY materials have been designed into hundreds of applications for
some of the largest electronic companies in the world. We listen to our
customers’ needs and develop thermal solutions that meet our customers’ specific design requirements.
Our customers come to us because LiPOLY deliver innovative and reliable thermal interface solutions.
Founded in 2005, Shiu Li Technology has established itself as a
leading thermal management manufacturer, developing high-performance thermal solutions for product designers around the
globe.
For nearly 20 years, Shiu Li Technology has supplied some of the
largest technology brands in the world with its brand of LiPOLY
thermal interface materials.
RBA 0005 0005
IATF
ISO TS 16949
ISO 14001
ISO 9001
Ⓡ
//HEADQUARTER
SHIU LI TECHNOLOGY CO ., LTD
No.435, Yongfeng Rd., Bade Dist., Taoyuan
City 334, Taiwan(R.O.C.)
• Management Center
• Production Center
• R&D Center
• Sales Center
TEL:+886-3-3788588
FAX:+886-3-3788288
service@lipoly.com
//BRANCH OFFICE
/ NIHON KYOKURITSUKAGI CO., LYD
4th floor, TR Building, 2-1 Kogicho, Kaizuka
City, Osaka Prefecture 597-0001
/ KUNSHAN SHIU LI ELECTRONICS CO., LTD
Area B, 2nd Floor, Building A1, No. 398, Hengchangjing Road, Zhoushi Town, Kunshan City,
Jiangsu Province
/ SHEN ZHEN SHIU LI ELECTRONIC CO., LTD
13F, Quanzhi Science and Technology Innovation Park, Hooting, Shajing Street, Baoan District, Shenzhen
/ U.S. Office
550 N.BRAND BLVD. 14TH FLOOR, GLENDALE, CA 91203
/ VIETNAM SHIU LI TECHNOLOGY CO., LTD.
Factory A6-1, Lot 6, Cam Dien – Luong Dien
Industrial Park, Luong Dien Commune, Cam
Giang District, Hai Duong Province, Vietnam
PRODUCT INDEX
High Thermal Conductive Gap Filler
T-top81-s High Thermal Conductive Gap Filler ...................................................... p.7-8
T-work7000 High Thermal Conductive Gap Filler ...................................................... p.9-10
T-top91-s High Thermal Conductive Gap Filler ...................................................... p.11-12
T-work8000 High Thermal Conductive Gap Filler ...................................................... p.13-14
T-top98-s High Thermal Conductive Gap Filler ...................................................... p.15-16
T-work9000 High Thermal Conductive Gap Filler ...................................................... p.17-18
Thermal Conductive Gel Pad
PK223 Thermal Conductive Gel Pad .................................................................. p.19
PK404 Thermal Conductive Gel Pad .................................................................. p.20
PK504 Thermal Conductive Gel Pad .................................................................. p.21
PK605 Thermal Conductive Gel Pad .................................................................. p.22
PK700 Thermal Conductive Gel Pad .................................................................. p.23
Exceptionally Soft Thermal Conductive Gel Pad
BS75K Exceptionally Soft Thermal Conductive Gel Pad ................................... p.24
BS87-s Exceptionally Soft Thermal Conductive Gel Pad ................................... p.25
BS89 Exceptionally Soft Thermal Conductive Gel Pad ................................... p.26
S282-s Exceptionally Soft Thermal Conductive Gel Pad ................................... p.27
Non-Silicone Thermal Conductive Pad
N700A Non-Silicone Thermal Conductive Pad .................................................. p.30
N700B Non-Silicone Thermal Conductive Pad .................................................. p.31
N700C Non-Silicone Thermal Conductive Pad .................................................. p.32
N800AH-s Non-Silicone Thermal Conductive Pad .................................................. p.33
N800A-s Non-Silicone Thermal Conductive Pad .................................................. p.34
N800BH Non-Silicone Thermal Conductive Pad .................................................. p.35
N800B Non-Silicone Thermal Conductive Pad .................................................. p.36
N800CH Non-Silicone Thermal Conductive Pad .................................................. p.37
N800C Non-Silicone Thermal Conductive Pad .................................................. p.38
Silicone Liquid Gap Filler
Thermal Conductive Putty
S-putty Thermal Conductive Putty ...................................................................... p.39
S-putty2-s Thermal Conductive Putty ...................................................................... p.40
H-putty Thermal Conductive Putty ...................................................................... p.41
H-putty2 Thermal Conductive Putty ...................................................................... p.42
SH-putty3 Thermal Conductive Putty ...................................................................... p.43
S-putty5-s Thermal Conductive Putty ...................................................................... p.44
Two-Part Thermal Conductive Gap Filler
PK223DM Two-Part Thermal Conductive Gap Filler ............................................... p.45-46
PK404DM Two-Part Thermal Conductive Gap Filler ............................................... p.47-48
PK605DM Two-Part Thermal Conductive Gap Filler ............................................... p.49-50
PK700DM Two-Part Thermal Conductive Gap Filler ............................................... p.51-52
Two-Part Thermal Conductive Sealing Glue
TPS586/TPS5868 Two-Part Thermal Conductive Sealing Glue .................................. p.53
Ultra Low Oil-Bleed Thermal Conductive Gel Pad
AS200-s Ultra Low Oil-Bleed Thermal Conductive Gel Pad ................................. p.28
AS400-s Ultra Low Oil-Bleed Thermal Conductive Gel Pad ................................. p.29
Thermal Conductive Gap Pad Series
Thermal Liquid Gap Filler Series
Non-Silicone Liquid Gap Filler
Non-Silicone Thermal Conductive Putty
N-putty Non-Silicone Thermal Conductive Putty .......................................... p.64
N-putty2 Non-Silicone Thermal Conductive Putty .......................................... p.65
Two-Part Curable Thermal Grease
D2000 Two-Part Curable Thermal Grease .................................................. p.60-61
Thermal Grease
TT3000 Nano Thermal Grease ...................................................................... p.62
G3380A/B/C/D Thermal Grease Series ..................................................................... p.63
Non-Silicone Two-Part Thermal Conductive Adhesive
EPDM20 Non-Silicone Two-Part Thermal Conductive Adhesive ................... p.66
EPDM30 Non-Silicone Two-Part Thermal Conductive Adhesive ................... p.67
Non-Silicone Two-Part Thermal Conductive Sealing Glue
EP770 Non-Silicone Two-Part Thermal Conductive Sealing Glue .............. p.68
Non-Silicone Thermal Grease
G3380NA/NB/NC Non-Silicone Thermal Grease Series .......................................... p.69
Silicone Thermal conductive RF Absorber Pad
TEM96A Thermal Conductive RF Absorber Pad ........................................... p.70
TEM96B Thermal Conductive RF Absorber Pad ........................................... p.71
TEM96C Thermal Conductive RF Absorber Pad ........................................... p.72
Non-Silicone Thermal Conductive RF Absorber Pad
N-TEM52 Non-Silicone Thermal Conductive RF Absorber Pad....................... p.73
N-TEM53 Non-Silicone Thermal Conductive RF Absorber Pad....................... p.74
N-TEM54 Non-Silicone Thermal Conductive RF Absorber Pad....................... p.75
5G mmWave Thermal Conductive Gel Pad
DTT44-s 5G mmWave Thermal Conductive Gel Pad ..................................... p.76
DTT65-s 5G mmWave Thermal Conductive Gel Pad ..................................... p.77
Thermal Conductive Absorber Series
High Insulated Thermal Conductive Film
PR27 High Insulated Thermal Conductive Film ........................................ p.83
PR28-s High Insulated Thermal Conductive Film ......................................... p.84
UL Flammability Thermal Conductive Tape
ST6000-S UL Flammability Thermal Conductive Tape .................................... p.78
AT910 UL Flammability Thermal Conductive Tape .................................... p.79
Insulated Thermal Conductive Tape
AT900A Insulated Thermal Conductive Tape ............................................... p.80
AT900C Insulated Thermal Conductive Tape ............................................... p.81
AT920-s High Thermal Conductive Tape ....................................................... p.82
High Thermal Conductive Tape
Insulated Thermal Conductive Series
Thermal Conductive Tape Series
Two-Part Thermal Conductive Die Attach Adhesive
TIM12 Two-Part Thermal Conductive Die Attach Adhesive ....................... p.56-57
TIM14 Two-Part Thermal Conductive Die Attach Adhesive ....................... p.58-59
TPS589 Two-Part Thermal Conductive Sealing Glue .................................. p.54
TPS31/TPS32 Lightweight Two-Part Thermal Conductive Sealing Glue ............. p.55
Complex Thermal Conductive Material
TR332CU Complex Thermal Conductive Film .................................................... p.89
G566A/G566AP Artificial Graphite Sheet ...................................................................... p.90
Thermal Conductive Rubber Cap/Tube
SP22/23/33 Thermal Conductive Rubber Cap Series ........................................... p.86
CP-S Thermal Conductive Rubber Cap ....................................................... p.87
TP200 Thermal Conductive Rubber Tube ..................................................... p.88
Artificial Graphite Series
SH1500/2000/3000 High Insulated Thermal Conductive Pad Series ........................ p.85
Series
T-top81-s
Characteristics
Silicone compound with
weak sticky surfaces.
Configurations
Sheets form,
Die-cuts parts
%
%
%
%
%
%
Visual
-
-
ASTM D374
ASTM D792
By LiPOLY
ASTM D149
ASTM D257
ASTM D257
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
Color
Surface tack 2-side/1-side
Thickness
Density
TML
Application temperature
ELECTRICAL
COMPRESSION
Dielectric breakdown
Deflection @10 psi
Deflection @20 psi
Deflection @30 psi
Deflection @40 psi
Deflection @50 psi
Dielectric constant@10MHz Dk
Dielectric constant@1GHz Dk
Dielectric constant@1.8GHz Dk
Dielectric factor@10MHz Df
Dielectric factor@1GHz Df
Dielectric factor@1.8GHz Df
Surface resistivity
Volume resistivity
THERMAL
Thermal conductivity
Thermal impedance@10psi
Thermal impedance@20psi
Thermal impedance@30psi
Thermal impedance@40psi
Thermal impedance@50psi
-
-
-
-
-
-
-
-
mm
g/cm³
°C
- -
KV/mm
Ohm
Ohm-m
W/m*K
ROHS & REACH
Thermal Conductivity ISO 22007-2 W/m*K
Hardness ASTM D2240 Shore OO
Purple
2
Customized
3.4
<0.1
-60~150
Compliant
8
>10¹¹
>10¹⁰
7
20
43
64
68
10.2
10.1
10.8
0.006
0.002
0.021
8.0
5.5
0.260
0.221
0.148
0.122
0.112
35
PROPERTY T-top81-s TEST METHOD UNIT
Coefficient of thermal expansion -236.67x10ˉ⁶ ASTM E228 1/K
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
PCB
Heat Sink
T-top81-s
High Thermal Conductive Gap Filler
T-top81-s
TYPICAL PROPERTIES
CONSTRUCTION
/ Thermal conductivity: 8.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance
FEATURES
/ Between CPU and heat sink
/ Between a component and heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
LiPOLY T-top81-s offers outstanding
thermal conductivity at 8.0 W/m*K
and extremely low thermal resistance under minimal force.
T-top81-s offers excellent compression, filling small air gaps on uneven
surfaces, ensuring an efficient and
consistent transfer of heat.
07
1.0 mm 2.0 mm 3.0 mm 1.0 mm 2.0 mm 3.0 mm
10 0.260 0.427 0.613 7 13 16
20 0.221 0.344 0.372 20 30 56
30 0.148 0.212 0.227 43 58 69
40 0.122 0.156 0.182 64 76 85
50 0.112 0.133 0.148 68 80 89
Compression Thermal Impedance (°C-in²/W) Compression (%)
Force (psi)
Initial 100 hrs 250 hrs 500 hrs
10 0.260 0.261 0.260 0.261 0.262
30 0.148 0.148 0.149 0.149 0.150
50 0.112 0.113 0.114 0.113 0.115
70°C
Compression Force (psi) Test
Property
Thermal
Resistance
Test
Property
Thermal
Resistance
Test
Property
Thermal
Resistance
Test
Property
Thermal
Resistance
Test
Property
Thermal
Resistance
Initial 100 hrs 250 hrs 500 hrs
10 0.260 0.261 0.262 0.261 0.262
30 0.148 0.149 0.150 0.149 0.151
50 0.112 0.114 0.113 0.113 0.114
Compression Force (psi)
150°C
Initial 100 hrs 250 hrs 500 hrs
10 0.260 0.260 0.259 0.260 0.259
30 0.148 0.149 0.148 0.149 0.149
50 0.112 0.113 0.112 0.112 0.111
Compression Force (psi)
60°C / 90%RH
0 Cycles 100 Cycles 200 Cycles 300 Cycles 400 Cycles 500 Cycles
10 0.260 0.260 0.261 0.260 0.261 0.261
30 0.148 0.149 0.148 0.150 0.149 0.150
50 0.112 0.113 0.112 0.113 0.113 0.114
Compression Force (psi) -40°C (30min) ←→ +125°C (30min)
Initial 100 hrs 200 hrs 300 hrs 400 hrs 500 hrs
10 0.260 0.260 0.261 0.260 0.261 0.260
30 0.148 0.147 0.148 0.147 0.148 0.148
50 0.112 0.111 0.112 0.112 0.112 0.111
Compression Force (psi)
Ultra Low Temperature -60°C
1000 hrs
1000 hrs
1000 hrs
THERMAL IMPEDANCE & COMPRESSION
RELIABILITY
Test method: ASTM D5470
Test method: ASTM D5470 , Specimen thickness = 1.0mm , Unit: °C-in²/W
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are
used as the definition standards for LiPOLY. Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality
required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the safety before using the material. We strongly recommend the purchaser pre-test the product and verify the
performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user. LiPOLY makes no warranty as to the suitability, merchantability, or
non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are sold in accordance
with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY
or its affiliates. Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
08
PCB
Heat Sink
T-work7000
Series
T-work7000
Characteristics
Silicone compound with
weak sticky surfaces.
Configurations
Sheets form,
Die-cuts parts
%
%
%
%
%
%
Visual
-
-
ASTM D374
ASTM D792
By LiPOLY
ASTM D149
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D257
ASTM D257
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
Color
Surface tack 2-side/1-side
Thickness
Density
TML
Application temperature
ELECTRICAL
COMPRESSION
Dielectric breakdown
Deflection @10 psi
Deflection @20 psi
Deflection @30 psi
Deflection @40 psi
Deflection @50 psi
Dielectric constant@10MHz Dk
Dielectric constant@1GHz Dk
Dielectric constant@1.8GHz Dk
Dielectric factor@10MHz Df
Dielectric factor@1GHz Df
Dielectric factor@1.8GHz Df
Surface resistivity
Volume resistivity
THERMAL
Thermal Conductivity
Thermal impedance@10psi
Thermal impedance@20psi
Thermal impedance@30psi
Thermal impedance@40psi
Thermal impedance@50psi
-
-
-
-
-
-
-
-
mm
g/cm³
°C
- -
KV/mm
Ohm
Ohm-m
W/m*K
Gray Green
2
Customized
3.4
<0.1
-60~150
ROHS & REACH Compliant
8
>10¹¹
>10¹⁰
14
24
47
55
59
10.4
10.4
11.6
0.007
0.001
0.021
11.0
Thermal Conductivity 6.5 ISO 22007-2 W/m*K
0.223
0.202
0.140
0.119
0.108
Hardness 65 ASTM D2240 Shore OOO
PROPERTY T-work7000 TEST METHOD UNIT
Coefficient of thermal expansion -244.48x10ˉ⁶ ASTM E228 1/K
/ Thermal conductivity: 11.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance
FEATURES
/ Between CPU and heat sink
/ Between a component and heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
TYPICAL PROPERTIES
LiPOLY T-work7000 offers outstand- CONSTRUCTION
ing thermal conductivity at 11.0
W/m*K and extremely low thermal
resistance under minimal force.
T-work7000 offers excellent compression, filling small air gaps on
uneven surfaces, ensuring an
efficient and consistent transfer of
heat.
High Thermal Conductive Gap Filler
T-work7000
09
1.0 mm 2.0 mm 3.0 mm 1.0 mm 2.0 mm 3.0 mm
10 0.223 0.388 0.579 14 15 16
20 0.202 0.327 0.341 24 34 57
30 0.140 0.200 0.216 47 60 71
40 0.119 0.146 0.172 55 69 77
50 0.108 0.127 0.139 59 73 81
Compression Thermal Impedance (°C-in²/W) Compression (%)
Force (psi)
Initial 100 hrs 250 hrs 500 hrs
10 0.223 0.224 0.223 0.224 0.225
30 0.140 0.141 0.141 0.141 0.142
50 0.108 0.110 0.109 0.109 0.111
70°C
Compression Force (psi)
Test
Property
Thermal
Resistance
Initial 100 hrs 250 hrs 500 hrs
10 0.223 0.224 0.225 0.224 0.225
30 0.140 0.142 0.143 0.142 0.143
50 0.108 0.110 0.111 0.109 0.108
Test
Property
Compression Force (psi)
150°C
Thermal
Resistance
Initial 100 hrs 250 hrs 500 hrs
0.223 0.222 0.223 0.222 0.221
0.140 0.141 0.142 0.149 0.141
0.108 0.109 0.108 0.108 0.107
Test
Property
Compression Force (psi)
60°C / 90%RH
Thermal
Resistance
0.223 0.223 0.224 0.223 0.224 0.223
0.140 0.142 0.141 0.142 0.143 0.143
0.108 0.109 0.110 0.110 0.109 0.110
Compression Force (psi)
Thermal
Resistance
Test -40°C (30min) ←→ +125°C (30min)
Property
0.223 0.222 0.223 0.223 0.224 0.223
0.140 0.141 0.142 0.142 0.143 0.141
0.108 0.111 0.109 0.110 0.109 0.110
Test
Property Compression Force (psi)
Ultra Low Temperature -60°C
Thermal
Resistance
Initial 100 hrs 200 hrs 300 hrs 400 hrs 500 hrs
0 Cycles 100 Cycles 200 Cycles 300 Cycles 400 Cycles 500 Cycles
10
30
50
10
30
50
10
30
50
1000 hrs
1000 hrs
1000 hrs
THERMAL IMPEDANCE & COMPRESSION
RELIABILITY
Test method: ASTM D5470
Test method: ASTM D5470 , Specimen thickness = 1.0mm , Unit: °C-in²/W
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are
used as the definition standards for LiPOLY. Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality
required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the safety before using the material. We strongly recommend the purchaser pre-test the product and verify the
performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user. LiPOLY makes no warranty as to the suitability, merchantability, or
non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are sold in accordance
with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY
or its affiliates. Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
10
Series
T-top91-s
Characteristics
Silicone compound with
weak sticky surfaces.
Configurations
Sheets form,
Die-cuts parts
%
%
%
%
%
%
Visual
-
-
ASTM D374
ASTM D792
By LiPOLY
ASTM D149
ASTM D257
ASTM D257
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
Color
Surface tack 2-side/1-side
Thickness
Density
TML
Application temperature
ELECTRICAL
COMPRESSION
Dielectric breakdown
Deflection @10 psi
Deflection @20 psi
Deflection @30 psi
Deflection @40 psi
Deflection @50 psi
Dielectric constant@10MHz Dk
Dielectric constant@1GHz Dk
Dielectric constant@1.8GHz Dk
Dielectric factor@10MHz Df
Dielectric factor@1GHz Df
Dielectric factor@1.8GHz Df
Surface resistivity
Volume resistivity
THERMAL
Thermal conductivity
Thermal impedance@10psi
Thermal impedance@20psi
Thermal impedance@30psi
Thermal impedance@40psi
Thermal impedance@50psi
-
-
-
-
-
-
-
-
mm
g/cm³
°C
- -
KV/mm
Ohm
Ohm-m
W/m*K
ROHS & REACH
Thermal Conductivity ISO 22007-2 W/m*K
Hardness ASTM D2240 Shore OOO
Gray Green
2
Customized
3.4
<0.1
-60~150
Compliant
8
>10¹¹
>10¹⁰
11
38
59
69
76
9.9
9.8
11.4
0.007
0.004
0.024
13.0
8.0
0.201
0.159
0.103
0.084
0.075
65
PROPERTY T-top91-s TEST METHOD UNIT
Coefficient of thermal expansion -179.04x10ˉ⁶ ASTM E228 1/K
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
PCB
Heat Sink
T-top91-s
High Thermal Conductive Gap Filler
T-top91-s
TYPICAL PROPERTIES
CONSTRUCTION
/ Thermal conductivity: 13.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance
FEATURES
/ Between CPU and heat sink
/ Between a component and
heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
LiPOLY T-top91-s offers outstanding
thermal conductivity at 13.0 W/m*K
and extremely low thermal resistance under minimal force.
T-top91-s offers excellent compression, filling small air gaps on uneven
surfaces, ensuring an efficient and
consistent transfer of heat.
11
1.0 mm 2.0 mm 3.0 mm 1.0 mm 2.0 mm 3.0 mm
10 0.201 0.355 0.418 11 17 23
20 0.159 0.290 0.283 38 40 64
30 0.103 0.169 0.183 59 64 79
40 0.084 0.141 0.156 69 73 82
50 0.075 0.118 0.126 76 75 85
Compression Thermal Impedance (°C-in²/W) Compression (%)
Force (psi)
Initial 100 hrs 250 hrs 500 hrs
10 0.201 0.201 0.201 0.202 0.202
30 0.103 0.103 0.104 0.103 0.104
50 0.075 0.075 0.075 0.076 0.076
70°C
Compression Force (psi) Test
Property
Thermal
Resistance
Test
Property
Thermal
Resistance
Test
Property
Thermal
Resistance
Test
Property
Thermal
Resistance
Test
Property
Thermal
Resistance
Initial 100 hrs 250 hrs 500 hrs
10 0.201 0.201 0.202 0.202 0.202
30 0.103 0.103 0.104 0.103 0.105
50 0.075 0.075 0.076 0.077 0.077
Compression Force (psi)
150°C
Initial 100 hrs 250 hrs 500 hrs
10 0.201 0.201 0.202 0.202 0.202
30 0.103 0.103 0.104 0.103 0.104
50 0.075 0.075 0.075 0.076 0.076
Compression Force (psi)
60°C / 90%RH
0 Cycles 100 Cycles 200 Cycles 300 Cycles 400 Cycles 500 Cycles
10 0.201 0.202 0.202 0.203 0.203 0.203
30 0.103 0.103 0.104 0.104 0.105 0.105
50 0.075 0.075 0.075 0.076 0.075 0.076
Compression Force (psi) -40°C (30min) ←→ +125°C (30min)
Initial 100 hrs 200 hrs 300 hrs 400 hrs 500 hrs
10 0.201 0.202 0.202 0.203 0.203 0.202
30 0.103 0.103 0.103 0.104 0.104 0.104
50 0.075 0.075 0.076 0.076 0.075 0.076
Compression Force (psi)
Ultra Low Temperature -60°C
1000 hrs
1000 hrs
1000 hrs
THERMAL IMPEDANCE & COMPRESSION
RELIABILITY
Test method: ASTM D5470
Test method: ASTM D5470 , Specimen thickness = 1.0mm , Unit: °C-in²/W
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are
used as the definition standards for LiPOLY. Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality
required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the safety before using the material. We strongly recommend the purchaser pre-test the product and verify the
performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user. LiPOLY makes no warranty as to the suitability, merchantability, or
non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are sold in accordance
with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY
or its affiliates. Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
12
PCB
Heat Sink
T-work8000
Series
T-work8000
Characteristics
Silicone compound with
weak sticky surfaces.
Configurations
Sheets form,
Die-cuts parts
%
%
%
%
%
%
TEST METHOD
Visual
-
-
ASTM D374
ASTM D792
By LiPOLY
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D149
ASTM D257
ASTM D257
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
ASTM E228
PROPERTY
Color
Surface tack 2-side/1-side
Thickness
Density
TML
Application temperature
ELECTRICAL
COMPRESSION
Dielectric breakdown
Deflection @10 psi
Deflection @20 psi
Deflection @30 psi
Deflection @40 psi
Deflection @50 psi
Dielectric constant@10MHz Dk
Dielectric constant@1GHz Dk
Dielectric constant@1.8GHz Dk
Dielectric factor@10MHz Df
Dielectric factor@1GHz Df
Dielectric factor@1.8GHz Df
Surface resistivity
Volume resistivity
THERMAL
Thermal Conductivity
Thermal impedance@10psi
Thermal impedance@20psi
Thermal impedance@30psi
Thermal impedance@40psi
Thermal impedance@50psi
Coefficient of thermal expansion
UNIT
-
-
-
-
-
-
-
-
mm
g/cm³
°C
- -
KV/mm
Ohm
Ohm-m
W/m*K
1/K
T-work8000
Purple
2
Customized
3.3
<0.1
-60~150
ROHS & REACH Compliant
8
>10¹¹
>10¹⁰
10
42
64
71
79
9.4
9.3
10.3
0.006
0.009
0.028
15.0
Thermal Conductivity 9.0 ISO 22007-2 W/m*K
0.185
0.122
0.074
0.054
0.046
-89.56x10ˉ⁶
Hardness 65 ASTM D2240 Shore OOO
TYPICAL PROPERTIES
CONSTRUCTION
/ Thermal conductivity: 15.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance
FEATURES
/ Between CPU and heat sink
/ Between a component and heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
LiPOLY T-work8000 offers outstanding thermal conductivity at 15.0
W/m*K and extremely low thermal
resistance under minimal force.
T-work8000 offers excellent compression, filling small air gaps on
uneven surfaces, ensuring an
efficient and consistent transfer of
heat.
High Thermal Conductive Gap Filler
T-work8000
13
1.0 mm 2.0 mm 3.0 mm 1.0 mm 2.0 mm 3.0 mm
10 0.185 0.293 0.335 10 20 41
20 0.122 0.167 0.174 42 60 72
30 0.074 0.106 0.115 64 74 82
40 0.054 0.076 0.083 71 82 87
50 0.046 0.059 0.064 79 86 90
Compression Thermal Impedance (°C-in²/W) Compression (%)
Force (psi)
Initial 100 hrs 250 hrs 500 hrs
10 0.185 0.183 0.184 0.185 0.187
30 0.074 0.076 0.076 0.075 0.077
50 0.046 0.048 0.047 0.046 0.048
70°C
Compression Force (psi)
Test
Property
Thermal
Resistance
Initial 100 hrs 250 hrs 500 hrs
10 0.185 0.186 0.187 0.186 0.187
30 0.074 0.076 0.077 0.077 0.078
50 0.046 0.048 0.047 0.047 0.048
Test
Property
Compression Force (psi)
150°C
Thermal
Resistance
Initial 100 hrs 250 hrs 500 hrs
0.185 0.186 0.185 0.184 0.183
0.074 0.076 0.077 0.076 0.075
0.046 0.047 0.046 0.045 0.045
Test
Property
Compression Force (psi)
60°C / 90%RH
Thermal
Resistance
0.185 0.183 0.184 0.186 0.185 0.186
0.074 0.073 0.074 0.077 0.076 0.076
0.046 0.047 0.045 0.048 0.047 0.047
Compression Force (psi)
Thermal
Resistance
-40°C (30min) ←→ +125°C (30min) Test
Property
0.185 0.186 0.185 0.184 0.185 0.186
0.074 0.075 0.075 0.073 0.074 0.075
0.046 0.047 0.046 0.045 0.047 0.047
Test
Property
Compression Force (psi)
Ultra Low Temperature -60°C
Thermal
Resistance
Initial 100 hrs 200 hrs 300 hrs 400 hrs 500 hrs
0 Cycles 100 Cycles 200 Cycles 300 Cycles 400 Cycles 500 Cycles
10
30
50
10
30
50
10
30
50
1000 hrs
1000 hrs
1000 hrs
THERMAL IMPEDANCE & COMPRESSION
RELIABILITY
Test method: ASTM D5470
Test method: ASTM D5470 , Specimen thickness = 1.0mm , Unit: °C-in²/W
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are
used as the definition standards for LiPOLY. Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality
required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the safety before using the material. We strongly recommend the purchaser pre-test the product and verify the
performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user. LiPOLY makes no warranty as to the suitability, merchantability, or
non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are sold in accordance
with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY
or its affiliates. Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
14
Series
T-top98-s
Characteristics
Silicone compound with
weak sticky surfaces.
Configurations
Sheets form,
Die-cuts parts
%
%
%
%
%
%
Visual
-
-
ASTM D374
ASTM D792
By LiPOLY
ASTM D149
ASTM D257
ASTM D257
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
Color
Surface tack 2-side/1-side
Thickness
Density
TML
Application temperature
ELECTRICAL
COMPRESSION
Dielectric breakdown
Deflection @10 psi
Deflection @20 psi
Deflection @30 psi
Deflection @40 psi
Deflection @50 psi
Dielectric constant@10MHz Dk
Dielectric constant@1GHz Dk
Dielectric constant@1.8GHz Dk
Dielectric factor@10MHz Df
Dielectric factor@1GHz Df
Dielectric factor@1.8GHz Df
Surface resistivity
Volume resistivity
THERMAL
Thermal conductivity
Thermal impedance@10psi
Thermal impedance@20psi
Thermal impedance@30psi
Thermal impedance@40psi
Thermal impedance@50psi
-
-
-
-
-
-
-
-
mm
g/cm³
°C
- -
KV/mm
Ohm
Ohm-m
W/m*K
ROHS & REACH
Thermal Conductivity ISO 22007-2 W/m*K
Hardness ASTM D2240 Shore OOO
Purple
2
Customized
3.3
<0.1
-60~150
Compliant
8
>10¹¹
>10¹⁰
11
38
62
71
77
10.0
9.9
10.3
0.003
0.007
0.025
18.0
10.5
0.149
0.104
0.061
0.046
0.039
65
PROPERTY T-top98-s TEST METHOD UNIT
Coefficient of thermal expansion -312.13x10ˉ⁶ ASTM E228 1/K
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
PCB
Heat Sink
T-top98-s
High Thermal Conductive Gap Filler
T-top98-s
TYPICAL PROPERTIES
CONSTRUCTION
/ Thermal conductivity: 18.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance
FEATURES
/ Between CPU and heat sink
/ Between a component and
heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
LiPOLY T-top98-s offers outstanding thermal conductivity at 18.0
W/m*K and extremely low thermal
resistance under minimal force.
T-top98-s offers excellent compression, filling small air gaps on
uneven surfaces, ensuring an
efficient and consistent transfer of
heat.
15
1.0 mm 2.0 mm 3.0 mm 1.0 mm 2.0 mm 3.0 mm
10 0.149 0.247 0.304 11 20 39
20 0.104 0.138 0.156 38 58 71
30 0.061 0.085 0.080 62 75 82
40 0.046 0.064 0.065 71 83 87
50 0.039 0.046 0.054 77 86 90
Compression Thermal Impedance (°C-in²/W) Compression (%)
Force (psi)
Initial 100 hrs 250 hrs 500 hrs
10 0.149 0.148 0.149 0.148 0.149
30 0.061 0.061 0.061 0.062 0.062
50 0.039 0.039 0.038 0.038 0.039
70°C
Compression Force (psi) Test
Property
Thermal
Resistance
Test
Property
Thermal
Resistance
Test
Property
Thermal
Resistance
Test
Property
Thermal
Resistance
Test
Property
Thermal
Resistance
Initial 100 hrs 250 hrs 500 hrs
10 0.149 0.148 0.149 0.149 0.150
30 0.061 0.061 0.061 0.062 0.062
50 0.039 0.039 0.039 0.040 0.040
Compression Force (psi)
150°C
Initial 100 hrs 250 hrs 500 hrs
10 0.149 0.148 0.149 0.148 0.149
30 0.061 0.061 0.060 0.061 0.061
50 0.039 0.039 0.038 0.040 0.040
Compression Force (psi)
60°C / 90%RH
0 Cycles 100 Cycles 200 Cycles 300 Cycles 400 Cycles 500 Cycles
10 0.149 0.148 0.149 0.148 0.149 0.148
30 0.061 0.060 0.061 0.060 0.061 0.061
50 0.039 0.038 0.039 0.038 0.038 0.039
Compression Force (psi) -40°C (30min) ←→ +125°C (30min)
Initial 100 hrs 200 hrs 300 hrs 400 hrs 500 hrs
10 0.149 0.148 0.148 0.148 0.149 0.149
30 0.061 0.060 0.061 0.060 0.061 0.061
50 0.039 0.039 0.038 0.039 0.040 0.040
Compression Force (psi)
Ultra Low Temperature -60°C
1000 hrs
1000 hrs
1000 hrs
THERMAL IMPEDANCE & COMPRESSION
RELIABILITY
Test method: ASTM D5470
Test method: ASTM D5470 , Specimen thickness = 1.0mm , Unit: °C-in²/W
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are
used as the definition standards for LiPOLY. Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality
required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the safety before using the material. We strongly recommend the purchaser pre-test the product and verify the
performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user. LiPOLY makes no warranty as to the suitability, merchantability, or
non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are sold in accordance
with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY
or its affiliates. Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
16
PCB
Heat Sink
T-work9000
Series
T-work9000
Characteristics
Silicone compound with
weak sticky surfaces.
Configurations
Sheets form,
Die-cuts parts
%
%
%
%
%
%
Visual
-
-
ASTM D374
ASTM D792
By LiPOLY
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D5470 modify
ASTM D149
ASTM D257
ASTM D257
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D150
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
ASTM D5470
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
Color
Surface tack 2-side/1-side
Thickness
Density
TML
Application temperature
ELECTRICAL
COMPRESSION
Dielectric breakdown
Deflection @10 psi
Deflection @20 psi
Deflection @30 psi
Deflection @40 psi
Deflection @50 psi
Dielectric constant@10MHz Dk
Dielectric constant@1GHz Dk
Dielectric constant@1.8GHz Dk
Dielectric factor@10MHz Df
Dielectric factor@1GHz Df
Dielectric factor@1.8GHz Df
Surface resistivity
Volume resistivity
THERMAL
Thermal Conductivity
Thermal impedance@10psi
Thermal impedance@20psi
Thermal impedance@30psi
Thermal impedance@40psi
Thermal impedance@50psi
-
-
-
-
-
-
-
-
mm
g/cm³
°C
- -
KV/mm
Ohm
Ohm-m
W/m*K
Brown
2
Customized
3.3
<0.1
-60~150
ROHS & REACH Compliant
8
>10¹¹
>10¹⁰
12
27
58
71
74
10.5
10.4
11.2
0.001
0.006
0.022
20.0
Thermal Conductivity 12.0 ISO 22007-2 W/m*K
0.110
0.088
0.050
0.037
0.031
Hardness 65 ASTM D2240 Shore OOO
TEST METHOD
Coefficient of thermal expansion -538.70x10ˉ⁶ ASTM E228 1/K
PROPERTY T-work9000 UNIT
TYPICAL PROPERTIES
CONSTRUCTION
/ Thermal conductivity: 20.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance
FEATURES
/ Between CPU and heat sink
/ Between a component and heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0
W/m*K and extremely low thermal
resistance under minimal force.
T-work9000 offers excellent compression, filling small air gaps on
uneven surfaces, ensuring an
efficient and consistent transfer of
heat.
High Thermal Conductive Gap Filler
T-work9000
17
1.0 mm 2.0 mm 3.0 mm 1.0 mm 2.0 mm 3.0 mm
10 0.110 0.201 0.255 12 21 31
20 0.088 0.105 0.120 27 55 68
30 0.050 0.056 0.064 58 78 83
40 0.037 0.039 0.042 71 85 89
50 0.031 0.033 0.035 74 86 90
Compression Thermal Impedance (°C-in²/W) Compression (%)
Force (psi)
Initial 100 hrs 250 hrs 500 hrs 1000 hrs
10 0.110 0.111 0.112 0.112 0.113
30 0.050 0.051 0.052 0.052 0.053
50 0.031 0.031 0.032 0.032 0.033
70°C
Compression Force (psi)
Test
Property
Thermal
Resistance
Initial 100 hrs 250 hrs 500 hrs 1000 hrs
10 0.110 0.111 0.112 0.113 0.113
30 0.050 0.051 0.052 0.053 0.053
50 0.031 0.032 0.032 0.033 0.033
Test
Property
Compression Force (psi)
150°C
Thermal
Resistance
Initial 100 hrs 250 hrs 500 hrs 1000 hrs
0.110 0.111 0.112 0.113 0.113
0.050 0.051 0.052 0.053 0.053
0.031 0.032 0.032 0.033 0.033
Test
Property
Compression Force (psi)
60°C / 90%RH
Thermal
Resistance
0.110 0.110 0.111 0.112 0.113 0.113
0.050 0.050 0.051 0.052 0.052 0.053
0.031 0.032 0.031 0.032 0.032 0.033
Compression Force (psi)
Thermal
Resistance
Tes -40°C (30min) ←→ +125°C (30min) t
Property
0.110 0.110 0.111 0.110 0.111 0.110
0.050 0.051 0.050 0.051 0.050 0.050
0.031 0.031 0.032 0.032 0.032 0.031
Test
Property
Compression Force (psi)
Ultra Low Temperature -60°C
Thermal
Resistance
0 Cycles 100 Cycles 200 Cycles 300 Cycles 400 Cycles 500 Cycles
10
30
50
10
30
50
10
30
50
Initial 100 hrs 200 hrs 300 hrs 400 hrs 500 hrs
THERMAL IMPEDANCE & COMPRESSION
RELIABILITY
Test method: ASTM D5470
Test method: ASTM D5470 , Specimen thickness = 1.0mm , Unit: °C-in²/W
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are
used as the definition standards for LiPOLY. Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality
required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the safety before using the material. We strongly recommend the purchaser pre-test the product and verify the
performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user. LiPOLY makes no warranty as to the suitability, merchantability, or
non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are sold in accordance
with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY
or its affiliates. Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
18
PROPERTY PK223 TEST METHOD UNIT
Color White Visual -
Surface tack 2-side/1-side 2 - -
- -
Thickness Customized ASTM D374
Density 2.1 ASTM D792 g/cm³
mm
Hardness 30 ASTM D2240 Shore OO
Application temperature -60~180
ROHS & REACH Compliant
- °C
COMPRESSION@1.0mm
Deflection @10 psi 33 ASTM D5470 modify %
Deflection @20 psi 38 ASTM D5470 modify %
Deflection @30 psi 42 ASTM D5470 modify %
Deflection @40 psi 45 ASTM D5470 modify %
Deflection @50 psi 48 ASTM D5470 modify %
ELECTRICAL
Dielectric breakdown 11 ASTM D149 KV/mm
Surface resistivity >10¹⁰ ASTM D257 Ohm
Volume resistivity >10¹⁰ ASTM D257 Ohm-m
THERMAL
Thermal Conductivity 2.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.711 ASTM D5470
Thermal impedance@20 psi 0.664 ASTM D5470
Thermal impedance@40 psi 0.595 ASTM D5470
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
Thermal impedance@30 psi 0.633 ASTM D5470
Thermal impedance@50 psi 0.572 ASTM D5470
/ Thermal conductivity: 2.0 W/m*K
/ Naturally tacky for ease of
manufacture
/ Low thermal impedance
/ Available in a range of
thicknesses
FEATURES
/ Notebook computers
/ Heat pipe assemblies
/ Memory modules
/ TV hardware
/ Automotive electronics
/ Mobile devices
/ High speed mass storage drives
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS Thermal Resistance vs. Pressure vs. Deflection
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
LiPOLY PK223 is a material TYPICAL PROPERTIES
designed for gap filling. The
thermal conductivity is 2.0
W/m*K. The hardness is Shore
OO/30 with high flexibility, high
compressibility, high insulating,
great self-adhesive, which can
cover the tolerance of design
making it very stable. It also
offers customized shape molding
service.
Thermal Conductive Gel Pad
PK223
19
PROPERTY PK404 TEST METHOD UNIT
Color Blue Visual -
Surface tack 2-side/1-side 2 - -
Thickness Customized ASTM D374 mm
Density 2.8 ASTM D792 g/cm³
Hardness 30 ASTM D2240 Shore OO
Application temperature -60~180 - °C
ROHS & REACH Compliant - -
COMPRESSION@1.0mm
Deflection @10 psi 21 ASTM D5470 modify %
Deflection @20 psi 27 ASTM D5470 modify %
Deflection @30 psi 36 ASTM D5470 modify %
Deflection @40 psi 41 ASTM D5470 modify %
Deflection @50 psi 46 ASTM D5470 modify %
ELECTRICAL
Dielectric breakdown 12 ASTM D149 KV/mm
Surface resistivity >10¹⁰ ASTM D257 Ohm
Volume resistivity >10¹⁰ ASTM D257 Ohm-m
THERMAL
Thermal Conductivity 4.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.502 ASTM D5470 °C-in²/ W
Thermal impedance@20 psi 0.452 ASTM D5470 °C-in²/ W
Thermal impedance@30 psi 0.423 ASTM D5470 °C-in²/ W
Thermal impedance@50 psi 0.361 ASTM D5470 °C-in²/ W
Thermal impedance@40 psi 0.380 ASTM D5470 °C-in²/ W
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
/ Thermal conductivity: 4.0 W/m*K
/ Naturally tacky for ease of
manufacture
/ Low thermal impedance
/ Available in a range of
thicknesses
FEATURES
/ Notebook computers
/ Heat pipe assemblies
/ Memory modules
/ TV hardware
/ Automotive electronics
/ Mobile devices
/ High speed mass storage drives
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
LiPOLY PK404 is a material
designed for gap filling. The
thermal conductivity is 4.0
W/m*K. The hardness is Shore
OO/30 with high flexibility, high
compressibility, high insulating,
great self-adhesive, which can
cover the tolerance of design
making it very stable. It also
offers customized shape molding
service.
Thermal Conductive Gel Pad
PK404
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
20
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
PROPERTY PK504 TEST METHOD UNIT
Color Gray Visual -
Surface tack 2-side/1-side 2 - -
- -
Thickness Customized ASTM D374
Density 3.0 ASTM D792 g/cm³
mm
Hardness 50 ASTM D2240 Shore OO
Application temperature -60~180
ROHS & REACH Compliant
- °C
COMPRESSION@1.0mm
Deflection @10 psi 13 ASTM D5470 modify %
Deflection @20 psi 17 ASTM D5470 modify %
Deflection @30 psi 22 ASTM D5470 modify %
Deflection @40 psi 27 ASTM D5470 modify %
Deflection @50 psi 31 ASTM D5470 modify %
ELECTRICAL
Dielectric breakdown 12 ASTM D149 KV/mm
Surface resistivity >10¹¹ ASTM D257 Ohm
Volume resistivity >10¹⁰ ASTM D257 Ohm-m
THERMAL
Thermal Conductivity 5.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.415 ASTM D5470
Thermal impedance@20 psi 0.393 ASTM D5470
Thermal impedance@40 psi 0.336 ASTM D5470
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
Thermal impedance@30 psi 0.358 ASTM D5470
Thermal impedance@50 psi 0.307 ASTM D5470
Thermal Resistance vs. Pressure vs. Deflection
/ Thermal conductivity: 5.0 W/m*K
/ Naturally tacky for ease of
manufacture
/ Low thermal impedance
/ Available in a range of
thicknesses
FEATURES
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
LiPOLY PK504 is a material
designed for gap filling. The
thermal conductivity is 5.0
W/m*K. The hardness is Shore
OO/50 with high flexibility, high
compressibility, high insulating,
great self-adhesive, which can
cover the tolerance of design
making it very stable. It also
offers customized shape molding
service.
/ Notebook computers
/ Heat pipe assemblies
/ Memory modules
/ TV hardware
/ Automotive electronics
/ Mobile devices
/ High speed mass storage drives
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
TYPICAL PROPERTIES
Thermal Conductive Gel Pad
PK504
21
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
PROPERTY PK605 TEST METHOD UNIT
Color Red Visual -
Surface tack 2-side/1-side 2 - -
Thickness Customized ASTM D374
Density 3.2 ASTM D792 g/cm³
mm
Hardness 60 ASTM D2240 Shore OO
Application temperature -60~180 - °C
ROHS & REACH Compliant - -
COMPRESSION@1.0mm
Deflection @10 psi 8 ASTM D5470 modify %
Deflection @20 psi 12 ASTM D5470 modify %
Deflection @30 psi 14 ASTM D5470 modify %
Deflection @40 psi 17 ASTM D5470 modify %
Deflection @50 psi 19 ASTM D5470 modify %
ELECTRICAL
Dielectric breakdown 12 ASTM D149 KV/mm
Surface resistivity >10¹¹ ASTM D257 Ohm
Volume resistivity >10¹⁰ ASTM D257 Ohm-m
THERMAL
Thermal Conductivity 6.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.371 ASTM D5470 °C-in²/ W
Thermal impedance@20 psi 0.341 ASTM D5470 °C-in²/ W
Thermal impedance@30 psi 0.323 ASTM D5470 °C-in²/ W
Thermal impedance@50 psi 0.262 ASTM D5470 °C-in²/ W
Thermal impedance@40 psi 0.294 ASTM D5470 °C-in²/ W
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
/ Thermal conductivity: 6.0 W/m*K
/ Naturally tacky for ease of
manufacture
/ Low thermal impedance
/ Available in a range of
thicknesses
FEATURES
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
LiPOLY PK605 is a material
designed for gap filling. The
thermal conductivity is 6.0
W/m*K. The hardness is Shore
OO/60 with high flexibility, high
compressibility, high insulating,
great self-adhesive, which can
cover the tolerance of design
making it very stable. It also
offers customized shape molding
service.
/ Notebook computers
/ Heat pipe assemblies
/ Memory modules
/ TV hardware
/ Automotive electronics
/ Mobile devices
/ High speed mass storage drives
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
Thermal Conductive Gel Pad
PK605
22
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
PROPERTY PK700 TEST METHOD UNIT
Color Gray Visual -
Surface tack 2-side/1-side 2 - -
- -
Thickness Customized ASTM D374
Density 3.3 ASTM D792 g/cm³
mm
Hardness 55 ASTM D2240 Shore OO
Application temperature -60~180
ROHS & REACH Compliant
- °C
COMPRESSION@1.0mm
Deflection @10 psi 9 ASTM D5470 modify %
Deflection @20 psi 14 ASTM D5470 modify %
Deflection @30 psi 19 ASTM D5470 modify %
Deflection @40 psi 23 ASTM D5470 modify %
Deflection @50 psi 26 ASTM D5470 modify %
ELECTRICAL
Dielectric breakdown 12 ASTM D149 KV/mm
Surface resistivity >10¹¹ ASTM D257 Ohm
Volume resistivity >10¹⁰ ASTM D257 Ohm-m
THERMAL
Thermal Conductivity 7.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.321 ASTM D5470
Thermal impedance@20 psi 0.288 ASTM D5470
Thermal impedance@40 psi 0.233 ASTM D5470
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
Thermal impedance@30 psi 0.254 ASTM D5470
Thermal impedance@50 psi 0.210 ASTM D5470
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
/ Thermal conductivity: 7.0 W/m*K
/ Naturally tacky for ease of
manufacture
/ Low thermal impedance
/ Available in a range of
thicknesses
FEATURES
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
LiPOLY PK700 is a material
designed for gap filling. The
thermal conductivity is 7.0
W/m*K. The hardness is Shore
OO/55 with high flexibility, high
compressibility, high insulating,
great self-adhesive, which can
cover the tolerance of design
making it very stable. It also
offers customized shape molding
service.
/ Notebook computers
/ Heat pipe assemblies
/ Memory modules
/ TV hardware
/ Automotive electronics
/ Mobile devices
/ High speed mass storage drives
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
Thermal Conductive Gel Pad
PK700
23
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
PCB
Heat Sink
BS75K
PROPERTY BS75K TEST METHOD UNIT
Color Dark Gray Visual -
Surface tack 2-side/1-side 2 - -
- -
Thickness Customized ASTM D374
Density 2.6 ASTM D792 g/cm³
mm
Hardness 18 ASTM D2240 Shore OO
Application temperature -60~180
ROHS & REACH Compliant
- °C
COMPRESSION@1.0mm
Deflection @10 psi 35 ASTM D5470 modify %
Deflection @20 psi 39 ASTM D5470 modify %
Deflection @30 psi 43 ASTM D5470 modify %
Deflection @40 psi 46 ASTM D5470 modify %
Deflection @50 psi 48 ASTM D5470 modify %
ELECTRICAL
Dielectric breakdown 12 ASTM D149 KV/mm
Surface resistivity >10¹⁰ ASTM D257 Ohm
Volume resistivity >10¹¹ ASTM D257 Ohm-m
THERMAL
Thermal Conductivity 3.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.562 ASTM D5470
Thermal impedance@20 psi 0.543 ASTM D5470
Thermal impedance@40 psi 0.485 ASTM D5470
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
Thermal impedance@30 psi 0.504 ASTM D5470
Thermal impedance@50 psi 0.463 ASTM D5470
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
/ Thermal conductivity: 3.0 W/m*K
/ High compression rate
/ Low thermal impedance
/ High recovery
/ Available in a range of
thicknesses
FEATURES
/ Between CPU and heat sink
/ Between a component and
heat sink
/ Notebook computers
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
LiPOLY BS75K is an ultra-soft
thermally conductive gel pad with
a thermal conductivity of 3.0
W/m*K.BS75K offers excellent
compression under minimal force
with high recovery characteristics. This product can be supplied
as standard sheets, custom
die-cuts or custom molded parts.
Exceptionally Soft Thermal Conductive Gel Pad
BS75K
24
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
PCB
Heat Sink
BS87-s
PROPERTY BS87-s TEST METHOD UNIT
Color Gray Visual -
Surface tack 2-side/1-side 2 - -
- -
Thickness Customized ASTM D374
Density 2.8 ASTM D792 g/cm³
mm
Hardness 10 ASTM D2240 Shore OO
Application temperature -60~180
ROHS & REACH Compliant
- °C
COMPRESSION@1.0mm
Deflection @10 psi 42 ASTM D5470 modify %
Deflection @20 psi 54 ASTM D5470 modify %
Deflection @30 psi 62 ASTM D5470 modify %
Deflection @40 psi 67 ASTM D5470 modify %
Deflection @50 psi 71 ASTM D5470 modify %
ELECTRICAL
Dielectric breakdown 12 ASTM D149 KV/mm
Surface resistivity >10¹¹ ASTM D257 Ohm
Volume resistivity >10¹⁰ ASTM D257 Ohm-m
THERMAL
Thermal Conductivity 3.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.502 ASTM D5470
Thermal impedance@20 psi 0.433 ASTM D5470
Thermal impedance@40 psi 0.332 ASTM D5470
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
Thermal impedance@30 psi 0.374 ASTM D5470
Thermal impedance@50 psi 0.301 ASTM D5470
/ Thermal conductivity: 3.0 W/m*K
/ High compression rate
/ Low thermal impedance
/ High recovery
/ Available in a range of
thicknesses
FEATURES
/ Between CPU and heat sink
/ Between a component and
heat sink
/ Notebook computers
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
LiPOLY BS87-s is an ultra-soft TYPICAL PROPERTIES
thermally conductive gel pad with
a thermal conductivity of 3.0
W/m*K.BS87-s offers excellent
compression under minimal force
with high recovery characteristics. This product can be supplied
as standard sheets, custom
die-cuts or custom molded parts.
Thermal Resistance vs. Pressure vs. Deflection
Exceptionally Soft Thermal Conductive Gel Pad
BS87-s
25
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
PCB
Heat Sink
BS89
PROPERTY BS89 TEST METHOD UNIT
Color Gray Visual -
Surface tack 2-side/1-side 2 - -
- -
Thickness Customized ASTM D374
Density 3.0 ASTM D792 g/cm³
mm
Hardness 25 ASTM D2240 Shore OO
Application temperature -60~180
ROHS & REACH Compliant
- °C
COMPRESSION@1.0mm
Deflection @10 psi 29 ASTM D5470 modify %
Deflection @20 psi 39 ASTM D5470 modify %
Deflection @30 psi 47 ASTM D5470 modify %
Deflection @40 psi 52 ASTM D5470 modify %
Deflection @50 psi 56 ASTM D5470 modify %
ELECTRICAL
Dielectric breakdown 12 ASTM D149 KV/mm
Surface resistivity >10¹¹ ASTM D257 Ohm
Volume resistivity >10¹⁰ ASTM D257 Ohm-m
THERMAL
Thermal Conductivity 5.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.318 ASTM D5470
Thermal impedance@20 psi 0.266 ASTM D5470
Thermal impedance@40 psi 0.211 ASTM D5470
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
°C-in²/ W
Thermal impedance@30 psi 0.233 ASTM D5470
Thermal impedance@50 psi 0.194 ASTM D5470
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
/ Thermal conductivity: 5.0 W/m*K
/ High compression rate
/ Low thermal impedance
/ High recovery
/ Available in a range of
thicknesses
FEATURES
/ Between CPU and heat sink
/ Between a component and
heat sink
/ Notebook computers
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
LiPOLY BS89 is an ultra-soft
thermally conductive gel pad with
a thermal conductivity of 5.0
W/m*K.BS89 offers excellent
compression under minimal force
with high recovery characteristics. This product can be supplied
as standard sheets, custom
die-cuts or custom molded parts.
Exceptionally Soft Thermal Conductive Gel Pad
BS89
26
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
PROPERTY S282-s TEST METHOD UNIT
Color Pink Visual -
Surface tack 2-side/1-side 1 - -
Reinforced layer Fiberglass - -
Thickness Customized ASTM D374
Density 2.6 ASTM D792 g/cm³
mm
Hardness 18 ASTM D2240 Shore OO
Application temperature -60~180 - °C
ROHS & REACH Compliant - -
COMPRESSION@1.0mm
Deflection @10 psi 5 ASTM D5470 modify %
Deflection @20 psi 7 ASTM D5470 modify %
Deflection @30 psi 10 ASTM D5470 modify %
Deflection @40 psi 13 ASTM D5470 modify %
Deflection @50 psi 15 ASTM D5470 modify %
ELECTRICAL
Dielectric breakdown 12 ASTM D149 KV/mm
Surface resistivity >10¹⁰ ASTM D257 Ohm
Volume resistivity >10¹¹ ASTM D257 Ohm-m
THERMAL
Thermal Conductivity 2.5 ASTM D5470 W/m*K
Thermal impedance@10 psi 1.094 ASTM D5470 °C-in²/ W
Thermal impedance@20 psi 1.052 ASTM D5470 °C-in²/ W
Thermal impedance@30 psi 0.993 ASTM D5470 °C-in²/ W
Thermal impedance@50 psi 0.941 ASTM D5470 °C-in²/ W
Thermal impedance@40 psi 0.952 ASTM D5470 °C-in²/ W
PCB
Heat Sink
S282-s
/ Thermal conductivity: 2.5 W/m*K
/ Designed for manufacturing
/ High dielectric breakdown
/ Shock and vibration absorber
/ Good mechanical strength
/ Fiberglass reinforced
FEATURES
/ Between a component and
heat sink
/ Flat-panel displays
/ LED, HDDs, DVDs
/ Heat pipe assemblies
/ Memory modules
/ Power supplies
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
Thermal Resistance vs. Pressure vs. Deflection
LiPOLY S282-s is a thermally TYPICAL PROPERTIES
conductive pad designed for gap
filling. The thermal conductivity is
2.5 W/m*K. Using fiberglass
reinforced layer and great self-adhesive which can fit closely with
non-flat heat sinks to increase
the contact area. S282-s is an
excellent insulating material with
characteristics of low stress
damped vibration and shock
absorption.
Exceptionally Soft Thermal Conductive Gel Pad
S282-s
27
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
PROPERTY AS200-s TEST METHOD UNIT
Color Gray Visual -
Surface tack 2-side/1-side 2 - -
Thickness Customized ASTM D374
Density 2.2 ASTM D792 g/cm³
mm
Hardness 35 ASTM D2240 Shore OO
Application temperature -60~180 - °C
ROHS & REACH Compliant - -
COMPRESSION@1.0mm
Deflection @10 psi 10 ASTM D5470 modify %
Deflection @20 psi 17 ASTM D5470 modify %
Deflection @30 psi 26 ASTM D5470 modify %
Deflection @40 psi 35 ASTM D5470 modify %
Deflection @50 psi 39 ASTM D5470 modify %
ELECTRICAL
Dielectric breakdown 12 ASTM D149 KV/mm
Surface resistivity >10¹⁰ ASTM D257 Ohm
Volume resistivity >10¹¹ ASTM D257 Ohm-m
THERMAL
Thermal Conductivity 2.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.892 ASTM D5470 °C-in²/ W
Thermal impedance@20 psi 0.824 ASTM D5470 °C-in²/ W
Thermal impedance@30 psi 0.783 ASTM D5470 °C-in²/ W
Thermal impedance@50 psi 0.704 ASTM D5470 °C-in²/ W
Thermal impedance@40 psi 0.731 ASTM D5470 °C-in²/ W
Oil Absorbing Sheet 1mm oil bleed width
AS200-s
50% Compression
Silicone Oil
/ Size 30*30mm²
/ Thickness 1.0mm
/ Compression 50%
/ Temperature 25℃
/ Time 120h
OIL BLEEDING
Thermal Resistance vs. Pressure vs. Deflection
LiPOLY AS200-s is a material TYPICAL PROPERTIES
designed for gap filling. The
thermal conductivity is 2.0 W/m*K.
The hardness is Shore OO/35, with
high flexibility and compressibility.
AS200-s has ultra-low oil bleeding
properties, which helps reduce
pollutants from silicon oil, keeping
electronic components clean.
/ Thermal conductivity:2.0 W/m*K
/ High compressibility
/ Low oil-bleeding
/ Naturally tacky and high
resilience
FEATURES
/ Notebook computers
/ Heat pipe assemblies
/ TV hardware
/ Wireless communication hardware
/ High speed mass storage drives
/ Set top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
Ultra Low Oil-Bleed Thermal Conductive Gel Pad
AS200-s
28
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
PROPERTY AS400-s TEST METHOD UNIT
Color Blue Visual -
Surface tack 2-side/1-side 2 - -
Thickness Customized ASTM D374
Density 2.6 ASTM D792 g/cm³
mm
Hardness 45 ASTM D2240 Shore OO
Application temperature -60~180 - °C
ROHS & REACH Compliant - -
COMPRESSION@1.0mm
Deflection @10 psi 9 ASTM D5470 modify %
Deflection @20 psi 15 ASTM D5470 modify %
Deflection @30 psi 25 ASTM D5470 modify %
Deflection @40 psi 33 ASTM D5470 modify %
Deflection @50 psi 39 ASTM D5470 modify %
ELECTRICAL
Dielectric breakdown 12 ASTM D149 KV/mm
Surface resistivity >10¹¹ ASTM D257 Ohm
Volume resistivity >10¹⁰ ASTM D257 Ohm-m
THERMAL
Thermal Conductivity 4.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.582 ASTM D5470 °C-in²/ W
Thermal impedance@20 psi 0.525 ASTM D5470 °C-in²/ W
Thermal impedance@30 psi 0.483 ASTM D5470 °C-in²/ W
Thermal impedance@50 psi 0.411 ASTM D5470 °C-in²/ W
Thermal impedance@40 psi 0.431 ASTM D5470 °C-in²/ W
Oil Absorbing Sheet 1mm oil bleed width
AS400-s
50% Compression
Silicone Oil
/ Size 30*30mm²
/ Thickness 1.0mm
/ Compression 50%
/ Temperature 25℃
/ Time 120h
OIL BLEEDING
/ Thermal conductivity:4.0 W/m*K
/ High compressibility
/ Low oil-bleeding
/ Naturally tacky and high
resilience
FEATURES
/ Notebook computers
/ Heat pipe assemblies
/ TV hardware
/ Wireless communication hardware
/ High speed mass storage drives
/ Set top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
Thermal Resistance vs. Pressure vs. Deflection
LiPOLY AS400-s is a material TYPICAL PROPERTIES
designed for gap filling. The
thermal conductivity is 4.0 W/m*K.
The hardness is Shore OO/45, with
high flexibility and compressibility.
AS400-s has ultra-low oil bleeding
properties, which helps reduce
pollutants from silicon oil, keeping
electronic components clean.
Ultra Low Oil-Bleed Thermal Conductive Gel Pad
AS400-s
29
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
PROPERTY N700A TEST METHOD UNIT
Color Gray Visual -
Surface tack 2-side/1-side 2 - -
- -
Thickness Customized ASTM D374
Density 2.4 ASTM D792 g/cm³
mm
Hardness 60 ASTM D2240 Shore OO
Application temperature -60~125
ROHS & REACH Compliant
- °C
Low molecular Siloxane
(D3 to D20 total) N.D Gas
Chromatography %
Outgassing CVCM (wt%) 0.0079 By LiPOLY -
COMPRESSION@1.0mm
Deflection @10 psi 10 ASTM D5470 modify %
Deflection @20 psi 22 ASTM D5470 modify %
Deflection @30 psi 35 ASTM D5470 modify %
ELECTRICAL
Dielectric breakdown 16 ASTM D149 KV/mm
Surface resistivity >10¹¹ ASTM D257 Ohm
Volume resistivity >10¹⁰ ASTM D257 Ohm-m
THERMAL
Thermal Conductivity 2.5 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.841 ASTM D5470
Thermal impedance@20 psi 0.682 ASTM D5470
°C-in²/ W
°C-in²/ W
Thermal impedance@30 psi 0.494 ASTM D5470 °C-in²/ W
Thermal impedance@40 psi 0.315 ASTM D5470 °C-in²/ W
Thermal impedance@50 psi 0.217 ASTM D5470 °C-in²/ W
Tensile Strength 1.0 ASTM D412 Kgf/cm²
/ Thermal conductivity:2.5 W/m*K
/ It’s made by non-silicone resin
materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and
sensitive electric components
FEATURES
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
Thermal Resistance vs. Pressure vs. Deflection
Non-Silicone Thermal Compound TYPICAL PROPERTIES
N700A is made of non-silicon
resin material. No low molecular
siloxane volatilization and low
total volatile gas, no electrical
contact & pollution problems.
N700A is flexible and has great
thermal conduction, Low compressive stress and high compressive characteristics can
effectively reduce the stress load
of components, so that the
equipment only needs to bear
less mechanical stress, and at the
same time, it can have low
thermal resistance and high
thermal conductivity.
The chemical formula indicates that if Cyclic polydimethylsilox-ane
(HO-[Si(CH3)2O]n-H) is non-reaction, it's volatile anytime and everywhere. For
example, when the electric products which has been put in a confined space, the
volatile of low-molecular-weight silox-anes will makes the elecetic products
uncontacted.
Non-Silicone Thermal Conductive Pad
N700A
30
N700B TEST METHOD UNIT
Red Visual -
2 - -
- -
Customized ASTM D374
2.6 ASTM D792 g/cm³
mm
60 ASTM D2240 Shore OO
-60~125
Compliant
- °C
27 ASTM D5470 modify %
42 ASTM D5470 modify %
51 ASTM D5470 modify %
16 ASTM D149 KV/mm
>10¹¹ ASTM D257 Ohm
>10¹⁰ ASTM D257 Ohm-m
3.0 ASTM D5470 W/m*K
0.671 ASTM D5470
0.543 ASTM D5470
°C-in²/ W
°C-in²/ W
0.392 ASTM D5470 °C-in²/ W
PROPERTY
Color
Surface tack 2-side/1-side
Thickness
Density
Hardness
Application temperature
ROHS & REACH
COMPRESSION@1.0mm
Deflection @10 psi
Deflection @20 psi
Deflection @30 psi
ELECTRICAL
Dielectric breakdown
Surface resistivity
Volume resistivity
THERMAL
Thermal Conductivity
Thermal impedance@10 psi
Thermal impedance@20 psi
Thermal impedance@30 psi
Thermal impedance@40 psi 0.236 ASTM D5470 °C-in²/ W
Thermal impedance@50 psi 0.169 ASTM D5470 °C-in²/ W
Tensile Strength 1.0 ASTM D412 Kgf/cm²
Low molecular Siloxane
(D3 to D20 total) N.D Gas
Chromatography %
Outgassing CVCM (wt%) 0.0072 By LiPOLY -
TYPICAL PROPERTIES
/ Thermal conductivity:3.0 W/m*K
/ It’s made by non-silicone resin
materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and
sensitive electric components
FEATURES
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
Non-Silicone Thermal Compound
N700B is made of non-silicon
resin material. No low molecular
siloxane volatilization and low
total volatile gas, no electrical
contact & pollution problems.
N700B is flexible and has great
thermal conduction, Low compressive stress and high compressive characteristics can
effectively reduce the stress load
of components, so that the
equipment only needs to bear
less mechanical stress, and at the
same time, it can have low
thermal resistance and high
thermal conductivity.
Non-Silicone Thermal Conductive Pad
N700B
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
Thermal Resistance vs. Pressure vs. Deflection
The chemical formula indicates that if Cyclic polydimethylsilox-ane
(HO-[Si(CH3)2O]n-H) is non-reaction, it's volatile anytime and everywhere. For
example, when the electric products which has been put in a confined space, the
volatile of low-molecular-weight silox-anes will makes the elecetic products
uncontacted.
31
N700C TEST METHOD UNIT
Gray Visual -
2 - -
- -
Customized ASTM D374
3.2 ASTM D792 g/cm³
mm
55 ASTM D2240 Shore OO
-60~125
Compliant
- °C
16 ASTM D5470 modify %
46 ASTM D5470 modify %
68 ASTM D5470 modify %
8 ASTM D149 KV/mm
>10¹¹ ASTM D257 Ohm
>10¹⁰ ASTM D257 Ohm-m
5.0 ASTM D5470 W/m*K
0.312 ASTM D5470
0.208 ASTM D5470
°C-in²/ W
°C-in²/ W
0.132 ASTM D5470 °C-in²/ W
PROPERTY
Color
Surface tack 2-side/1-side
Thickness
Density
Hardness
Application temperature
ROHS & REACH
COMPRESSION@1.0mm
Deflection @10 psi
Deflection @20 psi
Deflection @30 psi
ELECTRICAL
Dielectric breakdown
Surface resistivity
Volume resistivity
THERMAL
Thermal Conductivity
Thermal impedance@10 psi
Thermal impedance@20 psi
Thermal impedance@30 psi
Tensile Strength 0.15 ASTM D412 Kgf/cm²
Low molecular Siloxane
(D3 to D20 total) N.D Gas
Chromatography %
Outgassing CVCM (wt%) 0.0061 By LiPOLY -
TYPICAL PROPERTIES
/ Thermal conductivity:5.0 W/m*K
/ It’s made by non-silicone resin
materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and
sensitive electric components
FEATURES
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
Non-Silicone Thermal Compound
N700C is made of non-silicon
resin material. No low molecular
siloxane volatilization and low
total volatile gas, no electrical
contact & pollution problems.
N700C is flexible and has great
thermal conduction, Low compressive stress and high compressive characteristics can
effectively reduce the stress load
of components, so that the
equipment only needs to bear
less mechanical stress, and at the
same time, it can have low
thermal resistance and high
thermal conductivity.
Non-Silicone Thermal Conductive Pad
N700C
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
Thermal Resistance vs. Pressure vs. Deflection
The chemical formula indicates that if Cyclic polydimethylsilox-ane
(HO-[Si(CH3)2O]n-H) is non-reaction, it's volatile anytime and everywhere. For
example, when the electric products which has been put in a confined space, the
volatile of low-molecular-weight silox-anes will makes the elecetic products
uncontacted.
32
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
N800AH-s TEST METHOD UNIT
Pink Visual -
2 - -
- -
Customized ASTM D374
3.3 ASTM D792 g/cm³
mm
60 ASTM D2240 Shore OO
-60~125
Compliant
- °C
15 ASTM D5470 modify %
40 ASTM D5470 modify %
67 ASTM D5470 modify %
8 ASTM D149 KV/mm
>10¹¹ ASTM D257 Ohm
>10¹⁰ ASTM D257 Ohm-m
7.0 ASTM D5470 W/m*K
0.274 ASTM D5470
0.182 ASTM D5470
°C-in²/ W
°C-in²/ W
0.121 ASTM D5470 °C-in²/ W
PROPERTY
Surface tack 2-side/1-side
Thickness
Hardness
Application temperature
ROHS & REACH
COMPRESSION@1.0mm
Deflection @10 psi
Deflection @20 psi
Deflection @30 psi
ELECTRICAL
Dielectric breakdown
Surface resistivity
Volume resistivity
THERMAL
Thermal Conductivity
Thermal impedance@10 psi
Thermal impedance@20 psi
Thermal impedance@30 psi
Color
Density
Tensile Strength 0.15 ASTM D412 Kgf/cm²
Low molecular Siloxane
(D3 to D20 total) N.D Gas
Chromatography %
Outgassing CVCM (wt%) 0.0057 By LiPOLY -
TYPICAL PROPERTIES
/ Thermal conductivity:7.0 W/m*K
/ It’s made by non-silicone resin
materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and
sensitive electric components
FEATURES
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
Non-Silicone Thermal Compound
N800AH-s is made of non-silicon
resin material. No low molecular
siloxane volatilization and low
total volatile gas, no electrical
contact & pollution problems.
N800AH-s is flexible and has
great thermal conduction, Low
compressive stress and high
compressive characteristics can
effectively reduce the stress load
of components, so that the
equipment only needs to bear
less mechanical stress, and at the
same time, it can have low
thermal resistance and high
thermal conductivity.
Non-Silicone Thermal Conductive Pad
N800AH-s
Thermal Resistance vs. Pressure vs. Deflection
The chemical formula indicates that if Cyclic polydimethylsilox-ane
(HO-[Si(CH3)2O]n-H) is non-reaction, it's volatile anytime and everywhere. For
example, when the electric products which has been put in a confined space, the
volatile of low-molecular-weight silox-anes will makes the elecetic products
uncontacted.
33
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
N800A-s TEST METHOD UNIT
Pink Visual -
2 - -
- -
Customized ASTM D374
3.4 ASTM D792 g/cm³
mm
50 ASTM D2240 Shore OO
-60~125
Compliant
- °C
14 ASTM D5470 modify %
35 ASTM D5470 modify %
67 ASTM D5470 modify %
8 ASTM D149 KV/mm
>10¹¹ ASTM D257 Ohm
>10¹⁰ ASTM D257 Ohm-m
9.0 ASTM D5470 W/m*K
0.238 ASTM D5470
0.166 ASTM D5470
°C-in²/ W
°C-in²/ W
0.102 ASTM D5470 °C-in²/ W
PROPERTY
Color
Surface tack 2-side/1-side
Thickness
Density
Hardness
Tensile Strength 0.15 ASTM D412 Kgf/cm²
Application temperature
ROHS & REACH
COMPRESSION@1.0mm
Deflection @10 psi
Deflection @20 psi
Deflection @30 psi
ELECTRICAL
Dielectric breakdown
Surface resistivity
Volume resistivity
THERMAL
Thermal Conductivity
Thermal impedance@10 psi
Thermal impedance@20 psi
Thermal impedance@30 psi
Low molecular Siloxane
(D3 to D20 total) N.D Gas
Chromatography %
Outgassing CVCM (wt%) 0.0049 By LiPOLY -
TYPICAL PROPERTIES
/ Thermal conductivity:9.0 W/m*K
/ It’s made by non-silicone resin
materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and
sensitive electric components
FEATURES
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
Non-Silicone Thermal Compound
N800A-s is made of non-silicon
resin material. No low molecular
siloxane volatilization and low
total volatile gas, no electrical
contact & pollution problems.
N800A-s is flexible and has great
thermal conduction, Low compressive stress and high compressive characteristics can
effectively reduce the stress load
of components, so that the
equipment only needs to bear
less mechanical stress, and at the
same time, it can have low
thermal resistance and high
thermal conductivity.
Non-Silicone Thermal Conductive Pad
N800A-s
Thermal Resistance vs. Pressure vs. Deflection
The chemical formula indicates that if Cyclic polydimethylsilox-ane
(HO-[Si(CH3)2O]n-H) is non-reaction, it's volatile anytime and everywhere. For
example, when the electric products which has been put in a confined space, the
volatile of low-molecular-weight silox-anes will makes the elecetic products
uncontacted.
34
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
N800BH TEST METHOD UNIT
Pink Visual -
2 - -
- -
Customized ASTM D374
3.3 ASTM D792 g/cm³
mm
50 ASTM D2240 Shore OO
-60~125
Compliant
- °C
13 ASTM D5470 modify %
34 ASTM D5470 modify %
65 ASTM D5470 modify %
8 ASTM D149 KV/mm
>10¹¹ ASTM D257 Ohm
>10¹⁰ ASTM D257 Ohm-m
11.0 ASTM D5470 W/m*K
0.210 ASTM D5470
0.148 ASTM D5470
°C-in²/ W
°C-in²/ W
0.088 ASTM D5470 °C-in²/ W
0.15 ASTM D412 Kgf/cm²
PROPERTY
Color
Surface tack 2-side/1-side
Thickness
Density
Hardness
Tensile Strength
Application temperature
ROHS & REACH
COMPRESSION@1.0mm
Deflection @10 psi
Deflection @20 psi
Deflection @30 psi
ELECTRICAL
Dielectric breakdown
Surface resistivity
Volume resistivity
THERMAL
Thermal Conductivity
Thermal impedance@10 psi
Thermal impedance@20 psi
Thermal impedance@30 psi
Low molecular Siloxane
(D3 to D20 total)
Outgassing CVCM (wt%)
N.D Gas
Chromatography %
0.0047 By LiPOLY -
TYPICAL PROPERTIES
/ Thermal conductivity:11.0 W/m*K
/ It’s made by non-silicone resin
materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and
sensitive electric components
FEATURES
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
Non-Silicone Thermal Compound
N800BH is made of non-silicon
resin material. No low molecular
siloxane volatilization and low
total volatile gas, no electrical
contact & pollution problems.
N800BH is flexible and has great
thermal conduction, Low compressive stress and high compressive characteristics can
effectively reduce the stress load
of components, so that the
equipment only needs to bear
less mechanical stress, and at the
same time, it can have low
thermal resistance and high
thermal conductivity.
Non-Silicone Thermal Conductive Pad
N800BH
Thermal Resistance vs. Pressure vs. Deflection
The chemical formula indicates that if Cyclic polydimethylsilox-ane
(HO-[Si(CH3)2O]n-H) is non-reaction, it's volatile anytime and everywhere. For
example, when the electric products which has been put in a confined space, the
volatile of low-molecular-weight silox-anes will makes the elecetic products
uncontacted.
35
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
N800B TEST METHOD UNIT
Gray Visual -
2 - -
- -
Customized ASTM D374
3.3 ASTM D792 g/cm³
mm
50 ASTM D2240 Shore OO
-60~125
Compliant
- °C
12 ASTM D5470 modify %
32 ASTM D5470 modify %
63 ASTM D5470 modify %
8 ASTM D149 KV/mm
>10¹¹ ASTM D257 Ohm
>10¹⁰ ASTM D257 Ohm-m
13.0 ASTM D5470 W/m*K
0.183 ASTM D5470
0.131 ASTM D5470
°C-in²/ W
°C-in²/ W
0.074 ASTM D5470 °C-in²/ W
0.15 ASTM D412 Kgf/cm²
PROPERTY
Color
Surface tack 2-side/1-side
Thickness
Density
Hardness
Tensile Strength
Application temperature
ROHS & REACH
COMPRESSION@1.0mm
Deflection @10 psi
Deflection @20 psi
Deflection @30 psi
ELECTRICAL
Dielectric breakdown
Surface resistivity
Volume resistivity
THERMAL
Thermal Conductivity
Thermal impedance@10 psi
Thermal impedance@20 psi
Thermal impedance@30 psi
Low molecular Siloxane
(D3 to D20 total)
Outgassing CVCM (wt%)
N.D Gas
Chromatography %
0.0045 By LiPOLY -
TYPICAL PROPERTIES
/ Thermal conductivity:13.0 W/m*K
/ It’s made by non-silicone resin
materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and
sensitive electric components
FEATURES
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
Non-Silicone Thermal Compound
N800B is made of non-silicon
resin material. No low molecular
siloxane volatilization and low
total volatile gas, no electrical
contact & pollution problems.
N800B is flexible and has great
thermal conduction, Low compressive stress and high compressive characteristics can
effectively reduce the stress load
of components, so that the
equipment only needs to bear
less mechanical stress, and at the
same time, it can have low
thermal resistance and high
thermal conductivity.
Non-Silicone Thermal Conductive Pad
N800B
Thermal Resistance vs. Pressure vs. Deflection
The chemical formula indicates that if Cyclic polydimethylsilox-ane
(HO-[Si(CH3)2O]n-H) is non-reaction, it's volatile anytime and everywhere. For
example, when the electric products which has been put in a confined space, the
volatile of low-molecular-weight silox-anes will makes the elecetic products
uncontacted.
36
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
N800CH TEST METHOD UNIT
Gray Visual -
2 - -
- -
Customized ASTM D374
3.3 ASTM D792 g/cm³
mm
50 ASTM D2240 Shore OO
-60~125
Compliant
- °C
10 ASTM D5470 modify %
31 ASTM D5470 modify %
59 ASTM D5470 modify %
8 ASTM D149 KV/mm
>10¹¹ ASTM D257 Ohm
>10¹⁰ ASTM D257 Ohm-m
15.0 ASTM D5470 W/m*K
0.153 ASTM D5470
0.119 ASTM D5470
°C-in²/ W
°C-in²/ W
0.067 ASTM D5470 °C-in²/ W
0.15 ASTM D412 Kgf/cm²
PROPERTY
Color
Surface tack 2-side/1-side
Thickness
Density
Hardness
Tensile Strength
Application temperature
ROHS & REACH
COMPRESSION@1.0mm
Deflection @10 psi
Deflection @20 psi
Deflection @30 psi
ELECTRICAL
Dielectric breakdown
Surface resistivity
Volume resistivity
THERMAL
Thermal Conductivity
Thermal impedance@10 psi
Thermal impedance@20 psi
Thermal impedance@30 psi
Low molecular Siloxane
(D3 to D20 total)
Outgassing CVCM (wt%)
N.D Gas
Chromatography %
0.0040 By LiPOLY -
TYPICAL PROPERTIES
/ Thermal conductivity:15.0 W/m*K
/ It’s made by non-silicone resin
materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and
sensitive electric components
FEATURES
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
Non-Silicone Thermal Compound
N800CH is made of non-silicon
resin material. No low molecular
siloxane volatilization and low
total volatile gas, no electrical
contact & pollution problems.
N800CH is flexible and has great
thermal conduction, Low compressive stress and high compressive characteristics can
effectively reduce the stress load
of components, so that the
equipment only needs to bear
less mechanical stress, and at the
same time, it can have low
thermal resistance and high
thermal conductivity.
Non-Silicone Thermal Conductive Pad
N800CH
Thermal Resistance vs. Pressure vs. Deflection
The chemical formula indicates that if Cyclic polydimethylsilox-ane
(HO-[Si(CH3)2O]n-H) is non-reaction, it's volatile anytime and everywhere. For
example, when the electric products which has been put in a confined space, the
volatile of low-molecular-weight silox-anes will makes the elecetic products
uncontacted.
37
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
Thermal Resistance vs. Pressure vs. Deflection
The chemical formula indicates that if Cyclic polydimethylsilox-ane
(HO-[Si(CH3)2O]n-H) is non-reaction, it's volatile anytime and everywhere. For
example, when the electric products which has been put in a confined space, the
volatile of low-molecular-weight silox-anes will makes the elecetic products
uncontacted.
N800C TEST METHOD UNIT
Gray Visual -
2 - -
- -
Customized ASTM D374
3.3 ASTM D792 g/cm³
mm
50 ASTM D2240 Shore OO
-60~125
Compliant
- °C
8 ASTM D5470 modify %
28 ASTM D5470 modify %
55 ASTM D5470 modify %
8 ASTM D149 KV/mm
>10¹¹ ASTM D257 Ohm
>10¹⁰ ASTM D257 Ohm-m
17.0 ASTM D5470 W/m*K
0.122 ASTM D5470
0.103 ASTM D5470
°C-in²/ W
°C-in²/ W
0.058 ASTM D5470 °C-in²/ W
0.15 ASTM D412 Kgf/cm²
PROPERTY
Color
Surface tack 2-side/1-side
Thickness
Density
Hardness
Tensile Strength
Application temperature
ROHS & REACH
COMPRESSION@1.0mm
Deflection @10 psi
Deflection @20 psi
Deflection @30 psi
ELECTRICAL
Dielectric breakdown
Surface resistivity
Volume resistivity
THERMAL
Thermal Conductivity
Thermal impedance@10 psi
Thermal impedance@20 psi
Thermal impedance@30 psi
Low molecular Siloxane
(D3 to D20 total)
Outgassing CVCM (wt%)
N.D Gas
Chromatography %
0.0043 By LiPOLY -
TYPICAL PROPERTIES
/ Thermal conductivity:17.0 W/m*K
/ It’s made by non-silicone resin
materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and
sensitive electric components
FEATURES
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Sheet form
/ Die-cut parts
SPECIFICATIONS
Non-Silicone Thermal Compound
N800C is made of non-silicon
resin material. No low molecular
siloxane volatilization and low
total volatile gas, no electrical
contact & pollution problems.
N800C is flexible and has great
thermal conduction, Low compressive stress and high compressive characteristics can
effectively reduce the stress load
of components, so that the
equipment only needs to bear
less mechanical stress, and at the
same time, it can have low
thermal resistance and high
thermal conductivity.
Non-Silicone Thermal Conductive Pad
N800C
38
S-putty
Blue Visual -
Silicone - -
- -
2000 DIN 53018
3.0 ASTM D792 g/cm³
Pa.s
-60~180 - °C
100~1500
60 months
Compliant - -
- μm
12 ASTM D149 KV/mm
>10¹³ ASTM D257 Ohm-m
3.5 ASTM D5470 W/m*K
0.079 ASTM D5470 °C-in²/ W
0.071 ASTM D5470 °C-in²/ W
0.061 ASTM D5470 °C-in²/ W
PROPERTY TEST METHOD UNIT
Color
Resin base
Viscosity
Density
Application temperature
Bond line thickness
Shelf life
ROHS & REACH
ELECTRICAL
Dielectric breakdown
Volume resistivity
THERMAL
Thermal conductivity
Thermal impedance@10psi
Thermal impedance@30psi
Thermal impedance@50psi
Using 1.5mm pad as a gap control, put the putty between the
aluminum and the glass panel mark the initial position. Then,
place it in the oven with 125℃ for 1,000 hours and observe its
displacement after reliability test
Material no dropped or changed after
high temperature aging testing
VERTICAL RELIABILITY
/ Thermal conductivity:3.5 W/m*K
/ Bond line thickness:100-1500µm
/ Designed to remove manufacturing
tolerances
/ Does not produce stress on delicate
components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and
low stress application
FEATURES
/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg
CONFIGURATIONS
It can be preserved for 60 months
under the condition of unopened
and under room temperature 25℃.
PRESERVATION
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
Thermal Conductive Putty
S-putty
LiPOLY S-putty is a one-part dispensable material with thermal conductivity 3.5 W/m*K. High deformation can fill small air gaps perfectly to remove tolerance. It also can overcome overflow and drying
problems to increase the thermal conductivity. S-putty is a great alternative to thermal grease and
ideally suited for dispensing using the dispensing robot.
TYPICAL PROPERTIES
39
Base Line
S-putty2-s S-putty2-s
S-putty2-s
Blue Visual -
Silicone - -
- -
3500 DIN 53018
3.3 ASTM D792 g/cm³
Pa.s
-60~180 - °C
100~1500
60 months
Compliant - -
- μm
12 ASTM D149 KV/mm
>10¹³ ASTM D257 Ohm-m
6.0 ASTM D5470 W/m*K
0.062 ASTM D5470 °C-in²/ W
0.059 ASTM D5470 °C-in²/ W
0.053 ASTM D5470 °C-in²/ W
PROPERTY TEST METHOD UNIT
Color
Resin base
Viscosity
Density
Application temperature
Bond line thickness
Shelf life
ROHS & REACH
ELECTRICAL
Dielectric breakdown
Volume resistivity
THERMAL
Thermal conductivity
Thermal impedance@10psi
Thermal impedance@30psi
Thermal impedance@50psi
/ Thermal conductivity:6.0 W/m*K
/ Bond line thickness:100-1500µm
/ Designed to remove manufacturing
tolerances
/ Does not produce stress on delicate
components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and
low stress application
FEATURES
Using 1.5mm pad as a gap control, put the putty between the
aluminum and the glass panel mark the initial position. Then,
place it in the oven with 125℃ for 1,000 hours and observe its
displacement after reliability test
Material no dropped or changed after
high temperature aging testing
VERTICAL RELIABILITY
/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg
CONFIGURATIONS
It can be preserved for 60 months
under the condition of unopened
and under room temperature 25℃.
PRESERVATION
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
Thermal Conductive Putty
S-putty2-s
TYPICAL PROPERTIES
LiPOLY S-putty2-s is a one-part dispensable material with thermal conductivity 6.0 W/m*K. High deformation can fill small air gaps perfectly to remove tolerance. It also can overcome overflow and drying
problems to increase the thermal conductivity. S-putty2-s is a great alternative to thermal grease and
ideally suited for dispensing using the dispensing robot.
40
H-putty
Blue Visual -
Silicone - -
- -
15000 DIN 53018
3.0 ASTM D792 g/cm³
Pa.s
-60~180 - °C
100~3000
60 months
Compliant - -
- μm
12 ASTM D149 KV/mm
>10¹³ ASTM D257 Ohm-m
3.5 ASTM D5470 W/m*K
0.076 ASTM D5470 °C-in²/ W
0.072 ASTM D5470 °C-in²/ W
0.069 ASTM D5470 °C-in²/ W
Color
Resin base
Viscosity
Density
Application temperature
Bond line thickness
Shelf life
ROHS & REACH
ELECTRICAL
Dielectric breakdown
Volume resistivity
THERMAL
Thermal conductivity
Thermal impedance@10psi
Thermal impedance@30psi
Thermal impedance@50psi
PROPERTY TEST METHOD UNIT
Using 3.0mm pad as a gap control, put the putty between the
aluminum and the glass panel mark the initial position. Then,
place it in the oven with 125℃ for 1,000 hours and observe its
displacement after reliability test
Material no dropped or changed after
high temperature aging testing
VERTICAL RELIABILITY
/ Thermal conductivity:3.5 W/m*K
/ Bond line thickness:100-3000µm
/ Designed to remove manufacturing
tolerances
/ Does not produce stress on delicate
components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and
low stress application
FEATURES
/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
Thermal Conductive Putty
H-putty
TYPICAL PROPERTIES
LiPOLY H-putty is a one-part dispensable material with thermal conductivity 3.5 W/m*K. High deformation can fill small air gaps perfectly to remove tolerance. It also can overcome overflow and drying
problems to increase the thermal conductivity. H -putty is a great alternative to thermal grease and
ideally suited for dispensing using the dispensing robot.
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
41
/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg
CONFIGURATIONS
It can be preserved for 60 months
under the condition of unopened
and under room temperature 25℃.
PRESERVATION
H-putty2 TEST METHOD UNIT
Blue Visual -
Silicone - -
- -
15000 DIN 53018
3.3 ASTM D792 g/cm³
Pa.s
-60~180 - °C
100~3000
60 months
Compliant - -
- μm
12 ASTM D149 KV/mm
>10¹³ ASTM D257 Ohm-m
6.0 ASTM D5470 W/m*K
0.061 ASTM D5470 °C-in²/ W
0.054 ASTM D5470 °C-in²/ W
0.050 ASTM D5470 °C-in²/ W
PROPERTY
Color
Resin base
Viscosity
Density
Application temperature
Bond line thickness
Shelf life
ROHS & REACH
ELECTRICAL
Dielectric breakdown
Volume resistivity
THERMAL
Thermal conductivity
Thermal impedance@10psi
Thermal impedance@30psi
Thermal impedance@50psi
Using 3.0mm pad as a gap control, put the putty between the
aluminum and the glass panel mark the initial position. Then,
place it in the oven with 125℃ for 1,000 hours and observe its
displacement after reliability test
Material no dropped or changed after
high temperature aging testing
VERTICAL RELIABILITY
/ Thermal conductivity:6.0 W/m*K
/ Bond line thickness:100-3000µm
/ Designed to remove manufacturing
tolerances
/ Does not produce stress on delicate
components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and
low stress application
FEATURES
/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg
CONFIGURATIONS
It can be preserved for 60 months
under the condition of unopened
and under room temperature 25℃.
PRESERVATION
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
Thermal Conductive Putty
H-putty2
TYPICAL PROPERTIES
LiPOLY H-putty2 is a one-part dispensable material with thermal conductivity 6.0 W/m*K. High deformation can fill small air gaps perfectly to remove tolerance. It also can overcome overflow and drying
problems to increase the thermal conductivity. H -putty2 is a great alternative to thermal grease and
ideally suited for dispensing using the dispensing robot.
42
SH-putty3
Gray Visual -
Silicone - -
- -
17000 DIN 53018
3.4 ASTM D792 g/cm³
Pa.s
-60~180 - °C
100~3000
60 months
Compliant - -
- μm
12 ASTM D149 KV/mm
>10¹³ ASTM D257 Ohm-m
8.0 ASTM D5470 W/m*K
0.039 ASTM D5470 °C-in²/ W
0.035 ASTM D5470 °C-in²/ W
0.031 ASTM D5470 °C-in²/ W
Color
Resin base
Viscosity
Density
Application temperature
Bond line thickness
Shelf life
ROHS & REACH
ELECTRICAL
Dielectric breakdown
Volume resistivity
THERMAL
Thermal conductivity
Thermal impedance@10psi
Thermal impedance@30psi
Thermal impedance@50psi
PROPERTY TEST METHOD UNIT
Using 3.0mm pad as a gap control, put the putty between the
aluminum and the glass panel mark the initial position. Then,
place it in the oven with 125℃ for 1,000 hours and observe its
displacement after reliability test
Material no dropped or changed after
high temperature aging testing
VERTICAL RELIABILITY
/ Thermal conductivity:8.0 W/m*K
/ Bond line thickness:100-3000µm
/ Designed to remove manufacturing
tolerances
/ Does not produce stress on delicate
components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and
low stress application
FEATURES
/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg
CONFIGURATIONS
It can be preserved for 60 months
under the condition of unopened
and under room temperature 25℃.
PRESERVATION
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
Thermal Conductive Putty
SH-putty3
TYPICAL PROPERTIES
LiPOLY SH-putty3 is a one-part dispensable material with thermal conductivity 8.0 W/m*K. High deformation can fill small air gaps perfectly to remove tolerance. It also can overcome overflow and drying
problems to increase the thermal conductivity. SH-putty3 is a great alternative to thermal grease and
ideally suited for dispensing using the dispensing robot.
43
S-putty5-s
Blue Visual -
Silicone - -
- -
20000 DIN 53018
3.3 ASTM D792 g/cm³
Pa.s
-60~180 - °C
200~3000
60 months
Compliant - -
- μm
12 ASTM D149 KV/mm
>10¹³ ASTM D257 Ohm-m
10.0 ASTM D5470 W/m*K
0.035 ASTM D5470 °C-in²/ W
0.031 ASTM D5470 °C-in²/ W
0.027 ASTM D5470 °C-in²/ W
Color
Resin base
Viscosity
Density
Application temperature
Bond line thickness
Shelf life
ROHS & REACH
ELECTRICAL
Dielectric breakdown
Volume resistivity
THERMAL
Thermal conductivity
Thermal impedance@10psi
Thermal impedance@30psi
Thermal impedance@50psi
PROPERTY TEST METHOD UNIT
Using 3.0mm pad as a gap control, put the putty between the
aluminum and the glass panel mark the initial position. Then, p
lace it in the oven with 125℃ for 1,000 hours and observe its
displacement after reliability test
Material no dropped or changed after
high temperature aging testing
VERTICAL RELIABILITY
/ Thermal conductivity:10.0 W/m*K
/ Bond line thickness:200-3000µm
/ Designed to remove manufacturing
tolerances
/ Does not produce stress on delicate
components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low
stress application
FEATURES
/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
TYPICAL APPLICATION
/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg
CONFIGURATIONS
It can be preserved for 60 months
under the condition of unopened
and under room temperature 25℃.
PRESERVATION
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used as the definition standards for LiPOLY.
Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the purchaser’s specific purpose. The purchaser needs to evaluate and verify the
safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user.
LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are
sold in accordance with the LiPOLY Terms and Conditions in effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates.
Statements concerning possible or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
Thermal Conductive Putty
S-putty5-s
TYPICAL PROPERTIES
LiPOLY S-putty5-s is a one-part dispensable material with thermal conductivity 10.0 W/m*K. High
deformation can fill small air gaps perfectly to remove tolerance. It also can overcome overflow and
drying problems to increase the thermal conductivity. S-putty5-s is a great alternative to thermal
grease and ideally suited for dispensing using the dispensing robot.
44
/ Thermal conductivity: 2.2 W/m*K
/ Fast curing in normal atmospheric temperature
/ Great reliability
/ Great sealing in low pressure
FEATURES
/ Between CPU and heat sink
/ Between a component and heat sink
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ Electric vehicle& Automotive battery
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
/ Cartridges: 50ml, 400ml
/ Other special and custom sizes are available upon request
CONFIGURATIONS
Use the disposable plastic static mixing nozzles to mix parts A and B together to the desired ratio.
Liquid gap fillers can be dispensed using an automatic dispensing machine or a manual dispensing
tool that can be provided by LiPOLY upon request/purchase. The disposable plastic static mixing
nozzles cannot be re-used.
DISPENSING INSTRUCTIONS
Two-part liquid gap fillers should be stored in climate-controlled environments at or below 25°C.
Keep liquid gap fillers away from direct sunlight and away from high-temperature environments.
STORAGE
It can be preserved for 24 months under the condition of unopened and under room temperature 25℃.
PRESERVATION
The two-part liquid gap filler may not cure properly if it comes into contact with certain substances,
including amine, sulfur, organophosphorus compounds, and organotin compounds. Please avoid the
following substances when handling: (N, P, S, Sn, Pb, Hg, Sb, Bi, As) Ensure a clean mixing container
is used (e.g.: paper cup or plastic cup) before injecting the A and B parts into the mixing container.
The plasticizer, wax from the cups, varnish or the epoxy from the oven may contaminate the A and B
parts. You are reminded to pre-test the gap filler before using it.
PRECAUTIONS
LiPOLY PK223DM is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 2.2 W/m*K, PK223DM provides high thermal conductivity and
low thermal impedance. It is ideally suited for dispensing using the dispensing robot or by syringe.
Two-Part Thermal Conductive Gap Filler
PK223DM
45
PROPERTY PK223DM TEST METHOD UNIT
Color White (A part)
Gray (B part) Visual -
Solid content 100%
(Two-part : 100:100 ) - -
Viscosity A 120 ISO 3219 Pa.s
Viscosity B 110 ISO 3219 Pa.s
Density 2.2 ASTM D792 g/cm³
Shelf life 24 months - -
ROHS & REACH Compliant - -
SOLID(AFTER CURE)
Thermal conductivity 2.2 ASTM D5470 W/m*K
Thermal impedance@10mils BLT 0.294 ASTM D5470 °C-in²/ W
Thermal impedance@20mils BLT 0.571 ASTM D5470 °C-in²/ W
Thermal impedance@30mils BLT 0.710 ASTM D5470 °C-in²/ W
Hardness 50 ASTM D2240 Shore OO
Working temp (long term) -60 ~ 200 - °C
Operating ambient temp 20 ~ 30 - °C
CURE SCHEDULE
Pot life @ 25°C
Surface dry @ 25°C 20~25 By LiPOLY min
10~15 By LiPOLY min
Cure @ 25°C 30~35 By LiPOLY min
Cure @ 100°C 72 By LiPOLY sec
Cure @ 120°C 20 By LiPOLY sec
Surface resistivity >10¹⁰ ASTM D257 Ohm
Volume resistivity >10¹⁰ ASTM D257 Ohm-m
Dielectric breakdown 8 ASTM D149 KV/mm
ELECTRICAL
TYPICAL PROPERTIES
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used
as the definition standards for LiPOLY. Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the
purchaser’s specific purpose. The purchaser needs to evaluate and verify the safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product
under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user. LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY
material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are sold in accordance with the LiPOLY Terms and Conditions in
effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates. Statements concerning possible
or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
PLEASE NOTE
It’s recommended that the diameter of mixing tube outlet should be 3mm at least, which can solve the
possible problem of poor fluidity caused by ambient temperature.
46
/ Thermal conductivity: 3.6 W/m*K
/ Fast curing in normal atmospheric temperature
/ Great reliability
/ Great sealing in low pressure
FEATURES
/ Cartridges: 50ml, 400ml
/ Other special and custom sizes are available upon request
CONFIGURATIONS
Use the disposable plastic static mixing nozzles to mix parts A and B together to the desired ratio.
Liquid gap fillers can be dispensed using an automatic dispensing machine or a manual dispensing
tool that can be provided by LiPOLY upon request/purchase. The disposable plastic static mixing
nozzles cannot be re-used.
DISPENSING INSTRUCTIONS
Two-part liquid gap fillers should be stored in climate-controlled environments at or below 25°C.
Keep liquid gap fillers away from direct sunlight and away from high-temperature environments.
STORAGE
The two-part liquid gap filler may not cure properly if it comes into contact with certain substances,
including amine, sulfur, organophosphorus compounds, and organotin compounds. Please avoid the
following substances when handling: (N, P, S, Sn, Pb, Hg, Sb, Bi, As) Ensure a clean mixing container
is used (e.g.: paper cup or plastic cup) before injecting the A and B parts into the mixing container.
The plasticizer, wax from the cups, varnish or the epoxy from the oven may contaminate the A and B
parts. You are reminded to pre-test the gap filler before using it.
PRECAUTIONS
/ Between CPU and heat sink
/ Between a component and heat sink
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ Electric vehicle& Automotive battery
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
It can be preserved for 24 months under the condition of unopened and under room temperature 25℃.
PRESERVATION
LiPOLY PK404DM is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 3.6 W/m*K, PK404DM provides high thermal conductivity and
low thermal impedance. It is ideally suited for dispensing using the dispensing robot or by syringe.
Two-Part Thermal Conductive Gap Filler
PK404DM
47
PROPERTY PK404DM TEST METHOD UNIT
Color
Blue (A part)
White (B part) Visual -
Solid content 100%
(Two-part : 100:100) - -
Viscosity A 47 ISO 3219 Pa.s
Viscosity B 48 ISO 3219 Pa.s
Density 3.0 ASTM D792 g/cm³
Shelf life 24 months - -
ROHS & REACH Compliant - -
SOLID(AFTER CURE)
Thermal conductivity 3.6 ASTM D5470 W/m*K
Thermal impedance@10mils BLT 0.252 ASTM D5470 °C-in²/ W
Thermal impedance@20mils BLT 0.471 ASTM D5470 °C-in²/ W
Thermal impedance@30mils BLT 0.730 ASTM D5470 °C-in²/ W
Hardness 80 ASTM D2240 Shore OO
Working temp (long term) -60 ~ 200 - °C
Operating ambient temp 20 ~ 30 - °C
CURE SCHEDULE
Pot life @ 25°C
Surface dry @ 25°C 20~25 By LiPOLY min
10~15 By LiPOLY min
Cure @ 25°C 25~30 By LiPOLY min
Cure @ 100°C 60 By LiPOLY sec
Cure @ 120°C 20 By LiPOLY sec
Surface resistivity >10¹⁰ ASTM D257 Ohm
Volume resistivity >10¹⁰ ASTM D257 Ohm-m
Dielectric breakdown 8 ASTM D149 KV/mm
ELECTRICAL
TYPICAL PROPERTIES
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used
as the definition standards for LiPOLY. Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the
purchaser’s specific purpose. The purchaser needs to evaluate and verify the safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product
under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user. LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY
material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are sold in accordance with the LiPOLY Terms and Conditions in
effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates. Statements concerning possible
or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
PLEASE NOTE
It’s recommended that the diameter of mixing tube outlet should be 3mm at least, which can solve the
possible problem of poor fluidity caused by ambient temperature.
48
/ Thermal conductivity: 5.0 W/m*K
/ Fast curing in normal atmospheric temperature
/ Great reliability
/ Great sealing in low pressure
FEATURES
/ Cartridges: 50ml, 400ml
/ Other special and custom sizes are available upon request
CONFIGURATIONS
Use the disposable plastic static mixing nozzles to mix parts A and B together to the desired ratio.
Liquid gap fillers can be dispensed using an automatic dispensing machine or a manual dispensing
tool that can be provided by LiPOLY upon request/purchase. The disposable plastic static mixing
nozzles cannot be re-used.
DISPENSING INSTRUCTIONS
Two-part liquid gap fillers should be stored in climate-controlled environments at or below 25°C.
Keep liquid gap fillers away from direct sunlight and away from high-temperature environments.
STORAGE
The two-part liquid gap filler may not cure properly if it comes into contact with certain substances,
including amine, sulfur, organophosphorus compounds, and organotin compounds. Please avoid the
following substances when handling: (N, P, S, Sn, Pb, Hg, Sb, Bi, As) Ensure a clean mixing container
is used (e.g.: paper cup or plastic cup) before injecting the A and B parts into the mixing container.
The plasticizer, wax from the cups, varnish or the epoxy from the oven may contaminate the A and B
parts. You are reminded to pre-test the gap filler before using it.
PRECAUTIONS
/ Between CPU and heat sink
/ Between a component and heat sink
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ Electric vehicle& Automotive battery
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL APPLICATION
It can be preserved for 24 months under the condition of unopened and under room temperature 25℃.
PRESERVATION
LiPOLY PK605DM is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 5.0 W/m*K, PK605DM provides high thermal conductivity and
low thermal impedance. It is ideally suited for dispensing using the dispensing robot or by syringe.
Two-Part Thermal Conductive Gap Filler
PK605DM
49
PROPERTY PK605DM TEST METHOD UNIT
Color
Red (A part)
White (B part) Visual -
Solid content 100%
(Two-part : 100:100) - -
Viscosity A 110 ISO 3219 Pa.s
Viscosity B 80 ISO 3219 Pa.s
Density 3.3 ASTM D792 g/cm³
Shelf life 24 months - -
ROHS & REACH Compliant - -
SOLID(AFTER CURE)
Thermal conductivity 5.0 ASTM D5470 W/m*K
Thermal impedance@10mils BLT 0.092 ASTM D5470 °C-in²/ W
Thermal impedance@20mils BLT 0.171 ASTM D5470 °C-in²/ W
Thermal impedance@30mils BLT 0.254 ASTM D5470 °C-in²/ W
Hardness 85 ASTM D2240 Shore OO
Working temp (long term) -60 ~ 200 - °C
Operating ambient temp 20 ~ 30 - °C
CURE SCHEDULE
Pot life @ 25°C
Surface dry @ 25°C 20~25 By LiPOLY min
10~15 By LiPOLY min
Cure @ 25°C 25~30 By LiPOLY min
Cure @ 100°C 40 By LiPOLY sec
Cure @ 120°C 10 By LiPOLY sec
Surface resistivity >10¹¹ ASTM D257 Ohm
Volume resistivity >10¹⁰ ASTM D257 Ohm-m
Dielectric breakdown 8 ASTM D149 KV/mm
ELECTRICAL
TYPICAL PROPERTIES
PLEASE NOTE
Note: All specifications provided by LiPOLY are subject to change without notice. The test methods used by LiPOLY are based on the TIM Tester method and ASTM D5470 test method. These test methods are used
as the definition standards for LiPOLY. Property values provided in this document are not for product specifications or guaranteed. This document does not guarantee the performance and quality required for the
purchaser’s specific purpose. The purchaser needs to evaluate and verify the safety before using the material. We strongly recommend the purchaser pre-test the product and verify the performance of the product
under the purchaser’s specific conditions. Liability and use of the product are the responsibility of the end user. LiPOLY makes no warranty as to the suitability, merchantability, or non-infringement of any LiPOLY
material or product for any specific or general uses. LiPOLY shall not be liable for incidental orconsequential damages of any kind. All LiPOLY products are sold in accordance with the LiPOLY Terms and Conditions in
effect at the time of purchase and a copy of which will be furnished upon request. All rights reserved, including LiPOLY trademarks or registered trademarks of LiPOLY or its affiliates. Statements concerning possible
or suggested uses made herein shall not be relied upon or be constructed as a guaranty of patent infringement. Copyright 2023 LiPOLY.
It’s recommended that the diameter of mixing tube outlet should be 3mm at least, which can solve the
possible problem of poor fluidity caused by ambient temperature.
50




