Specifications

Board thickness: 0.2 ‒ 3.0 mm

Board size: Min: 340 x 400 mm

Max: 610 x 660 mm

Optional Configurations

Smart

Factory

Features

Direct Imaging Automation System

Optimized for HDI and ICS solder mask exposure processes.

Equipped with a board flipping mechanism to prevent PCB scratching, raise

production yield and reduce labor input.

Integrated PCBID barcode scanner to enhance full-process traceability and

processing parameter verification.

Automatically adjustable suction cups adapt to various PCB sizes to avoid

solder mask damage.

Linear motors drive loading and unloading, delivering faster, more stable

operation and higher efficiency.

Supports 睡督-hour fully automatic running.

Anti-static function available.

Visual Alignment System: Improves alignment

precision, ideal for FPC and ultra-thin substrates.

Data Management Database: Connects to MES or

ERP systems to store production data and realize

big-data-based intelligent manufacturing

management.

Automatic Loading Tray

(For ICS Application)

Board thickness: 0.076 ‒ 3.0 mm

Board dimensions: Min: 410 x 510 mm

Max: 513 x 623 mm

Smart

Factory

Features

Convey rollers adopt magnetic wheel drive to

eliminate direct contact and avoid dust

contamination.

Only 睢-point contact during material transfer to

minimize abrasion on PCB surfaces.

Built-in temporary storage module to cut waiting

time during product changeover.

Automatically sorts rejected panels according to

defect marks on CS or SS layers.

Compact footprint design to save workshop floor

space.

Compatible with a wide range of tray dimensions.

Equipped with anti-static protection.

Optional Configurations

AGV docking interface for automatic

unloading and sheet material conveyance,

enabling unmanned workshop operation.

Data Management Database: Stores

production data and links to MES/ERP

systems to support big-data production

management.

Automated Direct Imaging Exposure System

(Specially for FPC Solder Mask Exposure)

＜ 3000mm

Specifications

Substrate thickness: 0.1 ~ 1.0 mm

Substrate dimension: 250 x 300 mm ~ 600 x 600 mm

Can work with separators simultaneously

Positioning accuracy: ± 0.5 mm

Features

Suitable for flexible PCB and rigid-flex

PCB solder mask exposure processes.

Fully automatic operation with a small

footprint.

Custom suction nozzles designed

exclusively for flexible PCB and solder

mask protection.

Supports dual-panel simultaneous

positioning alignment.

Equipped with dedicated NG panel

staging station.

Fully Automated DI System for Dry Film

Specifications

科耀微電⼦(⾹港)有限公司

KE YAO MICRO-ELECTRONIC(HONG KONG)LIMITED

Jiang Xi Ke Yao Equipment Company Limited

TEL: +睧睥 睦睨睦 睢睤睤睤 睧睟睟

Hong Kong Headquarter

TEL: +睧睤睡 睡督睠睤 睥睥睧睥

FAX: +睧睤睡 睡督睠睤 睢睠睢睟

Website: www.wwg-ky.com

E-mail: sales@wwg-ky.com

KYG-M睟睦睡睟睡睥

KE YAO GROUP

OFFICIAL LINKTREE

KE YAO GROUP

WECHAT OFFICIAL ACCOUNT

Features

Compatible with rigid PCB and FPC, supporting

睡督-hour uninterrupted automatic operation.

One-to-two layout design, compatible with

mainstream DI equipment brands available on

the market.

Fitted with a 睥-axis robotic arm imported from

Japan, featuring stable performance, smooth

high-speed operation and simple control logic.

Supports horizontal or L-shaped rack carriers.

Board thickness: 睟.睟睤 ~ 睢.睡 mm

Supports release paper separation

Dual-side sensor configuration

Double-sided dust removal function

Positioning accuracy: ± 睟.睤 mm

Built-in board flipping function