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专注导热散热材料提供先进散热解决方案
东莞市汉宇热能科技有限公司DongGuanHanYuTMTechnologyCo.,Ltd.
公司简介INTRODUCTION
东莞市汉宇热能科技有限公司致力于导热散热材料的研发和制造，拥有多项材料专利，精良的研发团队可及时提供尖端的发热解决方案以满足客户日益先进产品的需求。
Dongguan HANYUTPThermal EnergyTechnology Co., Ltd.iscommittedtotheresearchand development andmanufactureofthermalandthermalmaterials. Ithasa number of material patents.The sophisticated R&D team can provide cutting-edge heating solutions tomeet the needs of customers'increasinglyadvanced products
本公司通过ISO9001、ISO14001、IATF16949、UL等认证，产品符合欧盟RoHS认证并与高等院校清华大学深圳研究生学院合作，为产品技术研发质量等方面提供了支持。引进先进设备，拥有高素质人才，高效率的管理队伍。在同行业中具备尖端研发能力。
Ourcompany has passed ISO9001、ISO14001、IATF16949 ULcertification,the products meet the EU ROsH logo and cooperate withthe Tsinghua University Shenzhen Graduate School ofHigher Education,which provides support forproducttechnology R&D quality.Introducing advanced equipment,high-quality talents,ande fficientmanagementteam.With cutting-edge researchand developmentcapabilitiesinthes ame industry.
本公司经营的产品包括：各导热系数导热硅胶片、导热凝胶、导热硅脂、导热石墨片、导热灌封胶、导热复合材料、相变化材料、金属散热片、绝缘片等。广泛应用于各类通信设备、PD快充电源、计算机、UAV无人机、NoteBook、LED照明、汽车、空调等行业。
Thecompany'sproductsinclude:termalconductivityofthermallyonductivesilicagel,thermallyconductivegel,therally conductivesiliconegrease,thermallyconductivegraphitesheet,thermallyconductivepotting,thermallyconductive compositematerials,pasechangematerials,etalhatsinkinsulatingsheet,etc.Itisidelyusedinariouscommication equipment,tgingrcestersUroseBookihtingtooileio
我们能够为您提供快速、高效的产品和服务，作为一家专业技术公司，我们拥有具备大规模生产能力的自主化生产基地，因此具有强大的成本优势。相信我们日益丰富的产品和工艺总能满足您的要求，并且保持公平的价格和最大的灵活性也会符合您的利益要求。
Weareable to provide you with fastand efficient productsand services.As a professional technology company,we havean independent production basewith large-scale production capacity,so it has a strong cost advantage.We believe that our increasingly rich products and processes willalways meet your requirements,and maintaining a fair price and maximum flexibilitywill also meet your interests.
生产能力Manufacturability检测设备Testing Equipment研发中心R&DCenter先进的加工工艺，拥有专业的自动化生产设备，能同时满足大规模的供货需求，为产品供应时效提供了有力的生产保障。
With professional and fully automated production equipment,it can meet large-scale supply requirementsat the same time,providingastrongproduction guarantee for productsupply timeliness.
拥有多台大型自动化搅拌，捏合机，满足产品批量生产的一致性及稳定性，为快速高效的生产提供了保障。
Equipped withmultiple large-scaleautomated mixingand kneading machines,it meets the consistencyand stabilityofmassproduction of products,providing guarantee for fast and efficient production.
拥有业内先进齐全的研发测试设备， 可及时提供尖端的解决方案以满足 客户日益先进产品的需求。 With advanced and complete R&D and testing equipment in the industry,we can provide cutting -edgesolutionsin time to meet the needs of customers'increasingly advanced products.
先进创新型研发中心，拥有先进的研发设备和硬件设施，多项国内先进技术专注研发新产品，走在行业尖端，具有雄厚的研发实力。
Theadvanced and innovative R&D center has advanced R&D equipmentand hardware facilities.Manydomesticadvanced technologies focus on R&D new products, and are at the cutting edge of the industry with strong R&D capabilities.
搅拌车间Mixing workshop测试中心Test center模切车间Die-cuting workshop五金冲压产品、精密五金弹片、五金散热片及五金零件冲压等产品。先进生产设备，产量保证足以满足客户交付需求。
Hardware stampingproducts,precision hardware shrapnel,hardware heatdissipation fins,and hardware component stamping products.Advanced production equipment ensures sufficient outputto meet customer delivery needs.
先进的行星搅拌机，集反应、混合、混炼、分散为一体的多用途设备，极大提高生产效率。
The advanced planetary mixer is a multi-purpose equipment that integrates reaction,mixing,mixing,and dispersion, greatly improving production efficiency.
拥有全套的实验点温测试设备，可及时提供尖端的解决方案以满足客户日益先进产品的需求。为客户提前测试好性能，定制高效，成本控制优良的多种选择方案，提供优质的服务。
We have a complete set of experimental temperature testing equipment,which can provide cutting-edgesolutions ina timely manner tomeetcustomers'increasingly advanced product needs.Provide customers withadvanced performance testing,efficient customization,and excellent cost control options to provide high-quality services.
多条模切组合线，可模切各类导热，散热，绝缘胶带等复合材料，为客户提供完整的产品配套服务。
Multiple die cutting combination lines can be used to cutvarious compositematerials such asthermal conductivity,heatdissipation,and insulation tape,providingcustomerswith completeproduct supportservices.
汉宇热能在其领域的杰出优势 已拥有超过200家客户的信赖
In die cut industry,hanyutp has its own excellent advantage.
We've wined more than 200 customers' trust.
销售行业涉及：手机电子通讯、汽车电源、新能源汽车、照明行业、显示器、电脑、精密电子设备、UAV无人机等等。
Sales industryinvolves:mobileelectroniccommunications,automotivepower,newenergyvehicles,lightingindustry displays,computers,precision electronic equipment, UAVdronesand so on.
ZTE中兴 FOXConn oppo lenovo
HIKVISION Baseus nVc雷士照明 vivo
PISEN Skyworth HUAWEI BYD
SAMsUNG Google KunX MI
Anker UGREEN绿联 AOHAI ROMOSS罗马奥海科技
Innovations.紫光集团 四 HOHUAOIN WINGTECA 闻泰科技
CONTENT
常规导热硅胶垫片ConventionalSillconeThermalPad 超高导热硅胶垫片HighConventionalSillconeThermalPad 含玻纤导热硅胶垫片Thermal ConductiveSilicone Gel Pad with Fiberglass 导热绝缘矽胶布SiliconeThermalFiberglass 导热绝缘薄片Thermallyconductive insulatingsheet 轻量化动力电池导热硅胶垫片LowDensityThermally ConductivitySiliconeGelPadForVehicles 导热硅脂 Thermal Grease 单组份导热凝胶 One-part Liquid Thermal Gap Pad
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双组份导热凝胶Two-partLiquidThermalGap Pad 硬质导热硅胶垫片SiliconeRubberThermalPad 低硅氧烷导热垫片Lowsiloxanethermalpad 非硅导热垫片 Non-SiliconeThermal Pad 相变化导热垫片 Phase change thermal pad 导热复合材料Thermallyconductivecomposite 导热材料卷料Thermalmaterialcoil 导热灌封材料 Thermallyconductive pottingmaterial 散热解决方案 Thermalsolutionet 金属散热片&绝缘片Metal heatsink&Insulationsheet
常规导热硅胶垫片 ConventionalSillconeThermalPad
产品介绍 Product description
具有一定的柔韧性、优良的绝缘性、压缩性、表面天然的粘性，专门为利用缝隙传递热量的设计方案生产，能够填充缝隙，完成发热部位与散热部位间的热传递，同时还起到绝缘、减震、密封等作用，能够满足设备小型化及超薄化的设计要求，是极具工艺性和使用性，且厚度适用范围广，是一种极佳的导热填充材料而被广泛应用于电子电器产品中。
It hasa certain degree offlexibility,excellent insulation, compressibility,and natural adhesion on the surface. Performance,specially produced forthe designscheme that uses the gap to transfer heat,can fill The gap completes the heat transfer between the heatingpart and the heat dissipation part,and at the same time, it also provides insulation Edge,shock absorption,sealing, etc.
0 该系列产品符合RoHS、卤素、HF管控标准。 This series of products comply with RoHS,halogen and HF control standards.
应用特点Features
导热系数：1.0W/m * k { ~ } 4 . 0 { \ W } / { \mathsf { m } } * { \mathsf { k } } （204号变形力超低，更为有效地保护电器元件高粘性表面，降低接触热阻。0 . 1 0 { ~ } 1 5 . 0 \mathsf {mm } 厚度可选尺寸可根据顾客的需求裁切
Thermal Conductivity:1.0W/m·k\~4.0W/m·k
Low deformation force
High viscosity
Various thickness options
Adjustable size
ThermalConductivity热传导率:1-4W/m.k
应用领域Application
5G行业，航空工业， PD电源行业
新能源汽车，
通讯设备，
精密光学产品，
高速储存设备等。 5G industry,aviation industry,
PD power industry
new energyvehicles,
Communication equipment,
Precision optical products,
High-speed storage equipment, etc.
君
产品规格 Product specifications
片状产品： 4 0 0 ^ { \star } 2 0 0 或者依照客户要求模切产品：依据客户要求
Sheet products: 4 0 0 ^ { \star } 2 0 0 oraccordingtocustomerrequirements Die cutting products:according to customer requirements.
| 项目Items | 单位/Unit | HP10 | HP15 | HP20 | HP30 | HP40 | 检验标准/TestMethod |
| 导heralConductivity | W/m·k | 1.0 | 1.5 | 2.0 | 3.0 | 4.0 | ASTM D5470 |
| Thickness | mm | 0.1~15 | 0.1~15 | 0.1~15 | 0.2~12 | 0.3~12 | ASTMD374 |
| Hardness | Shore 00 | 20~80 | 20~80 | 20~80 | 30~80 | 30~80 | ASTMD2240 |
| Thema2 Resist3mm) | C.in2/W | ≤1.5 | ≤1.2 | ≤1.0 | ≤0.8 | ≤0.6 | ASTMD5470 |
| 压缩t比@5ion Ratio | % | ≥40 | ≥35 | ≥35 | ≥30 | ≥25 | ASTM D575-1991 |
| Tearing trength | KN/m | ≥1.0 | ≥1.0 | ≥0.5 | ≥0.5 | ≥0.5 | ASTMD624 |
| 拉nsilestrength | Mpa | ≥0.4 | ≥0.3 | ≥0.3 | ≥0.2 | ≥0.15 | ASTM D412 |
| 延longatin | % | ≥80 | ≥80 | ≥70 | ≥60 | ≥60 | ASTM D412-1998A |
| 密度 Density | g/cm³ | 2.0(±0.2) | 2.2(±0.2) | 2.5(±0.2) | 3.0(±0.2) | 3.1(±0.2) | ASTM D792 |
| ULerty | Vertical | V-0 | V-0 | V-0 | V-0 | V-0 | UL94 |
| 热her重(120°vi7detry | % | ≤2 | ≤2 | ≤1.0 | ≤0.5 | ≤0.2 | ASTM E595-2006 |
| 体积电阻率 Volume Resistivity | Ω2.cm | 1011 | 1011 | 1010 | 1010 | 1010 | ASTMD257 |
| 击穿电压 Breakdown Voltage | KV/mm | ≥6 | ≥6 | ≥6 | ≥6 | ≥6 | ASTM D149 |
| 使用温度 Operating Temperature | °℃ | -50~180 | -50~180 | -50~180 | -50~180 | -50~180 | - |
| 硅氧烷挥发性(D3-D12) | PPM | GC-FID |
超高导热硅胶垫片 HighConventional Sillcone Thermal Pad
产品介绍 Product description
汉宇超高导热系数系列导热硅胶垫片，是一款导热系数极高的热界面材料(5-15W/m.k)。采用特殊研制纳米材料粉体填充，极大增加了导热通路，产品具有较好的电气绝缘特性及耐温性能，能够较好地填充间隙，实现发热部件到散热部件之间的热传递。产品极具工艺性和使用性，是一种极佳的导热填充材料。
Hanyu ultra-high thermal conductivity series thermally conductive silicone gasket isa thermal interface material with extremely high thermal conductivity (5-15W/m.k). Speciallydeveloped nano-material powder isused to fil, which greatly increases the heat conduction path.
\bigcirc 该系列产品符合RoHS、卤素、HF管控标准。 This series of products comply with RoHS,halogen and HF control standards.
应用特点Features
导热系数：5.0W/m.k\~15.0W/m·k
超高的导热系数
自粘
低热阻
低出油、高可靠度
高电气绝缘
ThermalConductivity:5.0W/m·k\~15.0W/m·k
High thermal conductivity
Self-adhesive
Low thermal resistance
Low oil output,high reliability
High electrical insulation
应用领域Application
5G行业，航空工业， PD电源行业
新能源汽车，
通讯设备，
精密光学产品，
高速储存设备等。 5G industry,aviation industry,
PD power industry
new energy vehicles,
Communication equipment,
Precision optical products,
High-speed storage equipment, etc.
产品规格 Product specifications
片状产品： 4 0 0 ^ { \star } 2 0 0 或者依照客户要求模切产品：依据客户要求
Sheet products: 4 0 0 x 2 0 0 oraccording to customer requirements Die cutting products:according to customer requirements.
| 项目Items | 单位/Unit | HP50 | HP60 | HP80 | HP100 | HP150 | 检验标准/TestMethod |
| 导ermalConductity | W/m· k | 5.0 | 6.0 | 8.0 | 10.0 | 15.0 | ASTM D5470 |
| Thickness | mm | 0.4~6.0 | 0.5~6.0 | 0.8~3.0 | 0.8~3.0 | 1.0~3.0 | ASTMD374 |
| 硬度 Hardness | Shore 00 | 40~70 | 40~70 | 50~70 | 50~70 | 50~70 | ASTM D2240 |
| Therm20Resi&stmm) | C.in2/W | ≤0.5 | ≤0.4 | ≤0.3 | ≤0.2 | ≤0.15 | ASTMD5470 |
| 压缩比@50psi Compression Ratio | % | ≥20 | ≥20 | ≥15 | ≥15 | ≥10 | ASTM D575-1991 |
| Tearingtrength | KN/m | ≥1.0 | ≥1.0 | ≥0.8 | ≥0.5 | ≥0.3 | ASTMD624 |
| tnistrength | Mpa | ≥0.15 | ≥0.15 | ≥0.1 | ≥0.1 | ≥0.08 | ASTM D412 |
| 延longaton | % | ≥35 | ≥35 | ≥25 | ≥25 | ≥20 | ASTM D412-1998A |
| ensity | g/cm³ | 3.15(±0.2) | 3.2(±0.2) | 3.4(±0.2) | 3.5(±0.2) | 3.6(±0.2) | ASTM D792 |
| ULc级y | Vertical | V-0 | V-0 | V-0 | V-0 | V-0 | UL94 |
| 热her重(120°vi7detry | % | ≤0.1 | ≤0.1 | ≤0.1 | ≤0.1 | ≤0.1 | ASTM E595-2006 |
| 体积电阻率 Volume Resistivity | Ω.cm | 1010 | 1010 | 1010 | 1010 | 1010 | ASTMD257 |
| 击穿电压 Breakdown Voltage | KV/mm | ≥6 | ≥6 | ≥6 | ≥6 | ≥6 | ASTM D149 |
| 使用温度 OperatingTemperature | ℃ | -50~180 | -50~180 | -50~180 | -50~180 | -50~180 | - |
| 硅氧烷挥发性(D3-D12) | PPM | GC-FID |
含玻纤导热硅胶垫片 Containing glass fiber thermal silica
产品介绍 Product description
使用玻纤布基材复合加强的导热垫片，具有较高撕裂强度、抗刺穿能力、能够改善操作性。配方独特，兼具成本效益与优异的导热性能。双面自粘，高压缩力下表现出较低的热阻和较好的电气绝缘特性。
The use of glass fiber cloth base material composite reinforced thermallyconductive gasket has high tear strength,puncture resistance,and can improve operability. Unique formula,both cost-effective and excellent thermal conductivity.Double-sided self-adhesive,showing lower thermal resistanceandbetterelectrical insulation characteristics under high compressive force.
\bigcirc 该系列产品符合RoHS、卤素、HF管控标准。 This series of products comply with RoHS,halogen and HF control standards.
应用特点Features
导热系数：1.0W/m·k\~3.0W/m·k
韧性强
高绝缘性
高可靠度
V-0阻燃等级
Thermal conductivity:1.0W/m·k\~3.0W/m·k
Strong toughness
High insulation
High reliability
V-0 flammability rating
应用领域Application
LED照明行业，航空工业，新能源汽车，UAV无人机，通讯设备，精密光学产品，高速储存
设备等。
LEDlighting industry,aviation industry,new eergy vehicles, UAV drones,communication equipment, precision optical products,high-speed storage equipment, etc.
产品规格 Product specifications
片状产品： 4 0 0 ^ { \star } 2 0 0 或者依照客户要求模切产品：依据客户要求
Sheet products: 4 0 0 x 2 0 0 oraccordingto customer requirements Die cutting products:according to customer requirements.
| 项目Items | 单位/Unit | HP-BX10 | HP-BX15 | HP-BX20 | HP-BX25 | HP-BX30 | 检验标准/TestMethod |
| 导heralConducity | W/m· k | 1.0 | 1.5 | 2.0 | 2.5 | 3.0 | ASTM D5470 |
| Thickness | mm | 0.15-5 | 0.2-5 | 0.2-5 | 0.2-5 | 0.2-5 | ASTMD374 |
| 硬度 Hardness | Shore 00 | 40~90(±5) | 40~90(±5) | 50~90(±5) | 50~90(±5) | 50~90(±5) | ASTMD2240 |
| therm20psi&s1mm) | C.in²/W | ≤2.0 | ≤1.6 | ≤1.5 | ≤1.2 | ≤1.0 | ASTM D5470 |
| 压缩比@50psi Compression Ratio | % | ≥20 | ≥20 | ≥20 | ≥20 | ≥20 | ASTM D575-1991 |
| tearingstrength | KN/m | ≥3.0 | ≥3.0 | ≥3.0 | ≥3.0 | ≥3.0 | ASTMD624 |
| 拉ensilestength | Mpa | ≥3.5 | ≥3.5 | ≥3.5 | ≥3.0 | ≥3.0 | ASTM D412 |
| 延longation | % | ≥20 | ≥20 | ≥20 | ≥20 | ≥20 | ASTM D412-1998A |
| 密度 Density | g/cm³ | 2.0(±0.2) | 2.0(±0.2) | 2.5(±0.2) | 2.8(±0.2) | 3.0(±0.2) | ASTM D792 |
| ULcerty | Vertical | V-0 | V-0 | V-0 | V-0 | V-0 | UL94 |
| 热her重(120°c.7dety | % | ≤2 | ≤2 | ≤2 | ≤2 | ≤2 | ASTM E595-2006 |
| Volumeesisivty | Ω.cm | ≥1011 | ≥1011 | ≥1011 | ≥1010 | ≥1010 | ASTMD257 |
| 击穿电压 Breakdown Voltage | KV/mm | ≥6 | ≥6 | ≥6 | ≥6 | ≥6 | ASTM D149 |
| 使用温度 OperatingTemperature | °℃ | -50~180 | -50~180 | -50~180 | -50~180 | -50~180 | - |
| 硅氧烷挥发性(D3-D12) | PPM | GC-FID |
导热绝缘矽胶布 Thermal Conductive Insulators
产品介绍 Product description
导热矽胶布是高绝缘产品，它也具备导热性能。它是将绝缘性的硅胶基材加入到导热材料当中去，从而达到既能绝缘又能导热的效果。
Thermal Conductive Insulators is the high-efficiency insulation ones with thermal conductive properties. The supplement of the insulation bass film made by silica gel into the high-conductive material createsa great effect on both the insulation and heat conduction.
\bullet 该系列产品符合RoHS、卤素、HF管控标准。 This series of products comply with RoHS,halogen and HFcontrol standards.
应用特点Features
导热系数：1.0W/m·k\~3.0W/m·k
高介电强度
高绝缘性
高抗化学性
抗拉力强，耐磨
V-0阻燃等级
Thermal conductivity:1.0W/m·k\~3.0W/m·k
High dielectric strength
High insulation
High chemical resistance
Strong tensilestrength,wear resistance
V-O flammability rating
ThermalConductivity热传导率:1-3W/m.k
| 0 | 10 | 11 | 12 | 20 | |||||||||||||
| 30 |
Hardness 软硬度(shore 00) :50\~80
应用领域Application
开关电源、通讯设备、计算机、平板电视、移动设备、视频设备、网络产品、家用电器等
Switchingpowersupplies,communicationsequipment ,computers,flat-panel TVs,mobile devices,video equipment,network products,household appliances, etc.
产品规格 Productspecifications
片状产品： 4 0 0 x 2 0 0 或者依照客户要求模切产品：依据客户要求
Sheet products: 4 0 0 x 2 0 0 oraccording tocustomer requirements Die cutting products:according to customer requirements.
| 项目Items | 单位/Unit | HP-XJB10 | HP-XJB15 | HP-XJB20 | HP-XJB25 | HP-XJB30 | 检验标准/TestMethod |
| 导heralConductivity | W/m·k | 1.0 | 1.5 | 2.0 | 2.5 | 3.0 | ASTM D5470 |
| Thickness | mm | 0.5-5 | 0.5-5 | 0.5-5 | 0.5-5 | 0.5-5 | ASTMD374 |
| 硬度 Hardness | Shore 00 | 50~80(±5) | 50~80(±5) | 50~80(±5) | 50~80(±5) | 50~80(±5) | ASTMD2240 |
| Therma20psi&s1mm) | C.in2/W | ≤2.0 | ≤1.6 | ≤1.5 | ≤1.2 | ≤1.0 | ASTMD5470 |
| 压缩比@50psi Compression Ratio | % | ≥20 | ≥20 | ≥20 | ≥20 | ≥20 | ASTM D575-1991 |
| 撕裂强度 Tearing strength | KN/m | ≥5.0 | ≥5.0 | ≥5.0 | ≥5.0 | ≥5.0 | ASTMD624 |
| 拉ensilestrength | Mpa | ≥6.0 | ≥6.0 | ≥6.0 | ≥6.0 | ≥6.0 | ASTM D412 |
| Elongatin | % | ≥20 | ≥20 | ≥20 | ≥20 | ≥20 | ASTM D412-1998A |
| 密度 Density | g/cm3 | 1.9(±0.2) | 2.2(±0.2) | 2.5(±0.2) | 2.8(±0.2) | 3.0(±0.2) | ASTM D792 |
| ULcerty | Vertical | V-0 | V-0 | V-0 | V-0 | V-0 | UL94 |
| 热her(120°c.7etry | % | ≤2 | ≤2 | ≤1 | ≤0.5 | ≤0.5 | ASTM E595-2006 |
| VlumeRsistity | Ω.cm | ≥1011 | ≥1011 | ≥1010 | ≥1010 | ≥1010 | ASTMD257 |
| 击穿电压 Breakdown Voltage | KV/mm | ≥8 | ≥8 | ≥8 | ≥8 | ≥8 | ASTM D149 |
| 使用温度 OperatingTemperature | ℃ | -50~180 | -50~180 | -50~180 | -50~180 | -50~180 | - |
| 硅氧烷挥发性（D3-D12) | % | GC-FID |
导热绝缘薄片 Thermally conductive insulatingsheet
产品介绍 Product description
导热硅胶绝缘片是一种以特殊薄膜为基材的高性能弹性体绝缘材料，具有优良的抗切割能力和极好的导热性能，被广泛应用于电子电器等行业。
Thermal conductive silicone insulationsheet isa kind of high performance elastomer insulation material with special filmas basematerial.It has excellentcutting resistance and excellent thermal conductivity.It is widely used in electronic and other industries.
应用特点Features
导热系数：1.0W/m.k\~2.0W/m·k 低热阻抗
电气绝缘性优异
抗电压达7KV，耐燃等级UL94V0
Thermal conductivity:1.0W/m·k\~2.0W/m·k
Low thermal resistance
Excellent electrical insulation
Anti-voltage up to 7KV,flame retardant
UL94V0
\bigcirc 该系列产品符合RoHS、卤素、HF管控标准。 This series of products comply with RoHS,halogen and HFcontrol standards.
ThermalConductivity热传导率:1-2W/m.k
| 0 | 10 | 11 | 12 | 20 | |||||||||||||
| 30 |
Hardness软硬度(shore00):50\~90
A
应用领域Application
发热功率器件，功率半导体，
电源模块，家用电器
马达控制
军工、航空
Suitable for thermal power devices,power
semiconductors,
Power module, household appliances
Motorcontrol
Military,aviation
产品规格 Product specifications
片状产品： 4 0 0 ^ { \star } 2 0 0 或者依照客户要求模切产品：依据客户要求
Sheet products: 4 0 0 x 2 0 0 oraccordingtocustomer requirements Die cutting products:according to customer requirements.
| 项目Items | 单位/Unit | HP-JYP10 | HP-JYP15 | HP-JYP20 | 检验标准/TestMethod |
| W/m·k | 1.0 | 1.5 | 2.0 | ASTM D5470 | |
| Thickness | mm | 0.1~0.3 | 0.1~0.3 | 0.1~0.3 | ASTMD374 |
| Hardness | Shore 00 | 50~90 | 50~90 | 50~90 | ASTMD2240 |
| Thema2 Resis13mm) | C.in2/W | ≤2.0 | ≤1.8 | ≤1.5 | ASTMD5470 |
| 压ompr@s5ion Ratio | % | ≥60 | ≥50 | ≥45 | ASTM D575-1991 |
| Tearingstength | KN/m | ≥3.0 | ≥2.5 | ≥2.0 | ASTM D624 |
| 拉silestength | Mpa | ≥0.3 | ≥0.3 | ≥0.25 | ASTM D412 |
| Elongation | % | ≥50 | ≥40 | ≥30 | ASTM D412-1998A |
| Density | g/cm³ | 1.8 | 2.2 | 2.5 | ASTM D792 |
| ULCerty | Vertical | V-O | V-0 | V-0 | UL94 |
| 热her重(120°vi7detry | % | ≤2 | ≤1 | ≤1 | ASTME595-2006 |
| VlumeRsistivity | Ω.cm | ≥101 | ≥101 | ≥101 | ASTMD257 |
| 击eakdown Voltage | KV/mm | ≥6 | ≥6 | ≥6 | ASTM D149 |
| 使用温度 OperatingTemperature | ℃ | -50~180 | -50~180 | -50~180 | - |
| 硅氧烷挥发性(D3-D12) | PPM | GC-FID |
轻量化动力电池导热硅胶垫片 LowDensityThermally Conductivity Silicone Gel PadForVehicles
产品介绍 Product description
具有高变形弹性和良好压缩比，适用于大型机构设计公差，产品为低密度设计，满足汽车零部件行业轻量化的趋势和要求，可选用特殊的超薄玻纤布双层结构，增加可操作性和耐用性。本产品单面自粘，自粘力克长期保持，无腐蚀性，无毒，绿色环保复合国际要求。
With high deformation elasticity and good compression ratio,itis suitablefor large-scale structural design tolerances. The product is designed for low densityand meets the trend and requirements for light weight in theauto parts industry.Special ultra-thin fiberglass cloth double-layer structure can be used to increase the operability.Sex and durability.This productisself-adhesive on one side,long -termself-adhesive force retention,non-corrosive, non -toxic,green environmental protection international requirements.
0 该系列产品符合RoHS、卤素、HF管控标准。 This series of products comply with RoHS,halogen and HFcontrol standards.
应用特点Features
导热系数：0.8W/m·k\~2.0W/m·k
低密度
高变形量
适合低应力应用场合
具有玻纤布补强
Thermal conductivity: 0.8W/m·k\~2.0W/m·k
Low density
High deformation
Suitable for low stressapplications
With fiberglass cloth reinforcement
| 0 | 8 | 9 | 10 | 11 | 12 | 20 | |||||||||||
| 30 |
Hardness软硬度(shore0o):30\~70
应用领域Application
新能源汽车设备；
充电桩；
军事和医疗设备；
LED产品，通讯设备等。
New energy automotive equipment,aviation industry, Military and Medical Equipment, LED products,communications equipment and so on.
产品规格 Product specifications
片状产品： 4 0 0 ^ { \star } 2 0 0 或者依照客户要求模切产品：依据客户要求
Sheet products: 4 0 0 x 2 0 0 oraccordingtocustomer requirements Die cutting products:according to customer requirements.
| 项目Items | 单位/Unit | HP-QL08 | HP-QL10 | HP-QL15 | HP-QL20 | 检验标准/TestMethod |
| 导heal Conductity | W/m·k | 0.8 | 1.0 | 1.5 | 2.0 | ASTM D5470 |
| Thickness | mm | 0.3~5.0 | 0.3~5.0 | 0.3~5.0 | 0.3~5.0 | ASTMD374 |
| Hardness | Shore 00 | 30~70(±5) | 30~70(±5) | 30~70(±5) | 30~70(±5) | ASTM D2240 |
| 热阻（@20psi&1mm） Thermal Resistance | oC.in2/W | ≤2.0 | ≤1.8 | ≤1.5 | ≤1.0 | ASTM D5470 |
| 压ompr@s5ion Ratio | % | ≥60 | ≥50 | ≥45 | ≥30 | ASTM D575-1991 |
| Tearingtrength | KN/m | ≥1.5 | ≥1.2 | ≥1.0 | ≥0.8 | ASTM D624 |
| 拉siestength | Mpa | ≥0.3 | ≥0.3 | ≥0.25 | ≥0.2 | ASTM D412 |
| Elongation | % | ≥50 | ≥45 | ≥35 | ≥30 | ASTM D412-1998A |
| ensity | g/cm³ | 1.2(±0.2) | 1.4(±0.2) | 1.7(±0.2) | 1.9(±0.2) | ASTM D792 |
| ULCerty | Vertical | V-0 | V-0 | V-0 | V-0 | UL94 |
| 热her重(120°ci7detry | % | ≤2 | ≤2 | ≤2 | ≤1.0 | ASTM E595-2006 |
| VlumeResistivity | Ω.cm | ≥1011 | ≥1011 | ≥1011 | ≥1011 | ASTM D257 |
| 击adwn Voltage | KV/mm | ≥6 | ≥6 | ≥6 | ≥6 | ASTM D149 |
| 使用温度 OperatingTemperature | ℃ | -50~180 | -50~180 | -50~180 | -50~180 | - |
| 硅氧烷挥发性(D3-D12) | PPM | GC-FID |
产品介绍 Product description
导热硅脂是一种高导热绝缘有机硅材料，既具有优异的电绝缘性，又有优异的导热性，同时具有低油离度(趋向于零)，耐高低温、耐水、臭氧、耐气候老化。它可广泛涂覆于各种电子产品，电器设备中的发热体与散热设施（散热片、散热条、壳体等）之间的接触面，起传热媒介作用和防潮、防尘、防腐蚀、防震等性能。
Thermal grease isa kind of high thermal insulation silicone material,which not only has excellent electrical insulation,but also has excellent thermal conductivity. Italso has low oil separation (tend to zero),highand low temperature resistance,water resistance,ozone, and weather resistance.Ageing.It can be widely applied to the contact surface between the heating element in various electronic products, electrical equipment and heat dissipation facilities(heat sinks,heatsinks,housings, etc.),functionsasa heat transfermedium,and isresistant to moisture,dust,and corrosion.,shockproof performance.
\bigcirc 该系列产品符合RoHS、卤素、HF管控标准。 Thisseriesof productscomplywith RoHS,halogen and HF control standards.
应用特点Features
导热系数：1.0W/m * k ~ 6 . 0 8 N / \mathsf { m } * k
低热阻，导热性能优异
低油离度(趋向于零)，长效型、可靠性佳
耐候性强（耐高低温、耐水气、耐臭氧、耐老化等）
接触面湿润效果佳，有效降低界面热阻
Thermal conductivity:1.0W/m·k\~6.0W/m·k
Low thermal resistance,excellent thermal
conductivity
Low oil separation,good reliability
Strongweather resistance
Effectively reduce the interface thermal resistance
应用领域Application
台式计算机CPU、电视机、LED照明灯具散热器、散热模块功率管、电热堆、变频器、电线设备
Desktop Computer CPU,TV,LED Lighting Fixtures Radiator,coolingmodule Power tube,electric reactor,inverter,wire equipment
产品规格 Product specifications
膏状产品（针管装或罐装）
Paste products (in syringes or cans)
| 项目Items | 单位/Unit | HZ-10 | HZ-20 | HZ-30 | HZ-40 | HZ-50 | 检验标准/TestMethod |
| The系al Conductity W/m·k | |||||||
| Therm@20psi&1mm) | C.in2/W | 1.0 ≤3.0 | 2.0 ≤1.5 | 3.0 ≤1.0 | ≤0.8 | ≤0.5 | ASTM D5470 |
| 粘度(MPa.S) | MPa.S | 50000 | 200000 | 250000 | 280000 | 350000 | - |
| Viscosity 挥发份（10℃，2h） | % | ≤1.0 | ≤0.5 | ≤0.5 | ≤0.5 | GB269-85 | |
| Sodcontent | % | 99 | 99.5 | 99.8 | 99.8 | 99.9 | ASTM D5470 |
| Density | g/cm³ | 2.1 | 2.6 | 3.0 | 3.0 | 3.1 | ASTMD792 |
| VlumeResistivty | Ω.cm | 1011 | 1011 | 1011 | ≥1010 | ≥1010 | ASTM D257 |
| 击穿电压 Breakdown Voltage | KV/mm | ≥6 | ≥6 | ≥6 | ≥6 | ≥6 | ASTM D149 |
| Str度eperature | ℃ | 25(2mouths) | 2512mouths) | 25(2mouths) | 25(2mouths) | 25(2mouths) | |
| 耐温范围 Temperature tolerance | ℃ | -40~150 | -40~150 | -40~150 | -40~150 | -40~150 | - |
| immegree | mm | ≤500 | ≤400 | ≤350 | ≤300 | ≤200 | ASTM D217-82 |
单组份导热凝胶One-partLiquidThermal Gap Pad
产品介绍 Product description
导热凝胶继承了硅胶材料亲和性好，耐候性、耐高低温性以及绝缘性好等优点，同时可塑性强，能够满足不平整界面的填充，可以满足各种应用下的传热需求。具有高效导热性能、低压缩力应用、低应力，高压缩比、高电气绝缘、良好的耐温性能、可实现自动化使用等性能。
The thermal conductive gel inherits theadvantages of good affinity,weather resistance,highand low temperature resistance,and good insulation properties of the silica gel material.Atthe same time,it has strong plasticity and can meet the filling of uneven interfaces, and can meetthe heat transfer requirements under various applications. High performance thermal conductivity,lowcompressive force applications,low stress,high compression ratio,high electrical insulation, good temperature resistance,and automated use.
\bigcirc 该系列产品符合RoHS、卤素、HF管控标准。 Thisseries of productscomplywith RoHS,halogen and HFcontrol standards.
应用特点Features
导热系数：3.0W/m.k\~7.0W/m·k
高效导热性
低压缩力应用
高电气绝缘
低应力
可靠性高
Thermal conductivity: 3 . 0 \mathsf { W } / \mathsf { m } * \mathsf { k } { ~ } 7 . 0 \mathsf { W } / \mathsf { m } * \mathsf { k } （2
High thermal conductivity
Low compression force application
Highelectrical insulation
Low stress
High reliability
应用领域Application
LED芯片、通信设备、手机CPU、内存模块、IGBT及其它功率模块、功率半导体领域
Used in LEDchips,communicationsequipment, mobile phone CPUs,memorymodules,IGBTsand other power modules,power semiconductors
产品规格 Product specifications
膏状产品(针管装或罐装) Paste products (in syringes or cans)
| 项目Items | 單位/Unit | HN-35 | HN-40 | HN-50 | HN-60 | HN-70 | 檢驗標/TestMethod |
| 导he系al Conductity | W/m·k | 3.5 | 4.0 | 5.0 | 6.0 | 7.0 | ASTM D5470 |
| 热阻（@20psi&1mm） Thermal Resistance | C.in2/W | ≤0.5 | ≤0.35 | ≤0.25 | ≤0.2 | ≤0.15 | ASTMD5470 |
| tusn rate | g/min | ≥35 | ≥35 | ≥30 | ≥25 | ≥25 | 30ccEFD胶管@90psi |
| 最小粘结厚度 Minimum bond thickness | MM | 0.08 | 0.08 | 0.08 | 0.08 | 0.08 | GB269-85 |
| 阻燃等级 UL Certify | -- | V0 | V0 | VO | VO | UL94 | |
| 密度 Density | g/cm³ | 3.0 | 3.2 | 3.3 | 3.5 | 3.6 | ASTMD792 |
| 体积电阻率 Volume Resistivity | Ω.cm | 1011 | 1011 | 1011 | 1011 | 10 | ASTM D257 |
| 击穿电压 Breakdown Voltage | KV/mm | ≥6 | ≥6 | ≥6 | ≥6 | ≥6 | ASTM D149 |
| 存放时间@25℃ Shelf Life | Month | 12 | 12 | 12 | 12 | 12 | -- |
| 热失重（120℃，7d） Thermal Gravimetry | % | ≤0.5 | ≤0.5 | ≤0.5 | ≤0.5 | ≤0.5 | ASTME595-2006 |
| 低硅氧烷挥发性(D3-D12) Lowsiloxane volatility | PPM | ≤500 | ≤500 | ≤500 | ≤500 | ≤500 | GC-FID |
| 耐温范围 Temperaturetolerance Range | ℃ | -50~180 | -50~180 | -50~180 | -50~180 | -50~180 | - |
| 锥入inmmegree | mm | ≤200 | ≤200 | ≤200 | ≤200 | ≤200 | ASTM D217-82 |
双组份导热凝胶 Two-partLiquid Thermal Gap Pad
产品介绍 Product description
双组份凝胶系列产品是一款双组份预成型导热产品，主要满足产品在使用时低应力，高压缩模量的需求，可实现自动化生产，与电子产品组装时与良好的接触，表现出较低的接触热阻和良好的电气绝缘特性。这种材料同时具有导热垫片和导热硅脂的某些优点，较好的弥补了二者的弱点。
The two-component gel series is a two-component pre -formed thermal grease thatmeets the requirements for low stress and high compression modulus when used, enables automated production,and makes good contact with electronic products.,show lower contact thermal resistance and good electrical insulation properties.This material also has some advantages of a thermal pad and thermal grease,which makes up for the weak points of both.
\bigcirc 该系列产品符合RoHS、卤素、HF管控标准。 Thisseries of products complywith RoHS,halogen and HFcontrol standards.
应用特点Features
导热系数：1.0W/m·k\~5.0W/m·k
超低热阻
低应力应用
可加热加速固化
1:1混合无副产物
Thermal conductivity:1.0W/m·k\~5.0W/m·k
Ultra low thermal resistance
Low stress applications
Accelerated heating
1:1 mixing without by-products
应用领域Application
PD快充电源、大功率电源、LED模组、摄像头、新能源汽车、消费类电子产品。
PD fast charging source,high-power power supply, LED module,camera,New energyvehicles,consumer electronics products.
产品规格 Productspecifications
膏状产品（针管装或罐装或桶装） Paste products (in syringes or cans)
| 项目Items | 單位/Unit | HN-10AB | HN-20AB | HN-35AB | HN-40AB | HN-50AB | 检验标准/TestMethod |
| 导热系数 Thermal Conductivity | W/m-k | 1.0 | 2.0 | 3.5 | 4.0 | 5.0 | ASTM D5470 |
| 热阻（@20psi&1mm） Thermal Resistance | C.in2/W | ≤0.8 | ≤0.75 | ≤0.55 | ≤0.4 | ≤0.3 | ASTMD5470 |
| Hrdness | Shore00 | 20~70(±5) | 20~70(±5) | 20~70(±5) | 15~70(±5) | 15~70(±5) | ASTMD2240 |
| 混合比例（A:B） Mixing ratio (A:B) | ： | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 | |
| A胶粘度(MPa.S) Viscosity | MPa.S | 25000~35000 | 25000~35000 | 100000~120000350000~500000 350000~500000 | -- | ||
| B胶粘度（MPa.S） Viscosity | MPa.S | 25000~35000 | 25000~35000 | 100000~120000 | 350000~500000350000~500000 | ||
| 撕裂强度 Tearingstrength | (KN/m) | ≥2.5 | ≥2.5 | ≥2.0 | ≥1.5 | ≥1.0 | ASTM D624 |
| 拉伸强度 Tensile Strength | (Mpa) | ≥0.4 | ≥0.4 | ≥0.3 | ≥0.2 | ≥0.1 | ASTMD412 |
| 密度 Density | g/cm3 | 2.2 | 2.5 | 3.0 | 3.15 | 3.15 | ASTM D792 |
| 体积电阻率 Volume Resistivity | Ω.cm | 10″ | 1011 | 10″1 | 10 | 10″1 | ASTMD257 |
| 击穿电压 Breakdown Voltage | KV | ≥6 | ≥6 | ≥6 | ≥6 | ≥6 | ASTM D149 |
| Str温度eperature | °℃ | 25(2mouths) | 25(2mouths) | 25(3mouths) | 25(3mouths) | 25(2mouths) | - |
| 热失重(120°℃，7d) Thermal Gravimetry | % | ≤1 | ≤1 | ≤0.5 | ≤0.2 | ≤0.2 | ASTM E595-2006 |
| 低硅氧烷挥发性（D3-D12） Low siloxane volatility | PPM | ≤500 | ≤500 | ≤500 | ≤500 | ≤500 | GC-FID |
| 耐温范围 Temperature tolerance Range | ℃ | -50~180 | -50~180 | -50~180 | -50~180 | -50~180 | -- |
| UL certty | -- | VO | VO | VO | VO | VO | UL94 |
硬质导热垫片 Hard thermal pad
产品介绍 Product description
硬质导热硅胶垫片是使用硅胶与导热陶瓷填料，以玻璃纤维布为补强材料，经特殊工艺加工而成。是一款强度非常大，具有优异的抗拉性，抗撕裂性的导热硅胶垫片，可与电子元器件紧密接触，有效降低界面热阻，导热性能表现极佳。
The hard thermal silicone gasket is made of silica gel and thermal conductive ceramic filler,and glass fiber cloth is used as reinforcing material and processed by aspecial process.Isa very strong,excellent tensile strength,tear resistance thermal silicone gasket,can be in close contact with electronic components, effectively reduce the interface thermal resistance,t hermal conductivity performance is excellent.
\bullet 该系列产品符合RoHS、卤素、HF管控标准。 This seriesof products complywith RoHS, halogen and HFcontrol standards.
应用特点Features
导热系数：1.0W/m·k\~3.0W/m·k
高效导热性
低压缩力应用
高电气绝缘
超薄厚度
可靠性高
Thermalconductivity:1.0W/m·k\~3.0W/m·k
High thermal conductivity
Low compression force application
High electrical insulation
Ultrathin thickness
High reliability
ThermalConductivity热传导率:1-3W/m.k
应用领域Application
LED芯片、通信设备、手机CPU、内存模块、IGBT及其它功率模块、功率半导体领域
LED chips,communications equipment, mobile phone CPUs,memory modules, IGBTs and other power modules, powersemiconductors
产品规格 Product specifications
片状产品： 4 0 0 ^ { \star } 2 0 0 或者依照客户要求模切产品：依据客户要求
Sheet products: 4 0 0 ^ { \star } 2 0 0 oraccording to customer requirements Diecutting products:according to customer requirements.
| 项目Items | 单位/Unit | HP-YZ10 | HP-YZ15 | HP-YZ20 | HP-YZ25 | HP-YZ30 | 检验标准/TestMethod |
| 导he系aConductivity | W/m·k | 1.0 | 1.5 | 2.0 | 2.5 | 3.0 | ASTM D5470 |
| Thickness | mm | 0.2~5 | 0.2~5 | 0.2~5 | 0.3~5 | 0.3~5 | ASTMD374 |
| Hardness | ShoreA | 20~60(±5) | 20~60(±5) | 20~60(±5) | 20~60(±5) | 20~60(±5) | ASTM D2240 |
| Therm20psi&s1mm) | C.in2/W | ≤2.0 | ≤1.8 | ≤1.0 | ≤0.8 | ≤0.6 | ASTM D5470 |
| 压o比t@5ion Ratio | % | ≥60 | ≥50 | ≥50 | ≥45 | ≥45 | ASTM D575-1991 |
| Tearing tength | KN/m | ≥4.0 | ≥3.5 | ≥3.5 | ≥3.5 | ≥3.0 | ASTMD624 |
| 拉siestength | Mpa | ≥0.5 | ≥0.5 | ≥0.4 | ≥0.3 | ≥0.3 | ASTM D412 |
| Elongation | % | ≥50 | ≥40 | ≥40 | ≥35 | ≥35 | ASTM D412-1998A |
| ensity | g/cm³ | 2.0(±0.2) | 2.2(±0.2) | 2.5(±0.2) | 2.7(±0.2) | 3.0(±0.2) | ASTM D792 |
| ULerty | Vertical | V-0 | V-0 | V-0 | V-0 | V-0 | UL94 |
| 热her重(120°vi7detry | % | ≤1.5 | ≤1.0 | ≤1.0 | ≤0.5 | ≤0.5 | ASTME595-2006 |
| 体积电阻率 Volume Resistivity | Ω.cm | ≥101 | ≥1011 | ≥101 | ≥101 | ≥1010 | ASTM D257 |
| eakdwn Voltage | KV/mm | ≥6 | ≥6 | ≥6 | ≥6 | ≥6 | ASTM D149 |
| 使peratingTemperature | °℃ | -50~180 | -50~180 | -50~180 | -50~180 | -50~180 | - |
| 硅氧烷挥发性(D3-D12) | % | GC-FID |
低硅氧烷导热垫片Lowsiloxane thermal pad
产品介绍 Product description适用于硅敏感的应用，比传统非硅材料有更低的硬度，提供更高的变形量与更高的导热性质.
Suitable forsiliconsensitive applications,it has lowerhardness than traditional non-silicon materials, providing higher deformationand higher thermal conductivity.
\bullet 该系列产品符合RoHS、卤素、HF管控标准。 This seriesof products complywith RoHS, halogen and HF control standards.
导热系数：1.0W/m.k\~5.0W/m·k
低硅油析出
耐高低温
可靠性高
Thermal conductivity:1.0W/m·k\~5.0W/m·k Low silicone oil precipitation Highand low temperature resistance High reliability
ThermalConductivity热传导率:1-5W/m.k
应用领域Application
LED芯片、通信设备、手机CPU、内存模块、IGBT及其它功率模块、功率半导体领域
LED chips,communications equipment, mobile phone CPUs,memory modules, IGBTs and other power modules, powersemiconductors
产品规格 Product specifications
片状产品： 4 0 0 ^ { \star } 2 0 0 或者依照客户要求模切产品：依据客户要求
Sheet products: 4 0 0 ^ { \star } 2 0 0 or according to customer requirements Diecutting products:according to customer requirements.
| 项目Items | 单位/Unit | HP-DGY10 | HP-DGY20 | HP-DGY30 | HP-DGY40 | HP-DGY50 | 检验标准/TestMethod |
| 导al Conductity | W/m·k | 1.0 | 2.0 | 3.0 | 4.0 | 5.0 | ASTM D5470 |
| Thickness | mm | 0.2~5 | 0.2~5 | 0.2~5 | 0.3~5 | 0.3~5 | ASTMD374 |
| Hardness | Shore 00 | 50~80 | 50~80 | 50~80 | 50~80 | 50~80 | ASTMD2240 |
| Therm20Resis1m) | C.in2/W | ≤2.0 | ≤1.8 | ≤1.0 | ≤0.8 | ≤0.6 | ASTMD5470 |
| Compr@s5ion Ratio | % | ≥60 | ≥50 | ≥50 | ≥45 | ≥45 | ASTM D575-1991 |
| teanngtrength | KN/m | ≥0.8 | ≥0.5 | ≥0.5 | ≥0.3 | ≥0.3 | ASTM D624 |
| 拉silestrength | Mpa | ≥0.5 | ≥0.5 | ≥0.4 | ≥0.3 | ≥0.3 | ASTM D412 |
| Elongtion | % | ≥50 | ≥40 | ≥40 | ≥35 | ≥35 | ASTM D412-1998A |
| Density | g/cm | 2.0(±0.2) | 2.2(±0.2) | 2.5(±0.2) | 2.7(±0.2) | 3.0(±0.2) | ASTM D792 |
| ULcerty | Vertical | V-0 | V-0 | V-0 | V-0 | V-0 | UL94 |
| them(120vi7metry | % | ≤0.5 | ≤0.5 | ≤0.3 | ≤0.3 | ≤0.3 | ASTME595-2006 |
| VolumeResistivity | Ω.cm | ≥1011 | ≥101 | ≥1011 | ≥1011 | ≥1010 | ASTM D257 |
| 击akdown Voltage | KV/mm | ≥6 | ≥6 | ≥6 | ≥6 | ≥6 | ASTM D149 |
| 使用温度 OperatingTemperature | ℃ | -50~180 | -50~180 | -50~180 | -50~180 | -50~180 | - |
| i氧量latiles | ppm | GC-FID |
非硅导热垫片Non-SiliconeThermal Pad
产品介绍 Product description
针对硅油敏感场合开发的一种无硅油，高导热、高强度、阻燃的界面导热片材，针对不同应用场合开发了多个型号，可以满足高压缩、多次重工、抗撕裂、高频振动冲击等多种应用场合。
Asilicone-free,high-conductivity,high-strength, flame-retardant interface thermal conductive sheet developed for silicone oil-sensitive occasions.A number of models havebeendeveloped fordifferent applications,which can meet high compression, multiple rework,tear resistance,and high frequency Various applications such as vibration and shock.
\bigcirc 该系列产品符合RoHS、卤素、HF管控标准。 This seriesof products complywith RoHS,halogen and HFcontrol standards.
应用特点Features
无硅油析出
机械性能良好
双面弱粘性，可单面增粘
高电气绝缘
尺寸稳定，重工性好，可反复粘贴不变
No silicone oil precipitation
Good mechanical properties
Weakadhesiononbothsides,single-sidedadhesion
Highelectrical insulation
Stable size,good reworkability,can be pasted repeatedly
ThermalConductivity热传导率:1-3W/m.k
应用领域Application
平面显示器，LED照明设备，
PDP显示屏，LCD背光模块
电源模快，家用电器。马达控制。
笔记本和台式计算机显卡与散热器之间。 Flat panel displays, LED lighting equipment,
PDP display,LCD backlight module
Fast power supply, household appliances. Motor control. Between the laptopand desktop computergraphicscard and the radiator.
产品规格 Product specifications
片状产品： 4 0 0 x 2 0 0 或者依照客户要求模切产品：依据客户要求
Sheet products: 4 0 0 ^ { \star } 2 0 0 or according to customer requirements Die cutting products:according to customer requirements.
| 项目Items | 单位/Unit | HP-FG10 | HP-FG20 | HP-FG30 | 检验标准/TestMethod |
| 导ermalConductity | W/m·k | 1.0 | 2.0 | 3.0 | ASTM D5470 |
| Thickness | mm | 0.5~5 | 0.5~5 | 0.5~5 | ASTMD374 |
| Hardness | Shore00 | 40~70 | 40~70 | 40~70 | ASTM D2240 |
| Therm20Resi&s1m) | C.in²/W | ≤2.0 | ≤1.8 | ≤1.0 | ASTM D5470 |
| Compre@son Ratio | % | ≥60 | ≥50 | ≥50 | ASTM D575-1991 |
| 撕裂强度 Tearing strength | KN/m | ≥3.0 | ≥2.5 | ≥2.5 | ASTMD624 |
| 拉eistrength | Mpa | ≥0.5 | ≥0.5 | ≥0.4 | ASTM D412 |
| 延longaton | % | ≥50 | ≥40 | ≥40 | ASTM D412-1998A |
| Density | g/cm³ | 2.2(±0.2) | 2.4(±0.2) | 2.8(±0.2) | ASTM D792 |
| ULcertly | Vertical | V-0 | V-0 | V-0 | UL94 |
| 热her(120°c.7etry | % | ≤0.2 | ≤0.2 | ≤0.1 | ASTM E595-2006 |
| 体积电阻率 Volume Resistivity | 2.cm | ≥101 | ≥1011 | ≥1011 | ASTMD257 |
| 击穿电压 Breakdown Voltage | KV/mm | ≥6 | ≥6 | ≥6 | ASTM D149 |
| 使用温度 OperatingTemperature | ℃ | -50~180 | -50~180 | -50~180 | - |
| i氧含atiles | ppm | 0 | 0 | 0 | GC-FID |
相变化导热垫片Phase change thermal pad
产品介绍 Product description
汉宇相变化系列导热硅胶垫片，一种热量增强聚合导热材料，导热系数可达4W/m.k，在 4 5 - 5 5 ^ { \circ } C 升温相变由固态转液态，在转变之后能够填充缝隙降低接触面热阻，在相变过程能够将电子元件的热量吸收，材料在室温下具有天然黏性，无需黏合胶粘，相变过程无需预热，液化后热阻降低至 0 . 0 1 8 ^ { \circ } \mathsf C -in/W，从而改善了CPU、图形加速器，DC/DC电源模块等功率器件的可靠性；具有像导热片一样可预先成型适合于器件安装，又具有象硅脂一样的低热阻特性，其结合了二者的完美特性。
Aheat-enhancedpolymerthermal conductivematerial with a thermal conductivity of up to 4W/mk.The phase changewill change from solid to liquidat 4 5 - 5 5 ^ { \circ } C After the transformation,it can fill gapsand reduce the thermal resistance of the contact surface.It can reduce the thermal resistance of electronic components during the phase change process. Heat absorption
m一
\bullet 该系列产品符合RoHS、卤素、HF管控标准。 This series of products comply with RoHS,halogen and HF control standards.
应用特点Features
超低接触热阻，高导热效率
天然黏性
可与多种材料覆合成复合导热材料
适用于高频率微处理器
V-0阻燃等级
Ultra-low contact thermal resistance,high thermal conductivity
Natural viscosity
Canbe combined withavariety of materialsto
formcomposite thermal conductive materials
Suitable for high frequency microprocessor
V-0 flame retardant grade
Thermal Conductivity热传导率:1-4W/m.k
应用领域Application
高频率微处理器、笔记本电脑、高速缓存芯片、内存模块、计算机服务器、固态继电器、功率模块、图像处理芯片、ASICS、IGBTs的散热片和电子器件之间
Between high-frequency microprocessors,notebook computers,cachechips,memory modules,computer servers,solid state relays,power modules,image processingchips,ASICS,IGBTs,heat sinksand electronic devices
产品规格 Product specifications
片状产品： 4 0 0 ^ { \star } 2 0 0 或者依照客户要求模切产品：依据客户要求
Sheet products: 4 0 0 ^ { \star } 2 0 0 oraccording to customer requirements Diecutting products:according to customer requirements.
| 项目Items | 单位/Unit | HP-XB10 | HP-XB20 | HP-XB30 | HP-XB40 | 检验标准/TestMethod |
| 导热系数 Thermal Conductivity | W/m· k | 1.0 | 2.0 | 3.0 | 4.0 | ASTM D5470 |
| 厚度 Thickness | mm | 0.2~1 | 0.2~1 | 0.2~1 | 0.2~1 | ASTMD374 |
| e电ecticonstant | MHZ | 3.3 | 3.3 | 3.3 | 3.3 | ASTMD150 |
| 热阻（@10psi） Thermal Resistance | C.in2/W | ≤0.15 | ≤0.09 | ≤0.05 | ≤0.03 | ASTMD5470 |
| 密度 Density | g/cm³ | 2.6(±0.2) | 2.8(±0.2) | 3.0(±0.2) | 3.15(±0.2) | ASTM D792 |
| ULCerty | Vertical | V-0 | V-0 | V-0 | V-0 | UL94 |
| 相变tng Temperature | ℃ | 45~65 | 45~65 | 45~65 | 45~65 | |
| 使p用tgTemperature | ℃ | -50~180 | -50~180 | -50~180 | -50~180 | |
| 体um阻率sistivity | Ohm-cm | 1013 | 1013 | 1013 | 1013 | ASTM D257 |
导热散热复合材料
Thermal conductiveand heatdissipationcompositematerials
产品介绍 Product description
汉宇专注于导热散热领域同时开发了多种散热材料，以满足客户日益强烈的散热需求，推出一系列的散热材料：纳米碳铜、石墨烯、散热陶瓷片、气凝胶隔热膜等等，为客户解决散热问题提供多样的选择方案。
Hanyu focuses on the field of heat conduction and heat dissipation,and has developed a variety of heat dissipation materials to meet customers'increasinglystrong demand forheat dissipation.It has launched a series of heat dissipation materials: nano carbon copper,graphene, heatdissipationceramicchips,aerogel thermal insulation film,etc.,providingcustomerswithavarietyof optionsto solve heat dissipation problems.
应用特点Features
超薄低至0.05mm
低热阻
高导热系数
散热性能优良
易加工
Ultra thin as lowas 0.05mm
Low thermal resistance
High thermal conductivity
Excellent heat dissipation performance
Easy to process
应用领域Application
电源，PD快充， Powersupply,PD fast charge, LED灯具， LED lamps, 行车记录仪， Drivingrecorder, USB转换器， USB converter, 安防监控等 Security monitoring,etc.
产品规格 Product specifications汉宇专注于散热方案领域同时开发了多种隔热材料，以满足客户日益强烈的产品温升需求，推出一隔热硅胶，隔热垫片，气凝胶等，旨在解决精密工业产品在狭小空间内的均热、散热的热管理问题，尤其对弱耐热元器件具有良好的隔热保护作用，提高电子产品的使用舒适度以及延长电子产品的使用寿命。
Hanyu focuses on the field of heat dissipation solutions and hasdevelopeda variety of thermal insulationmaterialstomeet customers'increasingly strong demand for product temperature rise.It haslauncheda thermal insulationsilicone,thermal insulation gasket,aerogel,etc.,aiming tosolve the thermal management problem of heat equalization and heat dissipation of precision industrial products in a narrow space,especially for weak heat resistance components,Improve the comfort of electronic productsand extend their lifespan.
超低导热系数
导热系数低至0.02W/m.k
隔热性能优良
易加工
Ultra low thermal conductivity The thermal conductivity isas low as 0.02W/m.k Excellent insulation performance Easy to process
导热材料卷材 Thermalconductivematerialcoil
产品介绍 Product description
随着时代的发展及制作工艺应用水平的进步，本产品顺应了工艺发展趋势能够满足全自动化贴合生产，将导热硅胶以卷料的形式收卷生产出来，极大提高了生产效率节省人力成本，提升产品质量。
With the development of the timesand the progress of the application level of the production process, this product conforms to the development trend of the processand can meet the fullyautomated lamination production.The thermal silica gel is produced in the formof coils,which greatly improves the production efficiency and saves labor costs.,Improve product quality.
\bullet 该系列产品符合RoHS、卤素、HF管控标准。 Thisseries of products comply with RoHS,halogen and HF control standards.
应用特点Features
万级数字无尘军工级模切车间全程智能生产，日产量上百万，24小时全天候材料测试可靠度实验室，材料可靠度连续测试时间已经超过1万小时以上。
The10,000-leveldigitaldust-freeilitarygradedie-uttingworkshopisintellgentlyproducedthroughouttheentireproess, withadailyoutputofmillonsof.The24-ourall-weathermaterialtestingreliabilitylaboratoryhascontinuouslytestedmaterial reliability formore than10,ooo hours.
应用领域Application
智能手机 smart phone LED芯片、通信设备、 LED chips,communication equipment, 内存模块、 Memory module, IGBT及其它功率模块、IGBTand other power modules, 功率半导体领域 Powersemiconductor field
产品规格 Product specifications卷料产品： 5 3 0 0mm ^ { \star } 5 0 N 或者依照客户要求模切产品：依据客户要求
Sheet products:4300mm\*50M or according to customer requirements Die cutting products:according to customer requirements.
导热灌封材料 Thermally conductive potting material
产品介绍 Product description
汉宇双组份导热灌封胶，是一种室温固化的加成型有机硅材料，由A、B双组份液体组成。这种双组份弹性硅胶设计用于灌封，保护处在严苛条件下的电子产品，流动性好，填充缝隙能力强，A、B组按1：1混合后固化为弹性体，固化时材料无明显的收缩和发热，固化后材料具备有机硅材料优异的物理电气性能。
Aroomtemperaturecuringaddition type organicsilicon material,composed of Aand B two-component liquids. This two-component elasticsilicone is designed for poting, protecting electronic products under severe conditions, with good fluidityand strong abilitytofill gaps
\bigcirc 该系列产品符合RoHS、卤素、HF管控标准。 This series of products comply with RoHS,halogen and HF control standards.
应用特点Features
低粘度，流动性好，可迅速充满狭小缝隙消泡性好，灌胶后可迅速排出气泡可加热加速固化，基本无收缩
1:1混合无副产物
弹性体，具有良好的抗震冲击及变形能力耐高低温变化，不脆化、不龟裂良好的阻燃性能
低介电系数，可降低灌胶后对机器传导辐射的影响抗中毒性，降低各类电子助剂对固化的影响
Low viscosity,good fluidity,can fill narrow gaps quickly
Good defoaming property,bubblescan be discharged quicklyafter filling glue
Can be heated to accelerate curing,basically no shrinkage
1:1 mixing without by-products
Elastomer,withgoodshockresistanceanddeformationability
Resistance to high and low temperature changes,no embritlement,no cracking
Good flame retardant properties
ThermalConductivity热传导率:1-2W/m.k
| 0 | 1 | 23456 | 7 | 891011 | 12 | 20 | |||||||||||
| 30 |
应用领域Application
户外LED灯具、电源设备、PD快充，风箱、等防水导热灌胶。
Outdoor LED lamps,
powersupply equipment,
PD fast charging,bellows, etc
waterproof and thermal conductive glue.
产品规格 Product specifications
A/B组分：分开包装，各10KG/桶需要其他包装可定制
A/Bcomponent:separately packaged,each1okG/barrel Need other packaging can be customized
| 项目Items | 单位/Unit | HN-08150 | HN-10220 | HN-15280 | HN-20650 | HN-25800 | 检验标准/TestMethod |
| 导热系数 Thermal Conductivity | W/m.k | 0.8 | 1.0 | 1.5 | 2.0 | 2.5 | ASTMD5470 |
| 颜色r | 灰 | 灰 | 灰 | 灰 | 灰 | ||
| 粘度A剂 Viscosity partA | MPa.S | 1000-2000 | 1500-2700 | 1800-3800 | 5000-8000 | 6000-10000 | ASTMD2196 |
| 粘度B剂 ViscositypartB | MPa.S | 1000-2000 | 1500-2700 | 1800-3800 | 5000-8000 | 6000-10000 | ASTMD2196 |
| 阻燃等级 UL Certify | v0 | V0 | VO | V0 | UL94 | ||
| 击穿电压 Breakdown Voltage | KV/mm | ≥6 | ≥6 | ≥6 | ≥6 | ≥6 | ASTMD149 |
| 密度 Density | g/cc | 1.5 | 1.8 | 2.0 | 2.2 | 2.5 | ASTMD792 |
| 使用温度 Operating Temperature | °℃ | -60~200 | -60~200 | -60~200 | -60~200 | -60~200 | EN344 |
| Vlume Resistivity | Ohm-cm | 1.0*1010 | 1.0*1010 | 1.0*1010 | 1.0*1010 | 1.0*1010 | ASTM D257 |
| 硬度 Hardness | ShoreA | 30~70 | 30~70 | 30~70 | 30~70 | 30~70 | ASTMD2240 |
| 表干时间 Dry time@25℃C | min | 30 | 30 | 30 | 30 | 30 | |
| 固化时间 Curingtime@25°℃ | min | 60 | 60 | 80 | 120 | 120 | |
| 固化时间 Curing time@80℃ | min | 10 | 10 | 10 | 10 | 10 | |
| 混合比例 Bond peel strength | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 |
金属散热片Metal heatsink
产品介绍 Product description
金属散热片具有高纯度，组织细密，含氧量低。无气孔、沙眼、疏松，导电性能佳，电蚀出的模具表面精度高，经热处理工艺，电极无方向性，适合精打，细打，具有良好的热电道性、加工性、延展性、防蚀性及耐候性等。有良好的导电、导热、耐蚀和加工性能，可以焊接和钎焊。
High purity,fine organization,low oxygen content. No pores,trachoma,looseness,good electrical conductivity, high precision of the surface of the electro-eroded mold, after the heat treatment process,the electrode has no directionality,suitable for fine punching,fine punching, and has good thermal conductivity,processability,ductility, and Corrosion and weather resistance,etc.It has good electrical conductivity,thermal conductivity,corrosion resistance and processing properties,and can be welded and brazed.
导热性是物质传导热量的性能。一般说导电性好的材料，其导热性也好。
若某些零件在使用中需要大量吸热或散热时，则要用导热性好的材料。
如凝汽器中的冷却水管常用导热性好的铜合金制造，以提高冷却效果。
回
金属(按导热性大小排列)有：银(Ag)、铜(Cu)、金(Au)、铝(AI)、纳(Na)、钼(Mo)、钨(W)、锌(Zn)、镍(Ni)、铁(Fe)、铂(Pt)、锡(Sn)、铅(Pb)
| 金属 | 银 | 铜 | 金 | 铝 | 铁 | 锡 | 铅 |
| 热传导系数 | 429 | 401 | 317 | 237 | 80 | 67 | 34.8 |
质 中 8质量保证 经久实用 真材实料 支持定制
产品介绍 Product description
具有尺寸稳定、平直和优良的抗撕拉强度，耐热耐寒、耐潮耐水、耐化学腐蚀，并具有超强的绝缘性能，优异的电气、力学、耐热、耐化学性能。
Ithasdimensional stability,straightnessand excellent tearstrength,heatand cold resistance,moisture resistance,waterresistance,hemical corrosion resistance, and has super insulation properties,excellent electrical, mechanical,heat resistance,and chemical resistance.
\bigcirc 该系列产品符合RoHS、卤素、HF管控标准。 Thisseries of productscomplywith RoHS,halogen and HF control standards.
应用领域Application
可用于电机、电容器、线圈、电缆的绝缘材料，还可与青稞纸制成复合型绝缘材料。现已广泛用于电气绝缘行业，适用于电子、家用电器、仪表、显示器、电机槽缝、电脑及周边设备的垫片、档片、屏幕及保护作用。
Itcanbe usedas insulatingmaterial formotors,capacitors, coilsand cables,and can also be made into composite insulating materials with barley paper.It has beenwidely used in the electrical insulation industry,and issuitablefor gaskets,files, screens and protection of electronics,household appliances, meters,displays,motor slots,computers and peripheral equipment.
| 测试项目 | 测试方法 | 单位 | 测试值 |
| 厚度 | ASTMD374 | mm | 0.25-0.5 |
| 颜色 | 黑色 | ||
| 密度 | ASTMD792 | g/cm³ | 1.2 |
| 吸水率 | ASTMD570 | % | 0.19 |
| 拉伸强度 | ASTMD882 | MPa | >53 |
| 断裂伸长率 | ASTMD882 | % | >65 |
| 撕裂强度 | ASTMD1338 | g/mil | >30 |
| 维卡软化温度 | ASTM1525 | ℃C | 135 |
| 热收缩率 | ASTMD1204 | % | |
| 介电强度 | ASTMD149 | KV/mil | 1.60 |
| 介电常数 | ASTMD150 | @1KHz | 2.33 |
| 体积电阻 | ASTMD257 | Ω.cm | >1016 |
| 表面电阻 | ASTMD257 | Ω·cm | >1015 |
| 阻燃 | UL94 | V-0 |
散热背夹均温片
Heatdissipation back clamp temperature equalization plate
产品介绍 Product description
应用于手机散热背夹上的导冷片，近几年手机游戏时的发热量越来越大，散热背夹应运而生，半导体的冷端吸收手机发热的热量传导给热端，热端的热量通过散热片和风扇很快的传导到周围空气中，冷端产生的冷通过导冷片把冷传递给手机达到散热效果。导冷片一般由特殊的导热硅胶复合金属铜经过复杂的工艺制作而成。
In recent years,the heat generation of mobile phone games using cooling fins has been increasing,and cooling fins have emerged. The cold end of semiconductorsabsorbs the heat generated by the phone and transmits it to the hot end.The heatfrom the hot end is quickly transmitted to the surroundingair through the cooling fins and fans,and the cold generated by the cold end is transmitted to the phone through the cooling fins to achieve heat dissipation. The cold guide plate is generally made of special thermal conductive silicone composite metal copper through complex processes.
应用特点Features
多种导热系数可调多种颜色定制化耐磨耐刮性好散热效果更佳可靠性强
Multipleadjustable thermal conductivity coefficients
Color Customization
Good wear and scratch resistance
Betterheatdissipationeffect
Strong reliability
Thermal solution热仿真
热仿真方案Thermal Simulation
应用FLoTHERM软件可以快速的进行大量项目仿真分析，在此基础上再结合一定的实验测试，可以大幅缩短产品的研发时间和降低产品研发成本，提高企业的研发能力和竞争力。电子设备散热领域，任何涉及流体流动和热量传递的物理现象都可以通过FLoTHERM软件进行仿真分析。
The applicationofFLOTHERMsoftware canquicklyconductalarge numberof projectsimulationanalysis.Based onthis,combined withcertain experimentaltesting,itcansignificantlyshorten the productdevelopmenttime andreduce productdevelopmentcosts,improve theR&Dabilityandcompetitivenessof enterprises.Inthefield ofelectronicdevice heatdissipation,anyphysicalphenomenoninvolvingfluidflowand heattransfercanbesimulated and analyzed using FLOTHERM software
结果分析Resultanalysis
Thermalsolution散热解决方案
解决方案Productdescription拥有全套的实验点温测试设备，可及时提供尖端的解决方案以满足客户日益先进产品的需求。为客户提前测试好性能，为客户定制高效，成本控制优良的多种选择方案，提供优质的服务。
Witha fullset of experimental point temperature testing equipment, we can provide cutting-edge solutions in time to satisfy customers Demand for increasingly advanced products.Test performance for customers inadvance,customizea variety of options forcustomers with high efficiency and excellent cost control,and provide high-quality services.
仪器设备Features
定制化服务 Customized service
·定制化服务，为客户量身定制产品
·材料顶级生产厂商，材料库种类丰富
·测温设备专业齐全，方案测试时效快速
·提供多种方案可选，控制成本的同时把温度控制在合理范围
·材料与机器适配性高，保证产品质量及符合业内检验标准
Customized services,tailor-made products forcustomers
Topmaterial manufacturer,richmaterial library
Thetemperature measuring equipment is complete,and the plan test time is fast
Provideavarietyofoptions to control thecostwhilecontrolling the temperaturewithinareasonablerange
Highadaptabilityof materialsand machines to ensure product qualityand meetindustry inspection standards
热成像系统 Thermal imagingsystem
| C02 19.5 19.45 A: | K B1 C03 19.3 19.3 19.3 A: | B1 C 19.3 19.3 19.3 | 04 B1 °℃ 19.3 19.3 A: 19.3 | 18 显示 | |
| A: 19.4 05 K B1 19.5 | C06 K B1 *C07 19.6 | K B1 °C 19.2 | 08 K B1 C 19.2 | 通 | |
| 19.5 19.5 A: 19.5 | 19.6 L： 19.5 A: 19.5 | 19.3 L: 19.2 A: 19.2 | 19.3 L: 19.2 A: 19.2 | 上一页 | |
| 开始数据采集 | |||||
| 08:01 | 停止 柱状图 | 曲线图系统 | 健盘锁 | 下一 | |
可实时监控温度变化曲线及数据；可同时对多路温度数据进行采集；测试范围 { * 2 0 0 { ~ } 1 3 0 0 ^ { \circ } C } ：
精准定位发热严重部位；
Real-time monitoring of temperature curve and data; Multi-channel temperature data can be collected atthe same time; Test range { } - 2 0 0 { ~ } 1 3 0 0 ^ { \circ } C Accurately locate the severely heated parts;
Thermalsolution 解决方案-案例分析
案例分析Productdescription
当电子产品功耗密度提升，自然散热类产品将触及“功耗墙”，散热问题会在某个拐点成为产品的关键技术难题，甚至成为制约产品体验的核心因素。如今随着充电器功率越做越大，而体积越做越小，机器本身工作时的温度就越来越高，散热问题就逐步凸显出来，汉宇热能提供了先进的散热方案设计，是未来电源散热设计的重要参考。
Whenthepowerconsumptiondensityofelectronicproducts increases,naturalheatdisipationproductswilltouch the" powerwall,andtheheatdisspationproblemwillbecomeakeytechnicalproblemfortheproductatacertaininfletionpoint, andevenbecomethecorefactorthatrestrictstheproductexperience.Nowadays,asthepowerofthechargerisgetingbigger andbigger,andtheizisgettngsmaleradsmallr,tetemperatureofthemacineitselfisgettinghgherandigherwhen itisworkingandtheheatdissipationproblemisgraduallyhighlighted.HanyuThermalprovidesadvancedheatdissipation scheme design,which is the future An important reference for power supply cooling design.
散热效果好，便于组装，同时满足安规要求 Goodheatdissipationeffect,easytoassemble, while meeting safety requirements
一体化测试服务 Integratedtestingservice
·温度点管控实测数据记录
·方案多种可选，数据直观
·方案评估，优劣势分析
·测温曲线一目了然，可判断温升规律
Temperature pointcontrol measured data record
Avarietyofoptions,intuitivedata
Program evaluation,analysis of advantagesand disadvantages
The temperature measurement curve isclearata glance,and the
law of temperature rise can be judged检测环境：室温：25.5℃，湿度：60%RH. Environment:25.5C;60%RH.
测试条件：输入90V电压，满载。 Test Conditions: Input 9oVac withfull load。
测试结果Testdata 方案评估Caseevaluation
| 项目Project: HF-010 | |||||||
| No | Test Point | 1# | 2# | 3# | 4# | Spec.limit | Pass/fail |
| 90V/50HZ | 90V/50HZ | 90V/50HZ | 90V/50HZ | ||||
| C1: 15V/3A | C1: 15V/3A | C1:15V/3A | C1: 15V/3A | ||||
| C2:15V/3A | C2: 15V/3A | C2:15V/3A | C2: 15V/3A | ||||
| 环境温度 | 25.5 | 25.8 | 25.9 | 25.3 | |||
| CH25 | Q1 | 101.2 | 98.9 | 95.0 | 96.5 | ||
| CH26 | Q2 | 114.1 | 111.5 | 100.1 | 104.5 | ||
| CH27 | Q3 | 94.2 | 91.3 | 87.9 | 88.3 | ||
| CH28 | BD1 | 109.9 | 107.4 | 101.3 | 102.6 | ||
| CH29 | BD2 | 110.8 | 110 | 101.8 | 103.2 | ||
| CH30 | MOS1 | 96.9 | 94.1 | 92 | 92.1 | ||
| CH31 | MOS2 | 90.6 | 88.5 | 85.4 | 86.3 | ||
| CH32 | 变压器1 | 76.6 | 79.2 | 74.7 | 76.7 | ||
| CH09 | 变压器2 | 87.7 | 87.7 | 85.4 | 87.8 | ||
| CH02 | 变压器3 | 96 | 90.6 | 85.8 | 87.3 | ||
| CH13 | C1 | 87.4 | 85 | 80.2 | 82.3 | ||
| CH10 | C2 | 93.2 | 90.7 | 85.2 | 87.3 | ||
| CH14 | 上壳 | 74.8 | 73.5 | 70.7 | 71.9 | ||
| CH01 | 下壳 | 80.3 | 77.4 | 78.5 | 75.7 | ||
| 方案： | 原机测试 | HP2040T030 方案1# | HP4025T030 方案2# | HP3055T030 方案3# | |||
原方案：温度控制较差；装配流程繁琐；操作步骤多；
方案1#：温度控制一般，装配流程简洁，易于装配，成本较低；
方案2#：温度控制极好，装配流程简洁，易于装配，但成本较高；
方案3#：温度控制良好，装配流程简洁，易于装配，成本控制较好，较为推荐；
