DEKRA德凯

产品验证和分析服务

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动态类试验 Dynamic Mechanical Test

设计验证 Design Verification

气候环境试验 Climatic Environment Test

工业/户外试验 Industrial/Outdoor Environment Test

材料验证 Material Test

其它试验 Other Test

汽车电子可靠性验证 Automotive Electronics Reliability Verification

印刷电路板验证 PCB Reliability Verification

无铅/无卤过程可靠性验证 Lead-free / Halogen-Free Process Reliability Verification

LED可靠性验证 LED Reliability Verification

目录

Contents

公司简介

Company Profile

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11

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13

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15

可靠性验证

Reliability Test

产业专区

Total Solution for Industry

失效分析

Failure Analysis

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4

关于DEKRA德凯

DEKRA德凯，百年安全保障的全球领导者。成立于1925年，DEKRA德凯旨在通过车辆检验确保道路安全。如今，DEKRA德凯

已发展成为全球最大的独立非上市检验、检测和认证专家机构，覆盖广泛的行业领域。作为值得信赖的全球合作伙伴，

DEKRA德凯凭借全面的服务和创新的解决方案，助力客户提升安全和可持续发展。2025年，DEKRA德凯营业总额达到44亿

欧元，业务遍布世界5大洲60多个国家和地区，逾48,000名员工致力于提供独立、专业的专家服务。DEKRA德凯连续荣获

EcoVadis铂金评级，位列前1%的可持续发展公司之列。

About DEKRA

For more than 100 years, DEKRA has been a trusted name in safety. Founded in 1925 with the original goal of

improving road safety through vehicle inspections, DEKRA has grown to become the world's largest independent,

non-listed expert organization in the field of testing, inspection, and certification. Today, as a global partner, the

company supports its customers with comprehensive services and solutions to drive safety and sustainability

forward. In 2025, DEKRA generated revenue of 4.4 billion euros. More than 48,000 employees are providing qualified and independent expert services in approximately 60 countries across five continents. DEKRA holds a

Platinum rating from EcoVadis, placing it among the top 1% of the world’s most sustainable companies.

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4

动态类试验

Dynamic Environment Test

· 振动试验 Vibration Test

· 机械冲击试验 Mechanical Shock Test

· 破坏边际曲线试验 Damage Boundary Curve Test (DBC Test)

· 碰撞试验 Bump Test

· 落下试验 (单体包装及栈板) Drop Test

· 耐压试验 Compression Test

· 地震试验 Earthquake Test

· 耐久性测试 (插拔与推拉) Endurance test

(Durability / Push-Pull)

· 插入力及拔出力试验 Push In / Pull Out Force Test

· 扭力试验 Torque Test

· 端子强度试验 Terminal Strength Test

· 按键寿命试验 Buttom Life Test

· 手机反覆/滚筒落下试验 Repeat / Rotate Drop Test

· 弯曲试验 Bending Test Thermal cycling-shock chamber

设计验证

Design Verification

· 寿命试验

Reliability Demonstration Test (MTBF)

· 破坏边际曲线试验

Damage Boundary Curve Test (DBC Test)

· 高加速寿命试验

Highly Accelerated Life Test (HALT)

· 高加速应力筛选

Highly Accelerated Stress Screen (HASS)

· 高加速应力审核

Highly Accelerated Stress Audit (HASA)

可靠性验证

Reliability Test

·动态类试验 Dynamic Mechanical Test

·设计验证 Design Verification

·气候环境试验 Climatic Environment Test

·工业/户外试验 Industrial/Outdoor Environment Test

·材料验证 Material Test

·其它试验 Other Test

高加速寿命试验 HALT

试验方法流程 Test Flow

5

新产品开发

New Device

Development

发现缺陷

Detect Found

所有量产产品

全部执行 (HASS)

Screen all Units (HASS)

抽样审核 (HASA)

Sampling Screen (HASA)

组装过程变异数

是否完全掌控?

All processes under

control?

HALT试验执行

Perform HALT Test

改善措施

Corrective Action

改善设计

Improve the Design

失效分析

Failure Analysis

No

No

Yes

Yes

失效

Fail

失效 Fail 失效 Fail 失效 Fail

温度循环应力

(搭配电源开关循环应力)

Temperature Cycle Stress

(Include Power On/

Off Switch Stress)

振动破坏极限值

Vibration Destruct Limit

振动操作极限值

Vibration Operating Limit

复合式应力引用

Combined Screen

完成报告

Final Report

失效分析 Failure Analysis

确认根本原因 Determine Root Cause

改善措施 Corrective Action

重新验证产品强度

Re-Stress to Verify Robustness

改善工艺过程/改善设计临界值/改进零组件供应链管控

Improve Manufacturing Process / Improve Design Margin /

Improve Component Choice

温度破坏极限值

Temperature Destruct Limit

温度操作极限值

(搭配电压边际应力)

Temperature Operating Limit

(Include Power Voltage)

高加速应力筛选 HASS & 高加速应力审核 HASA

气候类环境试验

Climatic Environment Test

· 温度试验 Temperature Test

· 湿度试验 Humidity Test

· 温度循环试验 Thermal Cycling Test

· 温度冲击试验 (气态/液态) Thermal Shock Test

· 温度/高空试验 Combined Temp. / Altitude Test

· 气体腐蚀试验 Gas Corrosion Test

· 环境应力筛选试验 Environmental Stress Screening Test

Upper operating limit

Lower operating limit Combined stress

Rapid thermal transition

Vibration step stress Vibration stress

HALT procedure

试验效益

· 利用高加速环境应力可快速将产品潜在缺陷激发出来并在设计阶段加以修正

· 作为产品量产时的HASS及HASA规格制定的参考

· 降低产品在市场的失效率及减少维修成本

· 建立产品设计能力资料库, 以作为研发依据并可缩短设计开发时间

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工业/户外试验

Industrial / Outdoor Environment Test

· 沙尘试验 Sand / Dust Test

· 雨淋试验 Rain Test

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· 日光照射试验 Solar Radiation Test

· 盐雾试验 Salt Mist Test

材料验证

Material Test

· 紫外线照射试验 Ultraviolet Test (UV Test)

· 氙灯老化试验 Xenon Test

· 百格试验 Cross Cut Test

· 耐人工汗液腐蚀试验 Artificial Sweat Test

· 耐磨擦试验 Attrition Resist Test (Alcohol, Rubber, RCA)

· 表面耐磨/刮擦试验 Surface Attrition Test

· 表面粗糙度试验 Surface Roughness Test

· 镀层试验 Coating Thickness Test

· 硬度试验 Hardness Test

· 耐燃烧试验 Flammability Test

· 耐臭氧试验 Ozone Test

· 耐溶剂试验 Solvent Resistance Test

· 霉菌试验 Mould Corrosion Test

· 碎石冲击试验 Chip Stone Test

其它试验

Other Test

· 噪音测试 Acoustic Test

· 静电枪实验 ESD Gun Test

· 纤维粉尘试验 Fibrous Dust Test

8 Electrical

Verification

电性分析

Non-destructive

Analysis

非破坏性分析

Sample

Preparation

样品制备

Failure Site

Localization

失效点定位

Physical Failure

Analysis

物性失效分析

失效分析

Failure Analysis

DEKRA德凯以全方位整合失效分析服务, 满足零组件至成品端客户的分析需求, 无论在设计、生产或售后阶段, DEKRA德凯都能

提供完整的一站式分析方案。

DEKRA provides comprehensive and integrated Failure Analysis services to meet the analysis needs of customers

from components to finished products. DEKRA can provide a complete one-stop solution covering full life cycle from

design, production to after-sales stages.

I-V Curve

Leakage

Open Short

TLP

CP

Front-side

Decap

Back-side

Preparation

Quick-term

Assembly

Cross-section

De-layer

3D Optical

Microscope

SAT

2D X-ray

3D X-ray

BGA Scope

OBIRCH

EMMI

C-AFM

FIB Crosssection

SEM

AES/ESCA

TEM

SIMS

FTIR

EDS

Analysis

Circuit

Probing

InGaAs

EMMI

Voltage

Contrast

Nano

Prober

Backscattering

Thermal

EMMI (InSb)

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X光检验 X-Ray Inspection

BGA - 锡球短路及移位

BGA - Solder Ball Bridge & Shift

BGA - 焊点气泡比例计算

BGA - Solder Ball Void Ratio

超音波扫描分析 SAT Analysis

TSOP元器件 - 晶片、支架脱层

TSOP Component - Die & Lead frame delamination

电路板 (空板) 爆板

PCBA Delamination

10 Spectrum O Si Ag Au Total

Spectrum 1

Spectrum 2

0.00

54.25

6.90

45.75

15.66

0.00

77.44

0.00

100.00

100.00

Si

Si

Au

Ag

O

0 5 10

Full Scale 446 cts keV

0 5 10

Full Scale 446 cts keV

Spectrum1 Spectrum2

切片分析 Cross-section Analysis

介面合金共化物 (INTERMETALLIC COMPOUND, IMC) 拒焊 (Non-Wetting)

能量色散X - 射线光谱仪分析 EDS Analysis

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产业专区

Total Solution for Industry

·汽车电子可靠性验证 Automotive Electronics Reliability Verification

·印刷电路板验证 PCB Reliability Verification

·无铅/无卤过程可靠性验证 Lead-free / Halogen-Free Process Reliability Verification

·LED可靠性验证 LED Reliability Verification

汽车电子可靠性验证

Automotive Electronics Reliability Verification

· 高加速寿命试验 HALT/HASS/HASA Test

· 气候环境试验 Climatic Environment Test

· 机械环境试验 Mechanical Environment Test

· 密封性试验 Enclosure/Tightness/IP Code Test

· 盐雾试验 Salt Mist/Cyclic Corrosion Test

· 气体腐蚀试验 Gas Corrosion Test

· 耐候性及光老化试验 Weather/Lightfastness/Sunlight Test

· 耐久性试验 Durability Test

· 无铅过程可靠性验证 Lead-free Process Reliability Verification

可靠性验证

Reliability Test

化学分析

Chemical Analysis

· 成分分析 Composition Analysis

· 污染物分析 Contamination Analysis

· 元极化学元素定性检测、筛检以及定量分析

Abiochemistry Element Qualitative Analysis,

Filtration and Quantitative Analysis

· 有机物谱图分析 Organics Spectrogram Analysis

· 汽车材料VOC测试 气味Odor/雾化Fogging/

总碳挥发T-VOC/甲醛Formaldehyde Test

· 禁限用有害物质检测 Hazardous Substances Test

(RoHS/PoHS/ELV)

· 耐候性测试 Weathering Test

· 耐化学试剂 / 耐油品试验 Resistance Chemical/Oil Test

· 耐冲击测试 Impact Resistance Test

· 耐燃性测试 Flammability Test

· 磨擦测试 Wear and Abrasion Test

· 耐刮伤测试 Scratch Resistance Test

材料验证

Material Test

· 非破坏性分析

Non-destructive Analysis

(SAT/2D & 3D X-Ray/3D OM)

· 破坏性分析

Destructive Analysis

(Cross-section/De-layer/Decap/Dye & Pry)

· 电性分析

Electrical Verification (I-V Curve/TLP)

· 故障点检测

Defect Detection (EMMI/OBRICH/InGaAs)

· 物理失效分析

Physical Failure Analysis (SEM/TEM)

失效分析

Failure Analysis

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汽车电子电磁相容验证

Automotive Emc Test

· 辐射发射测试 Radiated Emission (RE)

· 传导发射测试 Conducted Emission (CE)

· 辐射抗扰度测试 Radiated Immunity (RI)

· 大电流注入测试 Bulk Current Injection (BCI)

· 传导瞬态抗扰度测试 Conducted Transient Immunity (CTI)

· 静电放电测试 Electrostatic Discharge (ESD)

汽车电子零件可靠性验证

Automotive Electronics Component Qualification

· 针对IC零件的AEC Q100

AEC Q100 for IC component

· 针对分立元器件的AEC Q101(Diode, MOSFET等)

AEC Q101 for Discrete component

(Diode, MOSFET, etc.)

· 针对无源元器件的AEC Q200（电阻、电容、电感等）

AEC Q200 for Passive component

(Resistor, Capacitor, Inductor, etc)

· 针对离散光电组件的AEC Q102

AEC Q102 for Discrete optoelectronic component

印刷电路板验证

PCB Reliability Verification

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· 沾锡性测试 Solderability Test

· 热应力测试 Thermal Stress Test

· 回焊模拟耐热测试 Reflow Simulation Test

· 温湿度偏压测试 Temperature Humidity Bias Test

· 热油测试 Hot Oil Test

· PCB绝缘电阻测试 PCB Insulation Resistance Test

· 绝缘电阻量测 Insulation Resistance Measurement

· 导通电阻量测 Contact Resistance Measurement

· 介质耐电压测试 Dielectric Withstanding Voltage Test

· 离子污染量测 Ion Contamination Measurement

· 弯曲试验 Bending Test

· 玻璃转化温度量测 Glass Transition Temp. Measurement (Tg)

· 冷热冲击测试 Thermal Shock Test

· 表面绝缘电阻测试 Surface Insulation Resistance Test (SIR Test)

· 阳极性玻纤丝式漏电测试

Conductive Anodic Filaments Test (CAF Test)

· 爬行腐蚀测试 Creep Corrosion Test

表面绝缘电阻测试 (SIR) 阳极性玻纤丝之漏电现象 (CAF)

焊垫强度测试 沾锡性测试 (沾锡天平) 沾锡性测试 (漂锡法)

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无铅/无卤过程可靠性验证

Lead-free / Halogen-Free Process Reliability Verification

无铅及无卤化过程验证分析方案专业评估

Lead-Free & Halogen-Free Evaluation DEKRA德凯提供完整的无铅/无卤验证服务平台，包括无铅/无卤零件及PCB可靠性验证分析，过程优化参数验证 (Process DoE)→组装

品质验证 (Assembly Quality Verification)→可靠性试验 (Reliability Test) →失效分析 (Failure Analysis) 等。

组装品质验证 Assembly Quality Verification

失效 组装/电路板/过程改善

Fail

组装流程 (回焊/波峰焊/重工)

Assembly ( Reflow / Wave / Rework )

高加速寿命试验

HALT

温度循环试验

Temp. Cycling

冲击/落下测试

Shock/Drop

振动试验

Vibration

应变量测

Strain Gage

冲击反应频谱分析

Acceleration

SRS Analysis

外观检查

完成报告

Final Report

可靠性验证

Visual Inspection ( IPC-A-610 )

X光检验

X-ray

超音波扫描分析

SAT

切片分析

Cross-section

紅墨水试验

Dye/ Pry Test

推拉力试验

Pull / Shear

组装品质验证报告

Verification Report Component / PCB / Process Improve

Reliability Test

·外观检查 Visual Inspection

·电性功能测试 Functional Test

·切片分析 Cross-section

·红墨水试验 Dye/ Pry Test

LED可靠性验证

LED Reliability Verification

材料与故障分析

Material Test and Failure Analysis

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· 晶片层间结构观察 TEM

· 电子显微镜检测 SEM

· 材料分析 EDS

· 失效点检测 DB-FIB

· 截面切割 Cross-section

· 表面微污染分析与纵深分析 AES/ESCA

· 表面形貌粗糙度分析 AFM

· X光检验 X-ray

· 傅立叶变换光谱仪 FTIR

· 玻璃转化温度量测 DSC(Tg)

· 热重分析 TGA

· 材料膨胀系数量测 TMA

· 封装体熔胶开盖 Decap

· 静电放电测试 ESD

· 材料层间元素纵深分析 SIMS

· 故障分析评估 FA Evaluation

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5

7

3

5

1

nm 20 40 60 80 100 120 /μm

μm

30

Section

Spectral Period 1.00 μm

Spectral PMS Amplitude 6.08 nm

Spectral Frequency 0.998 /μm

Temporal Freq : 0.00 Hz

20

10

0

-10

-20

0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 nm

0.00

1E+21

1E+20

1E+19

1E+18

1E+17

1E+16

1E+15

1E+14

0.20 0.40 0.60 0.80

Depth (μm)

Concentration (Atoms/cm3)

1.00 1.20 1.40

1.60

In Ga AI

Si Mg

LED量子井 (MQW) TEM分

析每层磊晶层厚度

SEM磊晶 (GaN) 结构观察

AFM Pad表面粗糙度检测

TEM结晶绕射分析，可获得

晶格常数资讯

SEM发光层及金属层结构观测

InGaAs观察LED光电失效亮点

发光层与元素浓度比对图

元素扫描分析 DB-FIB剖面观察失效位置

DEKRA德凯亚太区

服务热线：400 688 1925

邮箱：info@dekra.com.cn

网址：www.dekra.com.cn

扫描左侧二维码，关注DEKRA德凯。

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