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一站式智能自动化设备/自主研发品牌 One-Stop Automation Equipment/ Independent R&D Brand
科耀微电子控股有限公司Ke Yao Micro-Electronic HoldingsLimited
ICompany Profile
科耀集團KE YAO GROUP
Ke Yao Group was founded in Hong Kong and has emerged as a prominent player in the Chinese and Southeast Asian markets. Led by Ke Yao Micro-Electronic Holdings Limited, the group comprises multiple subsidiaries, including: Ke Yao Micro-Electronic (Hong Kong) Limited, Jiang Xi Ke Yao Equipment Co., Ltd.Focused on research, development and innovation, the group is committed to developing specialized automation equipment and systems to enable industrial intelligence.It also provides one-stop professional services,including installation, technical training, efficient maintenance, and the sale of high-quality spare parts, delivering worry-free support to awide range ofcustomers.
里程碑/Milestones
· Phase Il project of Jiang Xi Ke Yao Equipment Co., Ltd. was put into production. 2026
·Developed lamination processes: Fusion Machine,
Automatic Copper Foil Cutting and Arranging Line, Automatic Board Separator. 2025 Independently R&D and manufactured a fully automatic cutting and grinding line. Designated as a partner by South Korea' s Optiflex; jointly developed and produced pre- 2024 lamination machines. 2022 Expanded manufacturing operations by establishing Jiang Xi Ke Yao Equipment Co., Ltd.in Longnan,Jiangxi, with self-built production facilities. 2020 Successfully delivered automated loaders/unloaders for SCREEN direct imaging machines.
* * Received High-Tech EnterpriseCertification. 2019
* Successfully implemented full automation and intelligent management for a customer' s Mitsubishi laser workshop,improving efficiency and reducing labor.
·Successfully delivered automated
loaders/unloaders for Pluritec X-Ray drilling machines. 2018 Established a software R&D departmentto develop and appl intelligent management system: Mitsubishi laser workshops. Obtained authorization from Mitsubishi, began R&D and production of specialized loaders/unloaders for Mitsubishi laser 2011 drilling machines. 2003 EstablishmentofKe Yao Micro-Electronic
GROUPSTRATEGICLAYOUT集团战略布局
Ke Yao Micro-Electronic (Hong Kong) Limited
Floor Area: 2,500 sqm
Services:
As the Group's Hong Kong headquarters,it provides comprehensive after-sales services,owns properties,and offersample storage space.
Jiang Xi Ke Yao Equipment Co., Ltd.
Site Area: 6 0 { \ m u } (40,000 sqm)
Services:
Designs and develops a complete,comprehensive real-time intelligent data management system.Independently develops and integrates brands,and builds strong alliances with partners.
To support market expansion, Ke Yao Group constructed a self-owned facility in Longnan City, Jiangxi Province, in 2022 and established Jiang Xi Ke Yao Equipment Co.,Ltd.With a registered capital of HK$2o0 million. The new company covers an area of approximately 60 Mu (40,000 sqm) and plans to develop in three phases: Phaselincludes a3-story production plant (18,000 sqm),a 5- story office building(5,0o0 sqm),and a6-story dormitory(5,0o0 sqm),which was put into operation in August 2023.Phase Il(18,0o0 sqm production plant) was already topped out by the end of 2025. Phase Illfeatures a 5-story manufacturing plant of 15,000 sqm, set to be put into operation at the end of 2026. Going forward, Jiang Xi Ke Yao Equipment Co., Ltd.will continue to innovate and optimize its existing technologies to adapt to market changes, meet customer needs,and achieve sustainabledevelopment.
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Intelligent Automatic System:
Designand develop acomplete and perfect real-time intelligent automation management system.
Automated Electromechanical Equipment:
IC substrate and Al server-related high-end product equipment to meet marketdemands for intelligent automation.
OtherAutomatic Equipment:
Suitableforapplication in printed circuit board and semiconductor production processes.
Industry 4.0
DataCom Intelligent Manufacturing System
DataCom covers multiple subsystems,each ofwhich can be used independently or developed data to connectwith other systems.It can gradually build a customized exclusive production system according to customerneeds.
一站式智能自动化设备/自主研发品牌 One-Stop Automation Equipment/ Independent R&D Brand
LogiSys Intelligent Workshop Logistics Management System
Targeting the requirements of intelligentworkshop logistics for on-site facility/equipment control and resource management, LogiSys provides a one-stop integrated solution.It resolves the mobility and resource allocation challenges of automated logistics for upper-level systems,enabling the creation of a more efficient on-site intelligent logistics system.
Mitsubishi Laser Drilling Intelligent Workshop
This Mitsubishi dual-table CO2 laser drilling machine delivers ultra-highperformance laser drilling. 【The Fully Automatic Loader/Unloader] features with board flipping function and integrates with the [Intelligent Automated Production Execution System】 to reduce board contamination caused by manual handling and eliminate human errors,enabling continuous production.Equipped with a dualboard detection function and a QR code reader,it significantlyimproves production
Intelligent Automatic System
一站式智能自动化设备/自主研发品牌 One-Stop Automation Equipment/ Independent R&D Brand
DataComMobile/TabletAPP
Users can remotely control workshop production via mobile phones and tablets,and simultaneously obtain real-time actual production conditions of the workshop through corresponding devices.
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A GTW5-12 植制粘机工程 工艺 生产
报警日期
报置时间
报管种类 。报警信息 无警报维护项目 DRY AIR FILTER CHECK维护设定时间 24维护经过时间 420保件日期 05/23/20保养次数 1吸尘吸附压力 -2.00台国吸附压力 -5.01R倒f0灯囊的温度 22.46L侧fe集面约温度 22.847
Intelligent Warehouse
Layout Plan for Sorting, Packing, Palletizing, Warehousing, and Outgoing Operations
Key Advantages& Features:
· Process Flow: Code reading,temporary storage,full pallet inspection,palletizing and warehousing,AGF pallet retrieval, automatic wrapping,outgoing delivery. · Advantages: Reduce enterprise labor costs,improve production efficiency, fully automatic and intelligent, enhance warehousing management quality. · Loading and unloading: Can be connected with AGF /trolley.
一站式智能自动化设备/自主研发品牌 One-Stop Automation Equipment/ Independent R&D Brand
The warehouse adopts intelligent management,with all operations such as incoming,outgoing,transportation and picking being fully automated.The system will automatically transport the picked goods to the picking area for palletizing based on the order number recorded at the time of incoming.
Jiangxi Ke Yao's Full-Process PCB Traceability System provides a comprehensive software and hardware solution for end-to-end traceability of PCB production processes. It records full quality and production data from material cutting to packaging, enabling customers to achieve full-process traceability in the most efficient way. All equipments in the solution (marking, code conversion, and X-board marking) support fully automated and connected for operation, simplifying workflows and reducing human intervention.
Double-Sided Laser Marking Equipment for PCB Inner Layers (Offline Model)
Equipment Features:
· Single recognition field of view: 1 0 0 x 8 0 {mm }
·Laser type: Infrared
·Laseroutput power:100-20o W (adjustable)
·Minimum code size: 4 \mathsf {mm } x 4 \mathsf {mm } (10 characters)
·Code depth/hole diameter: 0 . 3 \mathsf {mm } / 0 . 2 \mathsf {mm }
·Marking time: 1 second (for 4 \mathsf {mm } x 4 \mathsf {mm } code)
·Applicable board size: 4 0 0 x 4 0 0 {mm } . 7 0 0 x 8 0 0 {mm }
·Applicable board thickness: 0 . 5 { - } 1 0 \mathsf {mm }
·Positioning system: Mechanical positioning / CCD positioning
CCD field of view: 8 0 x 8 0 {mm } （2号
Carrier type: BOX/ L-rack(optional)
Board transfer: Trolley/AGV(optional) System Interface: Can connect to MES/ERP systems
Advantages& Features:
· Fully automated offline model,suitable for doublesided marking of large-format PCBs.
· Built-in automatic loading/unloading function with AGVintegration for fullyautomated material handling.
·Auto-positioning,inner-layer QR code recognition, and automaticmarking capabilities.
·Equipped with built-in X-Ray inner code reading system and X-Y motion platform; features fully automated loading/unloading mechanismwith lead shielding design. Auto-adjustable Z-axis: Compatible with PCBs of varying thicknessesby adjusting Z-axis height. Powered by independently developed laser marking
一站式智能自动化设备/自主研发品牌 One-Stop Automation Equipment/IndependentR&D Brand
PCB X-Ray Inner Code Reading and Laser Marking Machine (Offline Model)
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Equipment Features:
Advantages& Features:
· Single recognition field of view: 1 0 0 x 8 0 {mm }
·Laser type: Infrared
·Laser output power:10o-20ow (adjustable)
·Minimum code size: 4 \mathsf {mm } x 4 \mathsf {mm } (10 characters)
·Code depth/hole diameter: 0 . 3 {mm } / 0 . 2 {mm }
·Marking time: 1 second (for 4 \mathsf {mm } x 4 \mathsf {mm } code)
·Applicable board size: 4 0 0 x 4 0 0 {mm } - 7 0 0 x 8 0 0 {mm }
·Applicable board thickness: 0 . 5 - 1 0 \mathsf {mm }
·Positioning system: Mechanical positioning/ CCD positioning
CCD field of view: 8 0 x 8 0 {mm } （204
•Carrier type: BOX/L-rack (optional)
Board transfer:Trolley /AGV(optional) System Interface:Can connect to MES/ERP systems
· Fully automatic ofline model,suitable for X-Ray
innercode readingand lasermarking of large-format
PCBs.
· Built-in automatic board loading/unloading function, compatiblewith AGV to realize automatic material handling via AGV.
·Supports automatic positioning,inner-layer QR code
recognition, and automatic marking.
· Integrated with X-Ray inner code reading system, X-Y
motion platform,fully automatic loading/unloading
mechanism,and lead-shielded protection design.
Automatic Z-axis adjustment design, which can be compatible with PCBs of different thicknesses by adjusting the Z-axis height during marking.
Equipped with independently developed laser
PCB Pre-Routing Set& Unit LaserMarkingMachine(Offline Model)
Equipment Features:
·Laser type: UV/Green
·Minimum code size: 4 \mathsf {mm } x 4 \mathsf {mm } (10 characters)
·Applicable board size: 4 0 0 x 5 0 0 {mm } - 7 0 0 x 8 0 0 {mm }
·Applicable board thickness: 0 . 5 - 1 0 \mathsf {mm }
· Code depth: 0 . 3 \mathsf {mm }
·Minimum character size:3 mm
·Positioning system: Mechanical positioning / CCD positioning
·CCD field of view: 8 0 x 8 0 {mm }
Carrier type: BOx/L-rack (optional)
•Board transfer: Trolley /AGV(optional)
System Interface: Can connect to MES/ERP systems
Dimensions: 4 6 0 0 x 1 9 0 0 x 2 0 0 0 0 {mm } （2号
Advantages& Features:
· Fully automatic offline model, suitable for Set & Un marking on PCBs before routing.
· Built-in automatic board loading/unloading function,compatiblewith AGVforautomatic material handling.
·Supports automatic transferof adhesive pad separator paper,automatic positioning, marking, and code reading.
Automatic Z-axis adjustment design, which can be compatible with PCBs of different thicknesses by adjusting the Z-axis height during marking. Optional coaxial camera and laser mechanism design,enabling synchronous code readingafter marking. Equipped with independentlydeveloped laser
一站式智能自动化设备/自主研发品牌 One-StopAutomation Equipment/IndependentR&DBrand
LaserMarkingMachine for Defective PCBs (X-out) (Offline Model)
Equipment Features:
· Laser type: UV/CO2
·Applicable board size: 1 0 0 x 1 5 0 {mm } - 3 0 0 x 3 5 0 {mm }
·Applicable board thickness: 0 . 5 - 1 0 \mathsf {mm }
·Minimum code size: 4 \mathsf {mm } x 4 \mathsf {mm } (10 characters)
·Code depth: 0 . 3 \mathsf {mm }
·Minimum character size:3 mm
·Positioning system: Mechanical positioning/ CCD positioning
·CCD field of view: 8 0 x 8 0 {mm } （204号
Carrier type: BOX/Tray/L-rack (optional)
·Board transfer: Trolley /AGV (optional) System Interface: Can connect to MES/ERP systems Dimensions: 3 7 0 0 x 1 9 0 0 x 2 0 0 0 0 0 0 （204号
Advantages& Features:
·Specialized for marking defective PCBs with labels like "NG"or"X”.
· Built-in automatic board loading/unloading function, compatible with AGVfor automatic material handling.
·Supports automatictransfer of adhesive pad separator paper,automatic positioning,and marking.
·Automatic Z-axis adjustment design,which can be compatible with PCBs of differentthicknesses by adjusting the Z-axis height during marking. Defect information can be issued by the MES system orobtained by CCD reading the color of defective labels. Equipped with independently developed laser
PCB Inner-Layer Laser Marking Machine (Inline Model)
Equipment Features:
·Laser type:Infrared
·Laser output power:10o-20ow (adjustable)
·Applicable board size: 4 0 0 x 4 0 0 {mm } - 7 0 0 x 8 0 0 {mm }
·Applicable board thickness: 0 . 0 5 { - } 5 \mathsf {mm }
·Minimum code size: 4 \mathsf {mm } x 4 \mathsf {mm } (10 characters)
·Code depth/hole diameter: 0 . 3 {mm } / 0 . 2 {mm }
·Marking time: 1 second (for 4 \mathsf {mm } x 4 \mathsf {mm } code)
·Processing mode: Single-sided / Double-sided (optional)
·Positioning system: Mechanical positioning/ CCD positioning CCD field of view: 8 0 x 8 0 {mm } （204号 System interface: Can connect to MES/ERP and
other systems
Advantages& Features:
· Inline design,can be connected to PCB production lines.
· Supports automatic positioning and marking.
·Automatic Z-axis adjustment design, which can be compatible with PCBs of differentthicknesses by adjusting the Z-axis height during marking.
·Equipped with two independent marking systems, which can complete single-sided or double-sided marking as configured.
·Equipped with independently developed laser marking software.
一站式智能自动化设备/自主研发品牌 One-Stop Automation Equipment/IndependentR&D Brand
Automatic Reflow Line
Equipment Features:
·Automatic copper foil cutting ( 1 / 3 0 z ~ 5 0 z ) （20号 · High accuracy, placement precision ± 1 . 5 \mathsf {mm } ·Copper foil cutting precision ±1mm ·Automatic lamination, high efficiency ·Automatic sandwich lamination (copper foil ^ + mirror plate ^ + copper foil) ·Automatic grinding,cleaning and thickness measurementforsteel plates/mirrorplates
Advantages& Features:
· Controls copper wrinkles and dents,improves product quality
· Compatible with ERP and MES systems, optional QuaSys integration
· Energy-saving,safe and fully automated design for the entire equipment
• Automatic copper foil cutting
· Automatic board unstacking
X-Ray Target Drilling Fully Automatic Line
Equipment Features:
·Cycle time:4-6 panels/minute
·Applicable panel size: MIN 4 0 0 x 4 5 0 {mm } ,MAX620×835mm
·Applicable panel thickness: 0 . 4 { - } 6 . 0 \mathsf {mm }
·Laser power:200w
Advantages& Features:
· Uses X-Ray CCD to locate inner-layer targets and determine the correct orientation for placing circuit boards.
·Reduces operational costs,avoids manual errors,improves production efficiency,and enables automatic intelligence.
· Optional AGVor trolley for loading/unloading,and can connect with upstream and downstream process equipment.
·Compatible with mainframes of different brands and can work with upstream/downstream process equipment such as cutting and grinding lines.
一站式智能自动化设备/自主研发品牌 One-Stop Automation Equipment/ Independent R&D Brand
Fully Automatic PIN Loading& Taping / PIN Unloading& Tape Peeling Line
Equipment Features:
· Reduces drilling machine idle time and improves drilling machine work efficiency.
·Aluminum plate laser marking to prevent material confusion.
·Automatic pin insertion.
·Automatic unloading and stacking.
Advantages& Features:
·Automatically loads core boards,backingboards,and aluminum sheets.
·Electric tape applicator head with high stability.
·Automatic continuous taping on four sides of the board.
· Can be used in conjunction with AGV for online production in daily operations.
Advantages& Features:
·Human-Machine Interface (HMl): Unified control platform compatible with mainstream communication protocols,enabling inter-device connection and communication.
· Intellgent Diagnosis &Alarm: Real-time monitoring of equipment status,with early warnings for tool wear,air pressure abnormalities,paneljams,etc.,to reduce downtime and ensure continuous production.
·Data Traceability: Integrated with MES system for automaticcollection and upload of production data (output,yield rate,equipment status),enabling traceabilityand management to support digital production management.
·Fully Automatic Production Line: From automatic loading \scriptstyle { \mathsf { C C D } } precise positioning $$ highspeed cutting&grinding $$ automatic rounding $$ automaticthicknessmeasurement $$ automatic marking unloading/stacking, the entire process requires no manual intervention,
Main Technical Specifications:
·Applicable board size: 3 0 0 x 3 5 0 0 { m } * 7 6 0 x 6 6 0 {mm } （2 ·Applicable board thickness: 8 \mathsf {mm } ·Supported copper thickness: 0 . 5 { ~ } 3 OZ · Maximum production rate: 2 ~ 5 piece/minute
一站式智能自动化设备/自主研发品牌 One-StopAutomation Equipment/IndependentR&DBrand
AutomaticLoaders and Unloaders for
Dl Fully Automated System with MES& AGV
I Application for Package Substrate Solder Mask Exposure Process
Equipment Features:
· Suitable for solder mask exposure processes · Linear motor driven loading/unloading for quick and smooth operation ·Equipped with a panel flipper to prevent surface scratching,improve yield rate,and reduce labor costs ·Integrated witha PCBlD reader for traceability and verification of processing parameters ·Equipped with ESD Protection and lonizer functions
Optional Features:
· Vision alignment system: Improves alignment accuracy, suitable for FPC and thin panels. ·Compatible with AGVfor automatic panel transportation, enablingunmanned workshop operation. ·Database: Stores production data and connects to MES/ERP systems to enable big data management
Fully Automatic Direct Imaging Exposure System
I Application for FPC Solder Mask Ink Exposure
Equipment Features:
·Applicable to solder mask ink exposure processes of FPC and rigid-flex boards. · Fully automatic operation occupy small production areas
·Equipped with special suction nozzles for flexible boardsand solder mask inks · Supports dual-panel placement
· Includes an NG temporary storage station for defective panels
Standard Specifications:
·Applicable substrate thickness: 0 . 1 ~ 1 . 0 \mathsf {mm } ·Applicable substrate size: 2 5 0 x 3 0 0 ~ 6 0 0 {mm } ·Compatible with separator paper ·Positioning accuracy: ± 0 . 5 \mathsf {mm }
·Applicable to AOl inner/outer layersand FPC boards. W · One-to-two design,compatible with multiple AOl equipment brands on the market. •Adopts a unique suction cup design,capable of absorbing outer-layer through-hole boards.
Standard Specifications:
·Applicable panel thickness: 0 . 0 5 { ~ } 3 . 2 \mathsf {mm } ·Production capacity: 1 panel/15 seconds · Compatible with separator paper ·Dual-panel detection function
·Automatic carrier switching for continuous operation
· Double-sided dust adhering
· Inkjet marking
Optional Features:
·Vision alignment system: Improves alignment accuracy,suitable for FPC and thin panels. ·Compatible with AGVforloading/unloadingand automatic panel transportation,enabling unmanned workshop operation. ·Database: Stores production data and connects to MES/ERP systems to enable big data management
Other Peripheral Automatic Options
Rigid-Flex PCB Dry Film Pre-Laminator
Equipment Features:
·Application: Flexible PCBs,IC package substrates,dry films,dry film type inks,ABF
·Substrate size: MIN 2 5 0 x 2 5 0 {mm } ,MAX 620×520mm
·Substrate thickness: 0 . 0 5 ~ 3 . 0 {mm } （204号
·Dry film cutting accuracy:≤1mm
· Panel conveying speed: 0 . 0 5 { ~ } 5 . 0 \mathsf { m } _ { I } /min (adjustable)
· Cycle time: <=slant 3 5 sec/panel
· Dual-panel arrangement function: 2 5 0 x 5 0 0 {mm } \left( 2 x 1 \right)
• Pre-lamination accuracy: Double-sided pre-lamination accuracy <=slant 1 \mathsf {mm } (including front/back,
Advantages& Features:
· Specifically designed and manufactured to integrate with JSW single-stage vacuum laminators.
· 9 0 ^ { \circ } robotic arm rotation function,enabling dual-panel lamination to meet customer left/right or front/rear layout requirements.
·Built-in cleaning system.
· Improves yield rate and production efficiency of vacuum laminators,resulting in reducing labor costs.
一站式智能自动化设备/自主研发品牌 One-StopAutomation Equipment/IndependentR&D Brand
Advantages& Features:
· Intelligent Logistics: Automatically integrates with MES,providingreal-time reporting of materialbatc time and location, eliminating manual data entry throughout the process.
• High-Precision Pre-Alignment: Achieves precise alignment via CCD before lamination of multi-layer PCBs.
· One-Click Recipe:Supports QR code scanning for fool-proof, with line changeover time < 2 minutes.
•Energy Effciency & Low Consumption: Lower energy consumption than traditional hot presses, reducing water usage by 6 0 % per shift.
•Modular Maintenance: Heating,CCD,and cooling modulesare independently designed,enabling hotswap replacement within 10 minutes and increasing OEE by 8 % AED
Main Technical Specifications:
· Minimum lamination size: 4 0 6 x 4 0 6 { {mm } } · Maximum lamination size: 6 2 0 x 8 2 0 {mm } · CCD alignment accuracy: ± 1 0 \mu { m } · PP Incoming Material Position: AGV& trolley
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Corporate Honors 企业荣誉
品牌荣誉实力认证 Brand Honors,StrengthAccreditation
因为专业所以信赖
Because of Professionalism;WeEarn Your Trust
HongKong Headquarter TEL:+852 2415 6686 FAX:+85224153130 Website:www.wwg-ky.com E-mail:sales@wwg-ky.com
科耀微電子(香港)有限公司KEYAOMICRO-ELECTRONIC(HONGKONG)LIMITED
JiangXiKeYao EquipmentCompanyLimited TEL:+867973555800
