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DH131.022GX1BP.XX810高电流2W2公头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TIN PLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55°C\~+125℃
INSERTIONFORCETEST:5.5KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
PULLOUTFORCETEST:1.0KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
DH231.022XX1BP.XX810高电流2W2母头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
INSERTIONFORCETEST:5.5KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
PULLOUTFORCETEST:1.0KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
DH131.V22GX1BP.XX810高电流2V2公头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKELPLATING; BACK-TIN PLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN
TEMPERATURERATING:-55C\~+125C
INSERTIONFORCETEST:5.5KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
PULLOUTFORCETEST:1.0KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
DH231.V22XX1BP.XX810高电流2V2母头全金PBT黑胶，90度插板，铆合支架+鱼叉
MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40APS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
INSERTIONFORCETEST:5.5KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
PULLOUTFORCETEST:1.0KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
NOTE:
DH241.022GX1BP.A0X10 高电流2W2母头全金PBT黑胶，180度插板
NOTE:
MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
INSERTIONFORCETEST:5.5KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
PULLOUTFORCETEST:1.0KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
DH141.V22GX1BP.A0X10高电流2V2公头全金PBT黑胶，180度插板
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKELPLATING; BACK-TIN PLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN
TEMPERATURERATING:-55C\~+125C
INSERTIONFORCETEST:5.5KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
PULLOUTFORCETEST:1.0KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
DH241.V22XX1BP.A0X10高电流2V2母头全金PBT黑胶，180度插板
NOTE:
MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40APS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
INSERTIONFORCETEST:5.5KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
PULLOUTFORCETEST:1.0KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
DH151.022GX1BP.A0X10高电流2W2公头全金PBT黑胶，焊线式
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TIN PLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40APS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
INSERTIONFORCETEST:5.5KGF(MIN)，
SPEED:25MM/MIN,500CYCLES(MIN)
PULLOUTFORCETEST:1.0KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
DH251.022XX1BP.A0X10高电流2W2母头全金PBT黑胶，焊线式
MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
NOTE:
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
INSERTIONFORCETEST:5.5KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
PULLOUTFORCETEST:1.0KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
DH151.V22GX1BP.A0X10高电流2V2公头全金PBT黑胶，焊线式
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TIN PLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:500OMEGAOHMSMIN
TEMPERATURERATING:-55°C\~+125C
INSERTIONFORCETEST:5.5KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
PULLOUTFORCETEST:1.0KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
DH251.V22XX1BP.A0X10高电流2V2母头全金PBT黑胶，焊线式
NOTE:
MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40APS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55°C\~+125C
INSERTIONFORCETEST:5.5KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
PULLOUTFORCETEST:1.0KGF(MIN),
SPEED:25MM/MIN,500CYCLES(MIN)
DH131.033GX1BP.XX810高电流3W3公头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKEL PLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
DH231.033XX1BP.XX810高电流3W3母头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWER CONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30，OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH131.V33XX1BP.XX810高电流3V3公头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH231.V33XX1BP.XX810高电流3V3母头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKEL PLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40MPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
DH241.033GX1BP.A0X10高电流3W3母头全金PBT黑胶180度插板
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH141.V33GX1BP.A0X10高电流3V3公头全金PBT黑胶180度插板
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH241.V33GX1BP.A0X10高电流3V3母头全金PBT黑胶180度插板
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°℃
DH151.033GX1BP.A0X10高电流3W3公头全金PBT黑胶焊线式
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKEL PLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40MPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
DH251.033GX1BP.A0X10高电流3W3母头全金PBT黑胶焊线式
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWER CONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30，OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH251.V33GX1BP.A0X10 高电流3V3母头全金PBT黑胶焊线式
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
DH131.055XX1BP.XX810高电流5W5公头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKEL PLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125℃C
DH231.055XX1BP.XX810高电流5W5母头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30，OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH241.055GX1BP.A0X10高电流5W5母头全金PBT黑胶180度插板
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
DH251.055GX1BP.A0X10高电流5W5母头全金PBT黑胶焊线式
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH131.088XX1BP.XX810高电流8W8公头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH231.088XX1BP.XX810高电流8W8母头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°℃
DH141.088GX1BP.A0X10高电流8W8公头全金PBT黑胶180度插板
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKEL PLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40MPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
DH241.088GX1BP.A0X10高电流8W8母头全金PBT黑胶180度插板
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30，OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH151.088GX1BP.A0X10高电流8W8公头全金PBT黑胶焊线式
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH251.088GX1BP.A0X10高电流8W8母头全金PBT黑胶焊线式
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
DH131.094XX1BP.XX810高电流9W4公头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°℃C
DH231.094XX1BP.XX810高电流9W4母头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30，OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C838±0.25 $440UNC14.48±0.25 14.48 ± 0.25 90 ± 0.2527
255 00000 中用 出 0.80 甩5.547.77 2AC A: No screw type B Assy screw typeO ① ① ① ① O 1 面 画14,48 47.04 14.48 40A 3.75 4.202.77 219 H 2-23.20 30A 03.20 23.75中10 5,54 7．7 080 10A 1.70 2.20385 CurrentRating 8A 8BP.C.BEDGE Dimension DimensionRECOMMENDED P,C.B LAYOUTDH231-094GX1BP-XX810
2:Female,10A 0:RoHs
4:Female,20A 8:Breaket W/harpoon
6:Female,A 5:4.8\*11.8copperscrews6:4.8\*11.8steelscrews
3: Currentterminal/A J:5.8\*12.8copperscrews
094:9W4 K:5.8\*12.8steelscrews
G: FullGold 0:None
1:1u"2:2u3:3u5:5u" A:No screwtype B:Ass'yscrewtype
6:10u"7:15u8:30u" C:Attachscrewtype
1: FrontNI Back SN P:PBTB: Black
DH141.094GX1BP.A0X10高电流9W4公头全金PBT黑胶180度插板
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH241.094GX1BP.A0X10高电流9W4母头全金PBT黑胶180度插板
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
NOTE:
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°℃
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKEL PLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH251.094GX1BP.A0X10高电流9W4母头全金PBT黑胶焊线式
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30，OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH132.133XX1BP.XX810高电流13W3公头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH232.133XX1BP.XX810高电流13W3母头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40MPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
DH241.133GX1BP.A0X10高电流13W3母头全金PBT黑胶180度插板
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH151.133GX1BP.A0X10高电流13W3公头全金PBT黑胶焊线式
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH251.133GX1BP.A0X10高电流13W3母头全金PBT黑胶焊线式
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
DH132.172XX1BP.XX810高电流17W2公头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKEL PLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:500MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH232.172XX1BP.XX810高电流17W2母头全金PBT黑胶，90度插板，铆合支架+鱼叉
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD: MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30，OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRIC WITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C 104±0 47.04 ±0.25 38.38±0.25 #440UNC 13.82 ±0.25 13.82 ±0.25 90±0.25 2,77 ① 用 田 0.80 面 A C A No sorew ype B: syscrew hpe 22 ? 中 MMMrU T 1 面 面 2.84 ± 0.25 47,04 40A 03.75 04.20 21.138 30A 23.20 03.75 2-23.20 20A 2.80 3.28 . 10A 1.70 2.20 1 0 485 1800 A B ) 1.385 CurrentRating Dimension Dimension P.C.B EDGE RECOMMENDED P.C.B LAYOUT DH232-172GX1BP-XX810
2:Female,10A L 0:RoHs
4:Female,20A 8:BreaketW/harpoon
6:Female,30A
8:Female,40A 5:4.8\*11.8copperscrews 6:4.8\*11.8steel screws
3:CurrentterminalR/A J:5.8\*12.8oopperscrews
172:17W2 K:5.8\*12.8steelscrews
G:FullGold 0: None
1:1u2:2u"3:3u5:5u A:No screwtype B:Ass'yscrewtype
6:10u7:15u8:30u C: Attach screwtype
1: FrontNI Back SN P:PBT B: Black
DH141.172GX1BP.A0X10高电流17W2公头全金PBT黑胶180度插板
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DH241.172GX1BP.A0X10高电流17W2母头全金PBT黑胶180度插板
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
DH151.172GX1BP.A0X10高电流17W2公头全金PBT黑胶焊线式
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEEL MATERIAL,FRONT-NICKEL PLATING; BACK-TINPLATING CONNECTORINSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30,OR40MPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:5000MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125°C
DH251.172GX1BP.A0X10 高电流17W2母头全金PBT黑胶焊线式
NOTE:
0 MATERIALSANDFINISHED
SHELL:STEELMATERIAL,FRONT-NICKELPLATING; BACK-TINPLATING CONNECTOR INSULATOR:PBTTHERMOPLASTIC, 30%GLASSFILLED,UL94V-0RATED HIGHPOWERCONTACTMATERIAL:BRASS FOOTHOLD:MATERIAL:SPCC,NICKELPLATING
ELECTRICALCHARACTERISTICS
HIGHPOWERCONTACTCURRENTRATING:
10,20,30，OR40AMPS
HIGHPOWERCONTACTRESISTANCE:2.7MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:
1000VACFOR1MINUTE
INSULATIONRESISTANCE:50O0MEGAOHMSMIN.
TEMPERATURERATING:-55C\~+125C
DVFC1-245XXXXP-XX210DVI(24+5)180度焊线式,铆合铆钉+COVER
NOTE:
0 MATERIALSANDFINISHED INSULATOR:PA66+30%GFUL94V-0, SHELL:STEEL,FINISHEDSEEPART NO. CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED RIVETEDINSERT:BRASSMATERIAL,TINFINISHED WITH#4-40THREADEDASSEMBLED
ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDCVOLTAGERATING:40VDCCONTACTRESISTANCE:20MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN.INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICALMATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTALOPERATINGTEMPERATURE:-55C\~+85°CSTORAGETEMPERATURE:-55°C\~+105C
DVFC1-240XXXXP-XX210DVI(24+0)180度焊线式,铆合铆钉+COVER
NOTE:
MATERIALSANDFINISHED INSULATO:PA66+30%GFUL94V-0, SHELL:STEEL,FINISHEDSEEPARTNO. CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED RIVETEDINSERT:BRASSMATERIAL,TINFINISHED WITH#4-40THREADEDASSEMBLED
ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDC
VOLTAGERATING:40VDC
CONTACTRESISTANCE:20MILLIOHMSMAX.
DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICAL MATINGFORCE: 4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTAL
OPERATINGTEMPERATURE:-55C\~+85°CSTORAGETEMPERATURE:-55°C\~+105C
DVFC2.240XXXXP.A0X30DVI(24+0)180度焊线式，前铆5.5实心螺母
NOTE:
0 MATERIALSANDFINISHED INSULATOR:PBT+30%GFUL94V-0, SHELL:STEEL,FINISHEDSEEPARTNO. CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED RIVETEDINSERT:BRASSMATERIAL,TINFINISHED WITH#4-40THREADEDASSEMBLED
0 ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDC
VOLTAGERATING:40VDC
CONTACTRESISTANCE:20MILLIOHMSMAX.
DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN.INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICALMATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTALOPERATINGTEMPERATURE:-55C\~+85CSTORAGETEMPERATURE:-55C\~+105°C
DVFC2.245XXXXP.A0X30DVI(24+5)180度焊线式，前铆5.5实心螺母
NOTE:
0 MATERIALSANDFINISHED INSULATOR:PBT+30%GFUL94V-0, SHELL:STEEL,FINISHED SEEPARTNO. CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED RIVETED INSERT:BRASSMATERIAL,TINFINISHED WITH#4-40THREADEDASSEMBLED
ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDC
VOLTAGERATING:40VDC
CONTACTRESISTANCE:20MILLIOHMSMAX.
DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN.INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICALMATINGFORCE:4.5Kgf MAX. UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTALOPERATINGTEMPERATURE:-55C\~+85°CSTORAGETEMPERATURE:-55°C\~+105C
DVFC3-245XXXXP-XX270DVI(24+5)180度焊线式铆合8.25铆钉
NOTE:
0 MATERIALSANDFINISHED INSULATOR:PA66+30%GFUL94V-0, SHELL:STEEL,FINISHEDSEEPARTNO. CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED RIVETEDINSERT:BRASSMATERIAL,TINFINISHED WITH#4-40THREADEDASSEMBLED
ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDCVOLTAGERATING:40VDCCONTACTRESISTANCE:20MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN.INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICALMATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTALOPERATINGTEMPERATURE:-55C\~+85°℃CSTORAGETEMPERATURE:-55C\~+105C
DVFC3-241XXXXP-XX270DVI(24+1)180度焊线式,铆合8.25铆钉
NOTE:
MATERIALSANDFINISHED INSULATOR:PA66+30%GFUL94V-0, SHELL:STEEL,FINISHEDSEEPARTNO. CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED RIVETEDINSERT:BRASSMATERIAL,TINFINISHED WITH#4-40THREADEDASSEMBLED
ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDC
VOLTAGERATING:40VDC
CONTACTRESISTANCE:20MILLIOHMSMAX.
DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTAL
OPERATINGTEMPERATURE:-55C\~+85°CSTORAGETEMPERATURE:-55°C\~+105°C
NOTE:
0 MATERIALSANDFINISHED INSULATOR:PBTRG3030%G.F,UL94V-0, CONTACT:COPPERALLOY FRONTSHELL:SPCC,NICKELORGOLDPLATING BACKSHELL:SPCC,TINNEDPLATING
ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDC
VOLTAGERATING:40VDC
CONTACTRESISTANCE:20MILLIOHMSMAX.
DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTALOPERATINGTEMPERATURE:-55C\~+85CSTORAGETEMPERATURE:-55C\~+105C
Y.3JS25P.XXNXX DVI(24+1)公头焊线式
NOTE:
0 MATERIALSANDFINISHED INSULATOR:PBTRG3030%G.F,UL94V-0, CONTACT:COPPERALLOY FRONTSHELL:SPCC,NICKELORGOLDPLATING BACKSHELL:SPCC,TINNEDPLATING
0 ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDC
VOLTAGERATING:40VDC
CONTACTRESISTANCE:20MILLIOHMSMAX.
DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTAL
OPERATINGTEMPERATURE:-55°C\~+85CSTORAGETEMPERATURE:-55°C\~+105℃
Y.3JS19P.XXEXXDVI（18+1)公头焊线式，前铆5.5螺母
NOTE:
0 MATERIALSANDFINISHED INSULATOR:PBTRG3030%G.F,UL94V-0, CONTACT:COPPERALLOY FRONTSHELL:SPCC,NICKELORGOLDPLATING BACKSHELL:SPCC,TINNEDPLATING
0 ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDC
VOLTAGERATING:40VDC
CONTACTRESISTANCE:20MILLIOHMSMAX.
DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTALOPERATINGTEMPERATURE:-55C\~+85CSTORAGETEMPERATURE:-55C\~+105C
DVFR1-245XXXXP-XX210DVI(24+5)90度插板式
NOTE:
0 MATERIALSANDFINISHED INSULATOR:PA66+30%GFUL94V-0, SHELL:STEEL,FINISHEDSEEPARTNO. CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED RIVETEDINSERT:BRASSMATERIAL,TINFINISHED WITH#4-40THREADEDASSEMBLED
0 ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDC
VOLTAGERATING:40VDC
CONTACTRESISTANCE:20MILLIOHMSMAX.
DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
ENVIRONMENTAL
OPERATINGTEMPERATURE:-55C\~+85°℃STORAGETEMPERATURE:-55°C\~+105C
NOTE:
0 MATERIALSANDFINISHED INSULATOR:PA66+30%GFUL94V-0, SHELL:STEEL,FINISHEDSEEPARTNO. CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED RIVETEDINSERT:BRASSMATERIAL,TINFINISHED WITH#4-40THREADEDASSEMBLED
ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDCVOLTAGERATING:40VDCCONTACTRESISTANCE:30MILLIOHMSMAX.DIELECTRICWITHSTANDINGVOLTAGE:50OVACMIN.INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICALMATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTALOPERATINGTEMPERATURE:-55C\~+85CSTORAGETEMPERATURE:-55°C\~+105°C
DVFS1-245XXXXP-XX210 DVI(24+5)180度插板式，铆合8.25铆钉
NOTE:
0 MATERIALSANDFINISHED INSULATOR:PA66+30%GFUL94V-0, SHELL:STEEL,FINISHEDSEEPART NO. CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED RIVETEDINSERT:BRASSMATERIAL,TINFINISHED WITH#4-40THREADEDASSEMBLED
0 ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDC
VOLTAGERATING:40VDC
CONTACTRESISTANCE:20MILLIOHMSMAX.
DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTAL
OPERATINGTEMPERATURE:-55°C\~+85CSTORAGETEMPERATURE:-55C\~+105°C
DVFS2-245XXXXN-XXX10DVI(24+5)180度插板式，铆合铜柱+圆孔后盖
NOTE:
0 MATERIALSANDFINISHED INSULATOR:PA66+30%GFUL94V-0, SHELL:STEEL,FINISHEDSEEPARTNO. CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED RIVETEDINSERT:BRASSMATERIAL,TINFINISHED WITH#4-40THREADEDASSEMBLED
0 ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDC
VOLTAGERATING:40VDC
CONTACTRESISTANCE:20MILLIOHMSMAX.
DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTAL
OPERATINGTEMPERATURE:-55°C\~+85°CSTORAGETEMPERATURE:-55°C\~+105°C
37.60 ± 0.38 32.51 ±0.25 24.03 ± 0.15 13.335 4-40UNC 1.905 8.2 5 0 2.54 455 D3 ）g 9505 25335 T 2540 13.335 7．70 B: Ass'y screw type C: Atachsoew tpe4,85.8) ePart 2-23.20 1.905 CKT CIN C2 oee 品 00000 业 Ω #4-40UNC 1 000 CKT2C 24-20.86 1.905 6-20.66 RECOMMENDED P.C.B LAYOUT DVFS2-245XXXXN-XXX10
Female 0:RoHs
S2:Straight Pin 1: Dim.C=2.70
(W/PlasticCover) A:DimA=9.60/Dim.B=7.80
180:18+0Pin 185:18+5Pin G:Dim.A=8.80/Dim.B=7.00
240:24+0Pin 245:24+5Pin K:DimA=8.50/Dim.B=7.00/Dim.C=3.00
S:Selevite Gold Bright TIN 1:Dim.A=6.20/Dim.B=4.40 2:Dim.A=9.10/Dim.B=7.30
1:G/F"2:2u3:3u6:10u"7:15u" 3:DimA=10.0/Dim.B=8.20
1.FrontNI Back SN 4:DimA=10.5/Dim.B=8.70
2.FrontGoldBack SN 5.FullNI 5:Dim.A=11.5/Dim.B=9.70 6:DimA=12.0/Dim.B=10.2
B:BlackW:Wihte 7:Dim.A=14.0/Dim.B=12.2
N: PA66 9:DmA-14.5DmB=12.7
A: NoscrewtypeB:Ass'yscrewtype C:Attach screw type
0:None1:4.8\*8.5CopperScrews2:4.8\*8.5SteelScrews5:4.8\*1.8CopperScrews6:4.8\*1.8Steelcrews
DVFS4-245XXXXN-XX3X0DVI(24+5)180度插板式，铆合4.90铆钉
NOTE:
MATERIALSANDFINISHED INSULATOR:PA66+30%GFUL94V-0, SHELL:STEEL,FINISHEDSEEPARTNO. CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED RIVETEDINSERT:BRASSMATERIAL,TINFINISHED WITH#4-40THREADEDASSEMBLED
ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDC
VOLTAGERATING:40VDC
CONTACTRESISTANCE:20MILLIOHMSMAX.
DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTAL
OPERATINGTEMPERATURE:-55C\~+85°CSTORAGETEMPERATURE:-55°C\~+105°C
NOTE:
0 MATERIALSANDFINISHED INSULATOR:PBT+30%G.F,UL94V-0, CONTACT:COPPERALLOY FRONTSHELL:SPCC,NICKELORGOLDPLATING BACKSHELL:SPCC,TINNEDPLATING
0 ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDC
VOLTAGERATING:40VDC
CONTACTRESISTANCE:20MILLIOHMSMAX.
DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTALOPERATINGTEMPERATURE:-20°C\~+85°℃
Y.3JM29S.XXNXXDVI(24+5)母头夹板式
NOTE:
0 MATERIALSANDFINISHED INSULATOR:THERMOPLASTIC,NYLON CONTACT:COPPERALLOY FRONTSHELL:SPCC,NICKELORGOLDPLATING BACKSHELL:SPCC,TINNEDPLATING
0 ELECTRICALCHARACTERISTICS
CURRENTRATING:1.5AMPDC
VOLTAGERATING:40VDC
CONTACTRESISTANCE:20MILLIOHMSMAX.
DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0-4.0Kgf
0 ENVIRONMENTAL
OPERATINGTEMPERATURE:-55°C\~+85°CSTORAGETEMPERATURE:-55C\~+105°C
HDFAV1-19XX5BL-X11X0HDMI19PinA母直立式SMT型
HDFAV2-19XXXBL-211X0HDMI19PAF直立式SMT型（脚长1.9)，带脚支架（高5.8mm,脚距=26.5mm）
NOTE:
0 MATERIALSANDFINISHED INSULATOR:LCPUL-94V0, COVER:LCPUL-94V0 SHELL:SEEPARTNO,NIFINISHED FRAME:SPCC,NIFINISHED CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED
ELECTRICALCHARACTERISTICS CONTACTCURRENTRATING:0.5AMPS CONTACTVOLTAGERATING:40VAC CONTACTRESISTANCE:20mΩMAX. DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:1000MQMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0Kgf MIN
0 ENVIRONMENTAL TEMPERATURERATING:-40C\~+100°C
HDFAV3-19XX5BL-211X0（HDMI19PAF直立式SMT型，支架（高8.4MM带平角螺丝孔无脚）
NOTE:
MATERIALSANDFINISHED HOUSING:LCPUL94V-0 CAP:LCPUL94V-0 CONTACT:BRASS,SELEVITEGOLDFINISHED SHELL:BRASS,NICKELPLATED FRAME:SPCC,NICKELPLATED
ELECTRICALCHARACTERISTICS
CONTACTRATING:0.5AMP VOLTAGERATING:40VAC CONTACTRESISTANCE:20MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:1000MEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0Kgf MIN
0 ENVIRONMENTAL TEMPERATURERATING:-40C\~+100°C
HDFAV4-19XX5BL-211X0HDMI19PAF直立式SMT型带脚支架(高=8.4,脚距=26.5，带脚）
NOTE:
0 MATERIALSANDFINISHED HOUSING:LCPUL94V-0 CAP:LCPUL94V-0 CONTACT:BRASS,SELEVITEGOLDFINISHED SHELL:BRASS,NICKELPLATED FRAME:SPCC,NICKELPLATED
ELECTRICALCHARACTERISTICS
CONTACTRATING:0.5AMP VOLTAGERATING:40VAC CONTACTRESISTANCE:20MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:50OVACMIN. INSULATIONRESISTANCE:1000MEGAOHMS MIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0KgfMIN
0 ENVIRONMENTAL TEMPERATURERATING:-40C\~+100°C
NOTE:
ELECTRICALCHARACTERISTICS CURRENTRATING:0.5AMP VOLTAGERATING:40V CONTACTRESISTANCE:30MILLIOHMSMAX NSULATIONRESISTTANCE:100MMIN.@500VDC DIELECTRICWITHSTANDINGVOLTAGE:500VACFOR1MINUTE
MECHANICALCHARACTERISTICS
INSERTIONFORCE:4.5KGFMAX.WITHDRAWINGFORCE:1KGF\~4KGF.ENVIRONMENTALOPERATINGTEMPERATURE:-25C\~+85℃
HDFAV1.19M15BL.X1220（HDMI19PAF直立式SMT型加EMI弹片）
NOTE:
0 MATERIALSANDFINISHED INSULATOR:LCPUL-94V0, COVER:LCPUL-94V0 SHELL:BRASS/Stainlesssteel,NI FINISHED CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED
ELECTRICALCHARACTERISTICS
CONTACTCURRENTRATING:0.5AMPS CONTACTRESISTANCE:20MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:50OVACMIN. INSULATIONRESISTANCE:100MEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0Kgf MIN
ENVIRONMENTAL
TEMPERATURERATING:-55C\~+105C
NOTE:
MATERIAL
HOUSING AND BRACKET:HIGHTEMP.THERMOPLASTIC,UL94V-0COLOR:BLACK. CONTACT:COPPERALLOY,THICKNESS=0.20MMSHIELD: COPPERALLOY,THICKNESS=0.50MM
FINISHCONTACT:GOLD PLATING ONCONTACTAREASEENOTEG/FPLATED ON SOLDER TAILS50u" MIN.NICKEL UNDER PLATED OVERALLSHIELD: 50u"MIN. NICKEL PLATED OVER ALL
MECHANICALCHARACTERISTICSINSERTIONFORCE:44.1NMAX MATINGCYCLE:10000CYCLESEXTROCTIONFORCE:9.8NMIN,39.2NMAX
ELECTRICALCHARACTERISTICSRATINGCURRENT:0.5ARATINGVOLTAGE:40VCONTACTRESISTANCE:10MILLOHMSOHMSMAX(EXCLUDING CONDUCTORRESISTANCE)INSULATIONRESISTANCE:a,UNMATED:100MOHMSMINAT500VDCb,MATED:10MOHMSMINAT150VDCDIELECTRICWITHSTANDINGVOLTAGE:300VAC/IMINUTEOPERATINGTEPERATURE:-20°C\~+85°CSTORAGETEMPERATURE:-20°C\~+65°C
0.90±0.05 PINSignalAssignment PIN Signal Assignment 1 TMDSData2+ 11 TMDSClock Shield 2 TMDSData2Shield 12 TMDSClock3 TMDSData2- 13 CEC 4 TMDSData1+ 14 Utity NO.1 5 TMDSData1Shield 15 SCL 9.00 10.80 ±0,10 5.00 6 TMDSData1- 16 SDA −14,000.04 17.50 7 TMDSData0+ 17 DDCICECGround WITHOUT COVER 8 TMDSData0Shield 18 +5VPower 9 TMDSData0- 19 HotPlugDetect 2000 PIN19.00±0.10 PIN19 10 TMDSClock+ 13 15.00 6.20 0006.0 事 10000 H N.10NO.19 二 中 11 1555.L 4.2 0.30±0.03 -9.00 0.50 ±0.03 mmc 0.10 UREO 0.50±0.05 14.5.29± 0.04 0.20 ± 0.04（19x) 2-1.0±05 WA H GHDFAV9-19G15BL-B1220 HD:HDMI 0:RoHs F:Female 1: Tray2:Tape&Reel A:AType 12:H=15.0,dima=1.9 13:H=15.0,dima=1.5 V:180°,SMT C:Shel(spcc) B:Shell(oopper) 19:19PIN L: LCP G GldteGold Bnght TIN B: Black M: Selevite Gold Matte TIN 4: FullGold5:FullNi 1:G/F"2:2u3:3u" 5:5U"6:10u"
GHDFAV9.19M15BL.C0120HDMIAF19P180°立式LCP黑半金GF铁壳鍍镍立贴13mm卷装
NOTE:
0 MOPERATINGCURRENT:0.5AMAX.
0 OPERATIONTEMPERATURE:-25C\~+85C
0 DIELECTRICWITHSTANDINGVOLTAGE:500VoItsACBETWEENADIACENTTERMINAL(UNMATE)300VoItsACBETWEENADIACENTTERMINAL(MATE)
0 INSULATIONRESISTANCE:100MohmMIN.(UNMATED);10MohmMIN.(MATED)5.HDMISPECIFICATIONCOMPLIANCE
0 盐雾测试：国际标准要求，温度35℃，浓度5%的盐水，24H，用清水洗净后观测，产品无氧化、无锈蚀
0 寿命测试：≥10000次14.508\*1.00=8.00 22 1.608
Pin 2 -Pin 188① 4 20.90.50母060 9\*1.00=9.00 Pin 19 8 Pin 01/ 421021 10
Pin 1 - 14.0000 RECOMMENDEDPLOU：)TOLERANCE UNSPECIFIED ±0.05mm17.50 ④ 6.10① N 国 10 中010 150中 国
0.50 0.80.1 1.10 中 园14.50 6.60 26 0.909.00 4 DUSTCOVER 1 THERMOPLASTICUL94V-0③ 40.21 0.20 COPPERALLOYGOLDPLATEDOVERNICKEL3 CONTACTS 19 ONCONTACTAREAAND10Ou\*MIN.TINPLATEDOVERNICKELONSOLDERTAILS2 HOUSING 1 THERMOPLASTICUL94V-01 SHELL 1 COPPERALLOYORSPCCNICKELPLATEDITEM NAME Q'TYNOTESGHDFAV9-19M15BL-C0120HD: HDMI 0:RoHsF:Female 1: Tray2:Tape& ReelA:AType 01:H=13.0DIP=2.7V:180°,SMTTYPE C:Shel(spoc)19:19PIN L: LCPG: Gold Plating B:BlackS:SeleviteGold Bright TIN 4: FullGold 5: Full NiM: Selevite GoldMatte TIN 1:G/F"2:2u3:3u 5:5U"6:10u"7:15u"
HDFAD1.19M15BL.U112H(HDMI19PAF90度DIPTYPE反向沉板CH=0.5)
SPECIFICATIONS:
0 LowLevel ContactResistance:10Miliohms Max. 0 Dielectric Withstanding Voltage:
500VAC Between AdJacent Terminal OrGround,No Breakdown(Unmated)
300VAC Between AdJacent Terminal Or Ground,No Breakdwen(Mated) Insulation Resistance:100 Megohms Min.(Unmated)
10Megohms Min.(Mated) 0 InsertionForce:4.5Kgf Max. Extraction Force: Initail:1.0\~4.0Kgf.After2001To10000Cycles:0.5\~4.0Kgf.
NOTE:
0 MATERIAL:Molding:LCP，UL94V-0,Color:Black. Terminal: Copper Alloy.Shell:SUS304.
FINISH: Terminal Plating: Gold Flash. Solder Plating:Mate Tin100\~200u"Under Plating:Ni50u" Min Shell: Soldering Ni30\~80u"
HDFAD1.19M15BL.U212H(HDMI19PAF90度DIPTYPECL=3.10mm)
NOTE:
0 MATERIALSANDFINISHED INSULATOR:LCP UL-94V0, COVER:LCPUL-94V0 SHELL:SUS304NIFINISHED CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED
ELECTRICALCHARACTERISTICS
CONTACTCURRENTRATING:0.5AMPS CONTACTRESISTANCE:20MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:50OVACMIN. INSULATIONRESISTANCE:100MEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX.UNMATINGFORCE:1.0KgfMIN
ENVIRONMENTAL
TEMPERATURERATING:-55C\~+105C
GHDFAD2.19S15BL.B5110(HDMI19PINAF90度DIPTYPE,DIP(三排))
NOTE:
0 MATERIAL TERMINAL:C2680HT=0.25 HOUSING:LCP+30%G/F.,UL94V-0BLACK COVER:LCP+30%G/F.,UL94V-0BLACK SHELL:C2680HT=0.50
PLATINGTERMINAL:1U"MIN.GOLDINCONTACTAREA 100UMIN.MATTESNPLATEINSOLDERAREA. OVER50U"MIN.NI. SHELL:50U"NICKELPLATED OVERALL.
ELECTRICAL
CURRENTRATING:1.5A
RATEDVOLTAGE:30VMAX
TEMPERATURE:-55°C\~+85C
CONTACTRESISTANCE:30MΩ
INSULATIONRESISTANCE:1000MΩMIN
DIELECTRICWITHSTANDINGVOLTAGE:APPLY500VAC FOR1MINUTEBETWEENADJACENTTERMINALORGROUND. INSERTIONFORCE:3.5NMAXWITHDRAWALFORCE:10NMIN
GHDFAE0.19M15BL.B2221（HDMIAF侧插式铜壳四直脚四正反弹片，脚长2.3mm，针长1.9mm无盖，卷带包装）
NOTE:
ELECTRICALCHARACTERISTICS
CURRENTRATING:0.5AMP
VOLTAGERATING:40V
CONTACTRESISTANCE:30MILLIOHMSMAX
INSULATIONRESISTTANCE:100MMIN.@500VDC
DIELECTRICWITHSTANDINGVOLTAGE:500VACFOR1MINUTE
MECHANICALCHARACTERISTICS
INSERTIONFORCE:4.5KGFMAX.
WITHDRAWINGFORCE:1KGF\~4KGF.
LIFETEST:10000CYCLES
OPERATINGTEMPERATURE:-25CTO+85℃PARTNO.DESCRIPTION
GHDFAF0-19S14BL-C1210HDMIAF19P夹板式LCP黑胶，端子半金锡GF铁壳全金GF，夹板1.60mm喇叭口盘装
SPECIFICATIONS:
0 MATERIALSANDFINISHED INSULATOR:LCPUL-94V0, COVER:LCPUL-94V0 SHELL:BRASS/SPCC/STAINLESSSTEEL,NIFINISHED CONTACTMATERIAL:COPPERALLOY,SELEVITEGOLDFINISHED
0 ELECTRICALCHARACTERISTICS
CONTACTCURRENTRATING:0.5AMPS CONTACTRESISTANCE:30MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:10OMEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX. UNMATINGFORCE:1.0KgfMIN
0 ENVIRONMENTAL TEMPERATURERATING:-20°C\~+85C
GHDMAF0-19S14BL-C1210（HDMIAM19P夹板式LCP黑胶端子半金锡GF铁壳全金GF夹板1.60mm喇叭口盘装）
NOTE:
0 MATERIALSANDFINISHED INSULATOR:LCPUL-94V0, COVER:LCPUL-94V0 SHELL:BRASS/SPCC/STAINLESSSTEEL,NIFINISHED CONTACTMATERIAL:COPPERALLOY,SELEVITEGOLDFINISHED
0 ELECTRICALCHARACTERISTICS
CONTACTCURRENTRATING:0.5AMPS CONTACTRESISTANCE:30MILLIOHMSMAX. DIELECTRICWITHSTANDINGVOLTAGE:500VACMIN. INSULATIONRESISTANCE:100MEGAOHMSMIN.
MECHANICAL MATINGFORCE:4.5KgfMAX. UNMATINGFORCE:1.0Kgf MIN
0 ENVIRONMENTAL
TEMPERATURERATING:-20°C\~+85C
GHDFDS1.19X15XL.P112H(MICROHDMITypeD19Pin板上型CH=1.55双排SMT外壳前插后贴(01款))
NOTE:
MATERIALS
HOUSING: LCP+30% G/F,BLACK,UL94 V-0;CONTACT: PHOSPHOR COPPER(C5191),GOLD PLATINGAT MATING AREA,MATTE TIN ORAU PLATING AT SOLDER TAIL,ALL OVER NICKEL;SHELL:PHOSPHORCOPPER(C5191);
RATINGS:CURRENTRATING:0.3AOPERATING TEMPERATURE: -40℃C\~85°C
ELECTRICALREQUIREMENT:LLCR:EXCLUDING CONDUCTORRESISTANCE10MQMAX.(TARGETDESIGNVALUE),CONTACT:30MQMAX. CHANGED(FINAL),SHELL:50MQMAX.CHANGED (FINAL);DIELECTRICWITHSTANDINGVOLTAGE:150VAC(RMS)FOR1MINUTE(MATED),250VAC(RMS)FOR1MINUTE(UNMATED);INSULATIONRESISTANCE:10MΩMIN.@150VDC(MATED)，100MΩ MIN.@500VDC (UNMATED);
MECHANICALPERFORMANCEINSERTIONFORCE: 44.1N(4.5KGF)MAX.WITHDRAWALFORCE: 4.9\~25N (0.5\~2.5KGF);DURABILITY LIFE: 5,000 CYCLES;
IR REFLOW: THE PEAK TEMPERATURE ON BOARD SHALL BEMAINTAINED FOR10 SECONDSAT 260±5C3.6088 0.20 3.20Mylar P 0.40 19-0.23 32-2.408 5 PINSignalAssignment1 HotPlug Detect3.00 PCBEDGE 2 Utity
1 0.0090 4.300.02 580 Pn15 REOECEYUTWEW 7.50 6 5 34 TMDSData2shied TMDSData2- TMDSData1+H 7 TMDSData1 ShieldA8 TMDSData1-C Pin2 19-0.7 All soldering tail 9 TMDSData0+6.20 0.30±0.03 2.40 3．75 1.20 ±0.05 Contact 10 TMDSData0Shield5.10 1 TMDSData0-12 TMDSClock+Plug SogngMPoin 13 TMDSClock Shield□电 14 TMDSClock-Pin18 Pin2 15 CEC@ ③ 16 DDCICECGroundPin19 Pin1 0.4Min 17 SCL
19-0.16±0.05 3.200.40 C 0.20 1.0 Min. 4.05 1.0 Min 18 SDA3.60 Receptacle and Plug Mated Condition 19 +5VPowerGHDFDS1-19X15XL-P112HHD:HDMI 2:TAPEREELPARKAGEF:Female 1: Frontinsert plate and backD:DType patch (01type)SHELLMATERIALS:SMT.R/A P:PhosphorCoppel19:19PINL: LCFG: Full Gold COLORSTYLE B:BlackW:White(BeigeM:SeleviteGoldMatte TIN SHELLFINISH5:FulIN1: GoldFLASH2:2u"7:15u"9:1U"
GHDFDS1.19X15XL.P212H(MICROHDMITypeD19Pin板上型CH=1.55双排SMT外壳前后插(02款))
NOTE:
MATERIALS
HOUSING:LCP+30% G/F,BLACK,UL94V-0; CONTACT:PHOSPHORCOPPER(C5191),GOLD PLATINGATMATING AREA, MATTETINORAUPLATINGATSOLDERTAIL,ALLOVERNICKEL; SHELL: PHOSPHORCOPPER(C5191);
RATINGS:CURRENTRATING:0.3A OPERATING TEMPERATURE:-40℃C\~85°C
ELECTRICALREQUIREMENT: LLCR:EXCLUDING CONDUCTORRESISTANCE10MΩMAX.(TARGETDESIGNVALUE), CONTACT:30MΩMAX.CHANGED(FINAL),SHELL:50MQMAXCHANGED(FINAL); DIELECTRIC WITHSTANDINGVOLTAGE:150VAC(RMS)FOR1MINUTE(MATED), 250VAC(RMS)FOR1MINUTE(UNMATED); INSULATIONRESISTANCE:10MQMIN.@150VDC(MATED) 100MΩMIN. @500VDC(UNMATED);
MECHANICALPERFORMANCE INSERTIONFORCE: 44.1N(4.5KGF)MAX. WTHDRAWALFORCE:4.9\~25N(0.5\~2.5KGF)； DURABILITY LIFE: 5,000 CYCLES;
IRREFLOW: THEPEAKTEMPERATURE ON BOARD SHALL BE MAINTAINED FOR10 SECONDS AT 260±5C 3.60 Mylard 8818 0.203.20 19-0.23 3 @ 2 用 PINSignal Assignment 1 Hot Plug Detect 6.50 .00 6.20 2 PCB EDGE 2 Utity 00+09 5.90±0.03 RECOMMENDLOUPEW) 34 TMDSData2Shied 4.00.02 en 7537 5 TMDSData2- Pin19 8 =HO 6 TMDS Data1+ 0王0 WWWR 8 8 7 TMDSData1Shield N Pin18 6.20 0.30.03 15 2-0005 Alsolderigal 89 TMDSData1- 2.403.75 10 TMDSData0Shield 5.10 11 TMDSData0- 电 12 TMDSClock+ Plug Spngs poin Pin18 □ 中 Pin2 134 TMDSClockShield 15 CEC Pin19 Pin1 16 DDCICECGround 19-0.16±0.05 C 0.20 0.4 Min, 17 SCL 320 “0.40 1,0 Min 4.05 1.0Min. 18 SDA Receptace and Plug Mated Condition 19 +5VPower GHDFDS1-19X15XL-P212H
HD: HDMI 2:TAPEREELPARKAGE
F: Female 1: Frontinsertplateand back
D:DType patch (02type) SHELLMATERIAL
S:SMT.R/A P: Phosphor Copper
19:19PIN L: LCP
G:Full Gold COLORSTYLE B:BlackW:White(Beige
1: Gold FLASH SHELL FINISH5:FulIN
SD CARD SERIES
10.78 9.58 0.8 30 88 2 P19# P1# 3.13 T0.15±002 19-0.30 ± 0.05 AAAAA 09 L2RAAAAAA 0 0.1 中 .80 0080 10 PIN NAME DESCRPTION 口 口 09 011 。 2DAT2 DATAUNEBIT2 12 VSS3GROUND VSS3 DATANETZ 3 D0+ DIFFERENTIALDATEO+ □ CTEC 送 3.0 D 1.000.0 4 CDDAT3CARDDETECTIDATALNEBI3 5 D0- DIFFERENTIALDATEO10.78 67 CMD COMAIEIES NOTE: 2.45 P19# 19-0.50 8VSS1SUPPLYVOLTAGEGROUND 11.91 80 .95 -P1# 9 VSS4 GROUND 1.ALLDIAMTININLAENMILLIMETERS N 一 2-01.70 1VODOSUPYOT 3.CURRENTRATING:1AMPSMAX. 智 12808 201 8 最 11213 1000 O 4.CONTACTRESISTANCE:100MOHMSMAX. GND 13CLK 5.IELATRNSTANDEHMN50UTE 1111 1.80 1415 D1t2 DFEITLIEA 7.OPTERATINGTEMPERATURE:-20°CTO+60°C DETECT CARD 7 CARD OUT −8# 7# CARD INSERT 七8# LOF26.25 0.50 3 16VSS5GROUND 8.STORAGETEMPERATURE:-40CTO+70°℃ PROTECTREPROTECTD ERTECTEITEENABDE TORECEESEUS 17DAT DATAINET E:PADAREA 19WPWRITEPROTECT
MATERIAL ：GEPPATTERNONLY 1.HOUSING:LCPE130I(UL94V-0)BLACK. 2.CONTACTS:PHOSPHORBRONZE(C5210R-EH) 3.SHELL:BRASS SD1001-19M17BL-0001H
PLATING Ontheboard Type 4.0] 一 conventional 1.CONTACTS:50U"MINNICKELUNDERPLATED，100UMIN SNPLATEDSOLDERTAILS.1U"MINGOLDPLATED CONTACTAREA 19:19PIN L: LCP 2.SHELL:50U"MINNICKEL(LEAD-FREE)UNDERPLATED; M: Selevite Gold Matte TIN B:Black GOLD1U"MINPLATED OVERNICKELATSOLDERARED. 1:1u”7:15u8:30U" 7: Copper shell
NOTE:
1.ALLDIMENSIONS ARE INMILLIMETERS.
2.OPERATIONVOLTAGE:10VACMAX.
3.CURRENTRATING:1AMPSMAX.
4.CONTACTRESISTANCE:100MOHMSMAX.
5.INSULATIONRESISTANCE:1000MOHMSMIN.500VDC
6.DIELECTRICWITHSTANDINGVOLTAGE:500VAC/1MINUTE
7.OPTERATINGTEMPERATURE:-20°CTO+60°C
8.STORAGETEMPERATURE:-40°CTO+70°C
9.DURABILITY10000CYCLES.
重込寸甘为A倆込
10.809.55中7 8.305.03.3019-0.30AAAA AAAAAA 1/0-61\*1.此开关PIN部份，□ 门 09 F AZEA0 d U 卡前外为平的 3 D0+ DFFERENTALDATEO+9.60 4 CDDAT3CARDDETECTIDATALEBIT3EETT 3.05 D0- DFFERENTIALDATEO-CCAAL ▲26.45 0.70# 21,60 78 6 08 S9101 2000 SAI
CARD 20 7# 8# 7# B# 22 21 0 019 0.23 19.08 GNDO 12 1314 CUK D1- DFFERENTALDATE1- OFERENITLAEAELE
DETECT CARD OUT CARD INSERT 6.03 OP27.7513.65 15 VSS2 SUPPLYVOLTAGEGROUND
WRITE 19# GND 19# GND# 16.64 16 VSS5 GROUND
PROTECTWRITE PROTECTED WRITE ENABLE 00 2.88 17 DATO DATALNEBITO26.45 0.25 18 DAT1 DATALNEBIT119 WP WRITEPROTECTRECOMMEENDER PCB LAYOUTTOLERANCE UNLESS OTHERWISE IS ± 0.05PAD AREA3:GND PATTERN ONLYKEEP OUT AREANOCOPPERAREA(NO Trace&Via&GND）SD1001-19M17BL-00010Onthe boardType4.0] conventional19:19PIN L: LCPM:Selevite GoldMatteTIN B:Black1:1u"8:30U" 7:Coppershell 8:SUS shell
SD1004-19M17BL-0001H SD4.0短体CONN.(板下)
二15 1.95 0-6 ②1.50 1 2.94 1.20 19-0.302200000000000000.80 PIN NAME DESCRPTION日 电1 VSS3GROUND5 2DAT2 DATALNEBIT2H C 邮 20 2. 3 COOTORDETAAE DO+ DFFERENTALDATEO+JEEEE K 3.00 贴唛啦 6 CMD COMMANDRESPONSE2 A A4 7 CD CARDDETECT8VSS1SUPPLYVOLTAGEGROUND9 VSS4 GROUND009 2845 10VDD2SUPPLYVOLTAGE(IBV)24.16 P1# 11 VDD1SUPPLYVOLTAGENOTE: 1025 22.80 1.20品L 2-01.60 12D1- DIFFERENTALDATE1-1.ALLDIMENSIONSAREINMILLIMETERS. A 1 中 1.20 29.08 P19# 114 CLK OIFERBIALAELE2.0PERETTNVTOLTAGE:10VACMAX GND/ 22.80 353 5 15VSSUPYVTAEOAOL DETECT WRITE CARD 19# 7# CARD OUT GND 8# OARTE 7#0 B# 2 国 NA EOPE7 15 T 1617 VS CROAUETOPROTECTWRITEPROTECTED27.757.OPTERATINGTEMPERATURE:-20°CTO+60°C RECOMMEENDERPCB LAYOUT8.STORAGETEMPERATURE:-40°CTO+70°C TOLERANCE UNLESS OTHERWISE IS ±0.059.DURABILITY10000CYCLES. TY
MATERIAL1.HOUSING:LCPE130I(UL94V-0)BLACK.2.CONTACTS:PHOSPHOR BRONZE(C5210R-EH)3.SHELL:BRASS SD1004-19M17BL-0001H
PLATING Underthe board 一 conventional1.CONTACTS:50U"MINNICKELUNDERPLATED,100UMINSNPLATEDSOLDERTAILS.1U"MINGOLDPLATEDCONTACTAREA 19:19PIN L: LCP2.SHELL:30U"MINNICKELPLATED M: Selevite Gold Matte TIN B: Black1:1u"8:30U" 7: Coppershell
SD1004-19M17BL-0002H SD4.0短体CONN板下沉板0.43mm DIP
10.2750.52中□ 0doo0.87 0.50(MAX) PIN NAVE VSS3 DESORPTION GROUND2 DAT2 DATALNEBIT2T 0 2 品 2.88 4-0.13 和 0, 位置PCB上不 外张，所以此 能放电子元件 345 cK67 CD CARDDETECT8 VSS1SUPPLYVOLTAGEGROUNDNOTE: 0.20 ± 0.05 24.16 29.55 19-20.60 P1# 2.43pn与pin之间 隐焊工艺 910 VOSPIDIE1.ALL DIMENSIONSARE INMILLIMETERS. 凯 T 4 5 .20 20.20 2194 12 11 VDD1 SUPLYITAE2.OPERATIONVOLTAGE:10VACMAX GND/ .259.08 3 13 CLK CLOCK3.CURRENTRATING:1AMPSMAX. 50 14 D1+ DIFERENTALDATE 1+4.CONTACTRESISTANCE:100MOHMSMAX. 5.INSULATIONRESISTANCE:1000MOHMSMIN.500VDC DEARCT CARD OUT8# CARDINSERT 8 13.38 £OF2757 80 156 VSS2 SUPLIATAEAWRITE 1GND 19# GND# N 29.55 17DATODATALNEBTO6.DIELECTRINWITHSTANADNGVOLTAGE:500VAC/1MINUTE 8.STORALETEMPERATULRE:-40CTO+70°℃ PROTECT WRTEPROTECTEDWRITEENABLE TOLERANCE UNLESS OTHERWISE IS 1,00 ±0.05 PAD AREA RECOMMEENDERPCBLAYOUT :KEEP OUT AREA 18DAT1ATALETETGNDPATTERN ONLYNO COPPER AREA(NO Trace&Via&GND）
MATERIAL1.HOUSING:LCP E130I(UL94V-0)BLACK.2.CONTACTS:PHOSPHORBRONZE(C5210R-EH)3.SHELL:BRASS SD1004-19M17BL-0002H
PLATING Underthe board 2:SINK0.431.CONTACTS:50U"MINNICKELUNDERPLATED,100U"MIN 19:19PIN L: LCPSNPLATEDSOLDERTAILS.1U"MINGOLD PLATED CONTACTAREA M: SeleviteGold Matte TIN B: Black2.SHELL:50U"MINNICKELPLATED1:1u"8:30U" 7: Coppershell
SD1003.12M17BL.0001H(SD3.0短体CONN.(板下))
NOTE:
1.ALLDIMENSIONSAREINMILLIMETERS.
2.OPERATIONVOLTAGE:10VACMAX.
3.CURRENTRATING:1AMPSMAX.
4.CONTACTRESISTANCE:100MOHMSMAX.
5.INSULATIONRESISTANCE:1000MOHMSMIN.500VDC
6.DIELECTRICWITHSTANDINGVOLTAGE:500VAC/1MINUTE
7.OPTERATINGTEMPERATURE:-20°CTO+60°C
8.STORAGETEMPERATURE:-40CTO+70°C
9.DURABILITY10000CYCLES.
10.8011 0.90 00-6 -0.30电 0000000000000000.80电 田3538 PIN NAME DESCRPTION2015 1 VSS3 GROUNDO2DAT2 DATALNEBIT2拍□ □用 3 D0+ DFFERENTIALDATEO+00000。。 。4CDDAT3 CARDDETECTIDATALEBT3足 3.00 8.55 9.22 5 D0- DFFERENTIALDATEO-6 CMD COMMANDRESPONSEP1# ．63 1.20 7 CD CARDDETECT2-1.60 1.208 8 VSS1 SUPPLYVOLTAGEGROUND0 285 9 VSS4 GROUND24.16 22.80 奥 安 22.80 1255 9.08 P19# 中 05. 10 11 VDD2 VDD1 SUPPLYVOLTAGE(1.BV) SUPPLYVOLTAGEEhdaa A GND 17.80 155 12 D1- DFFERENTIALDATE1-A2 1.40NOCOPPERAREA 13 CLK CLOCK1.80 NO Trace&Va&GND) 14 D1+ DFFERENTIALDATE1+2 品 C OF27.75 福 15 VSS2 SUPPLYVOLTAGEGROUNDCARD 7# ○8# 7#0 七8# 16VSS5 GROUNDDETECT CARD OUT CARD INSERT 27.75 17DAT0 DATALNEBITOWRITE 19GND 19# GND# 18DAT1 DATALNEBIT1PROTECT WRITE PROTECTED WRITE ENABLE RECOMMEENDER PCB LAYOUT 19 WP WRITEPROTECTTOLERANCE UNLESS OTHERWISE IS ± 0.05Z:PAD AREA :KEEP OUT AREA:GNDPATTERNONLYNOCOPPERAREA(NO Trace&Via&GND)
MATERIAL
1.HOUSING:LCPE130I(UL94V-0)BLACK.
2.CONTACTS:PHOSPHORBRONZE(C5210R-EH)
3.SHELL:BRASS
PLATING
1.CONTACTS:50U"MINNICKELUNDERPLATED,100U"MIN SNPLATEDSOLDERTAILS.1UMINGOLDPLATED CONTACTAREA 2.SHELL:30U"MINNICKELPLATED
SD1003-12M17BL-0001H Under theboard Type3.0 [ conventional 12:12PIN L: LCP M: Selevite Gold Matte TIN B: Black 1:1u"7:15u8:30U" 7: Copper shell
SD1004.19M17BL.0003H（SD4.0CONN长体沉板1.70mm）
125
0.20±0.0510.78 10.80
3.07 P19# P1# 0.15 19-0.3080.11 AAAAAA
早 T 可中 日 120.50(MAX)21 卡 PIN NAME DESCRPTION
4 口 口 9 外张，所以此 1 VSS3 GROUND中 中 由 位置PC8上不 2 DAT2 DATALNEBT2能放电子元件 3 D0+ DFFERENTALDATEO+Y 贴唛啦（W：19mm） 4 CDDAT3 CARDDETECTIDATALNEBIT310.785 D0- DFFERENTALDATEO-6 CMD COMMANDRESPONSE7 CD CARDDETECT2 0 24.16 29.45 P1# 19-0.70 _P19# 8 9 VSS4 VSS1 SUPPLYVOLTAGEGROUND GROUND心 10 VDD2 SUPPLYVOLTAGE(1.BV)丰 G 112 VDD1 SUPYVAIAEIEEG.0 9 1314 CLK DFFETALATEIELEDEAECT CARD OUT8# CARD INSERTWRITE 19GND 19# GND# 15 VSS2 SUPPLYVOLTAGEGROUNDPROTECT WRITE PROTECTED WRITE ENABLE 10 COF27.75 0.60 16VSS5 GROUND17 DATO DATALNEBITO27.25 18 DAT1 DATALNEBI1RECOMMEENDERPCBLAYOUT 19 WP WRITEPROTECTTOLERANCE UNLESS OTHERWISE IS 1.00± 0.05
NOTE:
1.ALLDIMENSIONSAREINMILLIMETERS.
2.OPERATIONVOLTAGE:10VACMAX.
3.CURRENTRATING:1AMPSMAX.
4.CONTACTRESISTANCE:100MOHMSMAX.
5.INSULATIONRESISTANCE:1000MOHMSMIN.500VDC
6.DIELECTRICWITHSTANDINGVOLTAGE:500VAC/1MINUTE
7.OPTERATINGTEMPERATURE:-20°CTO+60°C
8.STORAGETEMPERATURE:-40CTO+70C
9.DURABILITY10000 CYCLES.
MATERIAL
1.HOUSING:LCPE130I(UL94V-0)BLACK.
2.CONTACTS:PHOSPHORBRONZE(C5210R-EH)
3.SHELL:BRASS
PLATING
1.CONTACTS:50U"MINNICKELUNDERPLATED，100UMINSNPLATEDSOLDERTAILS.1U"MINGOLDPLATEDCONTACTAREA2.SHELL:50U"MINNICKELPLATED
SD1004-19M17BL-0003H Under the board 3:SINKCH1.70 19:19PIN L: LCP M: Selevite GoldMatte TIN B: Black 1:1u"8:30U" 7: Copper shell
GSD1006.19M1XBL.014X0(SD4.0CARD PUSHHCONN.(板上)
NOTE:
1.ALLDIMENSIONSAREINMILLIMETERS
2.OPERATIONVOLTAGE:10VACMAX.
3.CURRENTRATING:1AMPSMAX.
4.CONTACTRESISTANCE:100MOHMSMAX.
5.INSULATIONRESISTANCE:1000MOHMSMIN.500VDC
6.DIELECTRICWITHSTANDINGVOLTAGE:500VAC/1MINUTE
7.OPTERATINGTEMPERATURE:-20CTO+60C
8.STORAGETEMPERATURE:-40CTO+70C
9.DURABILITY10000CYCLES
GSD1006.19M1XBL.024X0(SD 4.0CARD PUSH CONN.(板下)
NOTE:
MATERIAL
Insulator: LCP,rated UL94V-0, color: black. Contacts: Phosphor Bronze,Tin 100u"MINatSolderTail, Selectived Gold on Contact Area Plating. Shell: Stainless.Over Nickel Plating. Materialsused for procurementof existing parts"Level1 Environment related substances should NEVER be used Materials used for procurement of newparts"Level1 Environment related substancesshould NEVERbe used"
ELECTRICALCHARACTERISTICS
Operating voltage: 500V(AC/DC). Current rating: 1.0 A. Operating Temperature:-20℃\~+60℃ Insulationresistance:10ooMohmsmin.at250VDC Dielectricwithstanding voltage:50oVAC/1minute. Contact resistance:100mohmsmax. Mating cydle: 10o00 cycles,spring is notbreaking.
V .85 3.15 0.25 3 19-0.30 MAAAAAA 3 0.80 AAAAAAAAAN 电 4 20 器 ITOAT PIN NAME DESCRPTION HS 12 VS3 DROAUNETE TTPECTEC 8 3 D0+ DFFERENTIALDATEO+ CSSSSSS 4 ODAT3CARDDETECTIDATAUNEBIT3 .00 5 D0- DFFERENTIALDATEO6 CMD COMMANDRESPONSE 7 CD CARDDETECT 8 VSS1 SUPPLYVOLTAGEGROUND P19# VDS2 GRPIYVATICEI 28.35 P1# 品 24.65 19-0.70 11 VDD1 SUPPLYVOLTAGE 2 22.60 2-01.3 GND中 1232510625 中 113 1314 D CUK DFEITLAL DFEITLAEIELE 4 50 15 VSS2 SUPPLYVOLTAGE GROUND 24 节 VSS5 GROUND CARD 7# o8# 7#0 七8# 17 DATO DATAUNEBITO OET 1 TEL C OF29.65 18DAT1 DATAIAETITT 29.65 RECOMMEENDERPCBLAYOUT TOLERANCE UNLESS OTHERWISE IS ± 0.05 GSD1006-19M1XBL-024X0 SD:SDCONN O:RoHSH:HF 19:19PIN 1:TRAY2:TAPE&REEL M:SeleviteGoldMatte TIN 3:W/oPUSH_4:W/PUSH 1:1u"3:3u5:5U" 1:Ontheboard2:Undertheboarc 5. FULL NI L:LCP 7.G/FOn The Solder,Ni OverAll B: Black
