该页无缩略图
NOTE:
1.ALLDIMENSIONSAREINMILLIMETERS
2.OPERATIONVOLTAGE:10VACMAX.
3.CURRENTRATING:1AMPSMAX.
4.CONTACTRESISTANCE:100MOHMSMAX.
5.INSULATIONRESISTANCE:1000MOHMSMIN.500VDC
6.DIELECTRICWITHSTANDINGVOLTAGE:500VAC/1MINUTE
7.OPTERATINGTEMPERATURE:-20°CTO+60C
8.STORAGETEMPERATURE:-40°CTO+70°C
9.DURABILITY10000CYCLES
SD1005-19M15BL.10010MicroSD4.0+MicroSD2.0+UFS前後出Pin(H1.30)
NOTE:
MATERIAL
PLASTIC:LCP,THERMOPLASTICUL94V-0 COLOR:BLACK CONTACT:COPPEERALLOYC5210-HT=0.12mm SHELL:BASSC2680T=0.15mm
PLATING
CONTACT:CONTACTAREA:AuG/FPLATINGOVERNi SOLDERTAILAREA:MATTETIN80\~100u"OVERNi SHELL:SOLDERABLENIPLATINGOVERALL CONTACTANDTAILCOPLANARITYTOBE0.10mmMAX
SD1005-19S15BL.0001H(MicroSD4.0前后出pin成品图（H1.45))
NOTE:
ELECTRICALCHARACTERISTICS
CONTACTCURRENTRATING:0.5AMPERES.
DIELECTRICWITHSTANDINGVOLTAGE:AC500VRMS.
INSULATIONRESISTANCE:1000MΩMINIMUM.
CONTACTRESISTANCE:100MΩMAXIMUM.
ENVIRONMENTALOPERATINGTEMPERATURE:-25C\~+85°C
MECHANICALCHARACTERISTICS
MATINGCYELES:OFFICEENVIRONMENT5,000CYCLES. HARSHENVIRONMENT1.500CYCLES. TOTALINSERTION/PULLINGFORCE:1.0N\~80N
MATERIAL
INSULATOR:HI-TEMPPLASTICUL94V-ORATED.
CANTACT:COPPERALLOY.
SHELL:STAINLESSSTEEL.
PIN 100X0.35 X095 10.5 2X3.961 匠 8 0555 国 1MH
IIOI 中 品4XPIN 19 驾 825 5.60① 2.499X0.9 1.9410X0.651 2X0.60 ± 0.10 9 7X0.50 国□
CAAR PIN11 8 898x0.3150. 9X0.65 58 5 86X 1111 198 5 2.69 014.50 Card sict ④电 有 [N1 PIN1 8.38 2148 4X1105 6X T PIN 18 PIN 11 4x0.50 4X0.50 1电 福C 2x0.65 19T5.50 Connector Circuit Diagram for Card Detect Switch14.60 Edge SWITCH TERMO SWITCH TERMOPCB PATTERN LAYOUT 0 9(GENERAL TOLERANCE;± 0.05)2PAD DETECT TERM Q DETECT TERMN (WROUND).AFEN ISeROUNDd..CLCSESD1005-19S15BL-0001HMicro SD O:RoHSHHF19:19PIN 1:TRAY2:TAPE&REELS:Selevite Gold BrightTIN 00:PushPush H=1.451:G/F3:3u5:5U" L:LCP5.FULL NI B: Black
GSD1000.10S15BL.000X0(SD3.0PUSH卡座U型不锈钢壳
GTF1001.09M15BL.00010（TF卡座9PIN普通外焊LCP料)
NOTE:
NOTE:
MATERIALSPECIFCATION
INSULATIONMATERIAL:THERMOPLASTIC,
UL94V-0,BLACKWHITE.
SHELL:COPPERALLOY,T:0.30mm,NICKELPLATED.TERMINAL:COPPERALLOY,T=0.20mm,
PLATING:GOLD/TIN PLATED.
ELECTRICALCHARACTERISTIC
INSULATIONRESISTANCE:1000MΩMIN.
CONTACTRESISTANCE:30mΩMAX.
WITHSTANDINGVOLTAGE:50OVAC.
CURRENT:1.5AMAX.VOLTAGE:300VMAX.
MECHANICALCHARACTERISTICS
MATING:35NMAX.
EITHDRAWAL:10NMIN(COPPERALLOY).5.88NMIN(SPCC). DURABILITY:1500CYCLESMIN
ENVIRONMENTAL:TEMPERATURERANGE-50C\~+85C
UBF0A3.04BS9U5.BL01HC(USB2.0AF90度反向沉板CH-1.95)
NOTE:
MATERIAL
HOUSING:HI-TEMPPLASTICUL94V-0RATED.BLACKCONTACT:COPPERALLOY.
SHELL: SUS.
FINISH
CONTACT AREA: MIN1U"GOLD PLATING ON, UNDER50U"NIKLE PLATINGOVERALL. SOLDERAREA:10OU"MIN.TINPLATING ON, UNDER 50U" NICKELPLATING OVERALL SHELL:NICKEL 50U"PLATING OVERALL.
OTHER
IRREFLOWTEMPERATUR:260CFOR
10SECONDS3CYCLES.
OPENING CHECK:OPENINGSOFCONNECTOR MODULE ARE UNDER1mm.
GUBF0A0.12PS1A5.BB010（USB2.0AF三层无弹片）
NOTE:
MATERIAL
HOUSING:PA6T+30%G/F,COLOR:BLACK,UL94V-0; CONTACTS:PHOSPHORBRONZE SHELL:SEETABLEISOLATED:SK7 REARSHELL:SPCC
FINISH
CONTACT:GOLDFLASHPLATINGONCONTACTAREA 100u"MIN.BRIGHT-TINPLATING ONSOLDERTAIL AREA,50u"MIN.NICKELUNDERPLATINGOVERALL. SHELL:50u"MINNICKELPLATED. ISOLATED:SHELL:100u"MINNICKELPLATED REARSHELL:100uMINNICKELPLATED.
ELECTRICALCHARACTERISTICS
CURRENTRATING:1AMPERMAXIMUMVOLTAGE:30VACCONTACTRETENTIONFORCE:0.7KGFMINIMUM.CONTACTRESISTANCE:30MILLIOHMSMAXIMUM.INSULATIONRESISTANCE:1000MEGOHMSMINIMUM.DIELECTRICWITHSTANDINGVOLTAGE:750VACATSEELEVEL.TEMPERATURE:-55°C\~85CMECHANICALMATINGFORCE:3.57KGF(35N)MAXUNMATINGFORCE:1.02KGF(10N)MIN
GUBF0A0.16BSXX5.NNXX0（USB2.0AF四层）
NOTE:
>MATERIAL PRODUCTTOBEMETTYCOSPEC230-702
①②HOUSING:(CHANG CHUN4830 BKC)PBT OR PA46 OR NY6TWITH30% G/F UL94V-0;COLOR: BLACK③CONTACT: BRASSC2680-H(T=0.2±0.01mm) ④FRONTSHIELD:(S&T)BRASSC2680-HORSPCC(T=0.35±.01mm) REARSHIELD: (S&T)BRASSC2680-HOR SPPCC(T=0.3±0.01mm) GROUND FINGER:(S&T)BRASS C2680-HORSPCC(T=0.3±0.01mm)
FINISH
CONTACT:(SEETABLE)GOLDPLATEDINCONTACT 50u"MINNICKEL UNDERPLATEDALLOVER. 150u-250u"MATTETINONSOLDERTAILS. FRONT SHIELD:50-80U"Cu UNDER PLATED, 100-150U"NICKELPLATEDALLOVER. REARSHIELD:50-80U"Cu UNDERPLATED, 80-120U"NICKELPLATEDALLOVER. GROUNDFINGER:50-80U"CuUNDERPLATED, 80-120U"NICKELPLATEDALLOVER.
RETENTIONFORCE
CONTACTRETENTIONFORCE:0.3KG MIN.
FRONTSHELDRETENTIONFORCE:1.75KGFMIN.
GROUDFINGERRETENTIONFORCE:1.75KGFMIN.
WAVESOLDER
THECONNECTORSHALL BEMOUNTED ONTHEPCB, THETEMPERATUREOFTHE SOLDSHALLBE260°±5CAND IMMERSIONDARATION3-5SECONDS
GUBF0A2.04BS1C5.WPV103（USB2.0AF（15.0)180插板半金锡GFPBT白胶铁壳直边弯脚镀镍
NOTE:
ELECTRICALCHARACTERISTICS
CONTACTRESISTANCE:30MILLIOHMSMAX DIELECTNICWITHSTANDINGVOITAGE:500VACATSEALEVOL INSULATIONRESISTANCE:1000MEGA-OHMSMIN
MECHANICAL INSERTIONFORCE:3.57KGMAX UNMATING FORCE:0.7KGMIN
MATERIAL
HOUSING:PBT CONTACT:C2680 SHELL:SPCC/C2680
FINISH CONTACT:AUPLATEDONCONTACTAREAOVER 50\~80UNI,SNPLATEDONSOLDERTAILS. SHEL:NICKELPLATING
GUBF0B0.04PS1C5.WPV10（USB2.0BF180度插板式半金铜壳镀镍）
NOTE:
SPECIFCATIONS
CONTACTCURRENTRATING:1AMPERES.
DIELECTRICWITHSTANDINGVOLTAGE:AC500V.
INSULATIONRESISTANCE:1000MΩMINIMUM.
CONTACTRESISTANCE:30MΩMAXIMUM.
OPERATINGTEMPERATURE:-55CTO+85C
MECHANICALCHARACTERISTICS
MATINGFORCE:3.5KG.
MAXIMUM.UNMATINGFORCE:1KG.
MLNIMUM.DURABILITY:1500CYCLES.
ENVIROMENTAL
\*RECOMMENDEDPCBOARDTHICKNESS:1.6±0.05MM.THEBAND"△"ISMARKEDASTHEKEYCONTROLDIMENSION
GUBF0A2.04BS1B5.BLR10(USB2.0AF90度插板半金锡GFLCP黑胶铜壳镍壳直边弯脚）
NOTE:
>ELECTRICALCHARACTERISTICS
CONTACTCURRENTRATING:1AMPERES. DIELECTRICWITHSTANDINGVOLTAGE:AC500VR.M.S. INSULATIONRESISTANCE:50OMΩMIN. CONTACTRESISTANCE:30MΩMAX.
MECHANICALCHARACTERISTICS MATING FORCE:3.57KGMAX. UNMATINGFORCE:0.7KGMIN.
0 MATERIAL HOUSING:PBTORLCP CONTACT:BRASSC2680PLATINGAU1U"3U"5U"10U"15U"30U" SHELL:SPCC/BRASS.PLATINGNIOVERALL
GUBM0A2.04BS1C5.WP010USB2.0AM90度DIP有柱白胶PBT铁壳
NOTE:
CONTACTRESISTANCE:30MΩMAXINSULATIONRESISTANCE:1000MΩMINDIELECTNICVOLTAGE:50OVAC ONESECLEVELOPERATINGTEMPERATURE:-55C\~-105°CTOTAL MATING FORCE:3.5 KGFMAX.TOTAL UNMATING FORCE: 1.0 KGF MIN.
GUBM0A2-04BS1C5-WP010 USB M:Male 0:ITSCOMPLIANT 0:2.0Type WITHRoHs A2:AType,Straight, P:PBTL:LCP 04:04PIN B:BlackW:White B:BrassP:PhosphorBronze 5:FullNi S:SeleviteGold Bright TIN B:Brass C:Spcc M: Selevite Gold Matte TIN 1:GoldFLASH2:2U3:3U"5:5U
UBF1A2.09PM1U5.BL06HC(USB3.0AF90度沉板CH1.4
NOTE:
FINISH CONTACTAREA:GOLDPLATING ON(SEENOTES.NO.9DESCRIPTION,50u"NICKELPLATINGOVERALLSOLDERAREA:80u"MIN.MATTETINON,UNDER50u"NICKELPLATINGOVERALLSHELL:50-150u"WELDABLENICKELPLATING OVERALL
ELECTRICALCURRENTRATING:1.5APERPINMAX.VOLTAGERATING:30VDCCONTACTRESISTANCE:30MΩMAX(INITIAL)50MΩMAX(FINAL)INSULATIONRESISTANCE:100MQMIN(INITIAL)DIELECTRICWITHSTANDINGVOLTAGE:100VAC.
LIFETEST:5,000CYCLES.
UNLESSOTHERWISESPECIFIEDTOLERANCE:ASSHOWASGENERALTOLERANCE
DIMENSIONSMARKED<>EXPRESSINGREFERENCE.
ENVIRONMENTAL:OPERATIONTEMPERATURE:-40C\~+85CALLBURRSSHALLNOTEXCEED0.05MM,
MAXIMUMGATEVESTIGEFLUSHORBELOW
PRODUCTCOMPLIANTTOROHSANDHALOGENFREE.
06.00AVAILABLE 500 VACUUMPICKUPAREA 1mgooo 85 L 国 2-R0.50 2-<0.70> 13.50 PCB EAGE 15.70 4-0.80 4-1.30 PAD EZZSTAND OFF 828 13.10±0.25 2-0.3MAX. COE 105 12.50 ± 0.10 PIN 5 12025022 0110 PIN9 00+00 1 4 = PIN 1↓ 11.10410 2-0.30 ± 0.15 5815 -1.60 005 6.60 ± 0.15 5±0.15 12.60±0.15 ONN 0 11.75 T 65 9-0.30±0.15 2.00±0.15 4.00 ± 0.15 7.00 ±0.15 8.00±0.15 K4.50> 12.80±0.15 <2.87> 10.15 UBF1A2-09PM1U5-BL06HC USB C:TAPE&REEL F:Female (W/ODC) 1:3.0Type2:3.1Type 0:Rohs H: H.F A2: AType(Straight) 06:90°，DIP.CH=1.4 09:09PIN A:PA9TL:LCP B:BrassP:PhosphorBronze COLORSTYLE B:BIack U:BluE S:Selevite Gold Bright TIN 3:FullSn4:FullGold5:FulN M: Selevite GoldMatte TIN SHELLMATERIAL B:BraSS U:SUS 1:GoldFLASH6:10U"9:1U
UBF1A2.09PMXU5.BL02HC(USB3.0AF90度沉板CH0.35)
NOTE:
MATERIALHOUSING:HI-TEMPPLASTIC UL 94V-0 RATED.BLACKCONTACT:COPPERALLOY. SHELL:SUS304.
FINISH
CONTACTAREA:MIN1U"GOLDPLATING ON, UNDER1U"NIKLE PLATING OVERALL. SOLDERAREA:100U'MIN.MATTETINPLATING ON, UNDER50U"NICKELPLATING OVERALL SHELL:NICKEL 50U"PLATING OVERALL.
ELECTRICAL
CURRENTRATING:VBUS&GNDPIN1APERPIN.CONTACTRESISTANCE:VBUS&GNDPIN:30mΩMAX.OTHER PIN: 50mΩ MAX.DIELECTRICWITHSTANDINGVOLTAGE:100VACFOR1MINUTE.INSULATIONRESISTANCE:100MΩMIN.
MECHANICAL INSERTIONFORCE:35N(3.57Kgf)MAX.WITHDRAWALFORCE: 10N(1.02kgf) MIN(INITIAL),8N(0.816kgf) MIN(FINAL).
ENVIRONMENTAL:OPERATIONTEMPERATURE:-30C\~+85C
OTHERIRREFLOWTEMPERATUR:260CFOR10SECONDS3CYCLES.OPENINGCHECK:OPENINGSOFCONNECTORMODULEAREUNDER1mm
GUBF1A0.09CXXX5.XX070(USB3.0AF90度DIP卷边镍壳弯脚）
NOTE:
ELECTRICALPERFORMANCE
CONTACTCURRENTRATING:
1.80AMPERESFORVBUSANDGNDCONTACTS
0.25AMPERESFORALLOTHERCONTACTS
DIELECTRICWITHSTANDINGVOLTAGE:AC10OV/MINUTE
INSULATIONRESISTANCE:100MOHMSMIN
CONTACTRESISTANCE:30MOHMMAXFORVBUSANDGNDCONTACTS
50MOHMMAXFORALLOTHERCONTACTS
MECHANICALPERFORMANCE
MATINGFORCE:35NMAXDURABILITY:1500CYCLES UNMATING FORCE:10NMIN;8NMINAFTERDURABILITY.
ENVIRONMENTALPERFORMANCE
TEMPERATURERANGE:OPERATINGTEMPERATURE:-55°C\~+85°CMATERIAL
HOUSING: HIGHTEMP.PLASTIC,UL94V-0 SHELL:SUS304/BRASS CONTACT:2.0CONTACTSC5191AND 3.0CONTACTSC2680(T=0.25)
PLATING
CONTACT:AUPLATEDONCONTACTAREATIN10OU"PLATEDONSOLDERAREA NICKEL5OU"PLATED UNDERPLATING OVERALL.
5.2SHELL:NICKEL PLATED/GOLD PLATED
GUBF1A0.09PM1B5.LLS40（USB3.0AF居中沉板90度SMT磷铜端子半金雾锡GFLCP浅蓝卷边铜壳镀镍前贴后直脚）
NOTE:
MATERIAL INSULATOR:LCPUL94V-0 CONTACT:BRONZE(T=0.20mm) SHELL: BRASS(T=0.30mm)
ELECTRICALCHARACTERISTICS
CONTACTRESISTANCE:30mΩMAXIMUMCONTACTCURRENTRATING:1.5ADIELECTRICWITHSTANDINGVOLTAGE:50OVR.M.S.INSULATIONRESISTANCE1000MEGOHMSMINOPERATINGTEMPEROTURE:-40C\~85C
MECHANICALCHARACTERISTICS
MATINGFORCE:3.57kgMAX UNMATEDFORCE:1.02kg MIN DURABILITY:MANDATORY:5,000CYCLES
PLATING
TERMINAL:50u"MINNICKELALL OVER 100u"MINTinONSOLDERAREA (1\~30)u"AuONCONTACTAREA SHELL:100u"MIN.NICEL ALL OVER
""FORMAJORDIM
GUBF1A0.09BXXU5.XX410(USB3.0AF侧插卷边)
NOTE:
CONTACTCURRENTRATING
1.8AMPERESFORPIN1&PIN4. 0.25AMPERESOTHERCONTACTS DIELECTRICWITHSTANDINGVOLTAGE:AC100V(RMS) INSULATIONRESISTANCE:100MEGOHMSMINIMUM.
CONTACTRESISTANCE 30MΩMAXFORPIN1&PIN4 50MΩMAXFOROTHERCONTACTS
MECHANICALCHARACTERISTICSMATINGFORCE:35NEWTOMS.MAXIMUMUNMATINGFORCE:10NEWTOMS.MLNIMUM.OPERATINGTEMPERATURE:-40C+85C
GUBF1A0.18BM1B5.UPR10（USB3.0AF双层90度插板式弯脚）
NOTE:
INSULATOR:PBT+30%GFUL94V-0, SHELL:STEEL,NIORSNFINISHED CONTACTMATERIAL:BRASS,SELEVITEGOLDFINISHED RIVETED INSERT:BRASSMATERIAL,TINFINISHED WITH #4-40 THREADEDASSEMBLED
ELECTRICALCHARACTERISTICS
MATERIALSANDFINISHED
CURRENTRATING:1.0AMPDC
VOLTAGERATING:300VDC
CONTACTRESISTANCE:20 MILLIOHMS MAX.
DIELECTRICWITHSTANDINGVOLTAGE:1000VACMIN. INSULATIONRESISTANCE:1000MEGAOHMSMIN.
OPERATINGTEMPERATURE:-55C\~+85℃STORAGETEMPERATURE:-55C\~+105C
ENVIRONMENTAL
NOTE:
>CHARACTERISTICS
RATINGVOLTAGE:30VAC. RATINGCURRENT:1.8AFORVBUSANDGND， AND0.25AFORALLOTHERCONTACTS CONTACTRESISTANCE:30MΩMAX. INSULATIONRESISTANCE:100MΩMIN. WITHSTANDINGVOLTAGE:AC500V. MATINGFORCE:3.57KGFMAX(35NMAX) EXTRACTIONFORCE: 1KGFMIN(9.8NMIN) LIFETEST:5000CYCLESMIN. TEMPERATURERANGE:-30°C\~+80C.
3 2-1.00 20.70313.842.30 ①4PLCSTANDOFF 1USED AREA 642351 CONNECTOREDGE电 PANEL N08'013.146.00 STAND OFF AREA (PLASTIC)14.8 RECOMMENDED P.C.B LAYOUT(TOP VIEW)12.50 ±0.10 THICKNESS=1,60mm,TOLERANCE; ±0,0511.10±0.10 24.0±0.385110 D □ 0 □ □ 自口 101 DATE CODE 口H □ 8006 □ 日
O7O H CD 3R A 0+品 □2.313
18-0.40±0.05 18-0.45±0.05（下两层） H 2.00(上两层） 9.64±0.15 1.75 ± 0.054-2.0 ± 0.054007.008.0012.80±0.20 8:4815.60±0.3011.68GUBF1A0-36CXXU8-UA010F:Female 0:RohsA0:AType,Crimping 01:W/OSpring36:4x9PIN A:PA9TC:U3.0/Brass+U2.0/Phosphor Bronze COLORSTYLES:SeleviteGold BrightTIN B: Black U: BlueM:Selevite GoldMatteTIN 8:TinPLATING ONLYAT KINKS.1:GoldFLASH 3:3U"5:5U" (Front Shell)7:15U" SHELLMATERIALU:SUSC:SpcC
UBF1A3.09PMXUB.BL03HC（USB3.0AF90度反向沉板CH-1.85）
NOTE:
MATERIALHOUSING:HI-TEMPPLASTICUL94V-0;ColorBLACKCONTACT:COPPERALLOY.SHELL:STAINLESS STEEL.
SPECIALITY
CURRENTRATING:1A
CURRENTVOLTAGE:30V
CONTACTRESISTANCE:30MΩMAX.
INSULATIONRESISTANCE:100MΩMIN500DC. DIELECTRICWITHSTANDINGVOLTAGE:100VAC SOLDERABILITY:255±5C,5±0.5S
DURABILITY:5000CYCLESMIN
PLEASECONTACTJITSSALESREPRESENTATIVETO VERIFYPRODUCTDETAILS&AVAILABILITY MATERIA SHELL: BRASS (T=0.30mm)
UBF1A3.09HMXU5.BL05HC（USB3.1AF90度反向沉板CH-2.4
VACUUMPICKUPAREA 12.80 602X 6.00 100 13.10 0L X600 8 12.50 ± 0.10 9.95 9 PIN1 0 号 0.30±0.05 回 1.40(4X) 2120 12 重 0.70（4x） PIN5. PIN9 13.80 7.80 13.70 1.30±0.03（4x) NOTE: PCBFRONTEDGE RECOMMENDED PCB LAYOUT(COMPONENTSIDE) FINISH THICKNESS=1.2O±005（TOPVIEW）DEFAULTTOL±0.05 CONTACTAREA:AU30U\*ON(SEENOTES.NO.9DESCRIPTION, 50U"NICKELPLATINGOVERALL. SOLDERAREA:100UMIN.MATTETINON, UNDER50U"NICKELPLATINGOVERALL. SHELL: 5OU"WELDABLE NICKEL PLATING OVERALL. 2.00 0.30±0.05 ELECTRICAL 4.00 CURRENTRATING:18(PIN1.4);OTHERCONTACTS0.25A 8.00 CONTACT RESISTANCE:30 MΩ MAX(INITIAL)FOR PIN1&PIN4. 50 MΩ MAX(INITIAL) FOR ALL OTHER CONTACT PIN. UBF1A3-09XMXU5-BL05HC MAX CHANGE DELTA OF +10 MΩ AFTER ENVIRONMENTAL STRESSES. INSULATIONRESISTANCE:100MQMIN(INITIAL) USB A:TAPE&REEL DIELECTRIC WTHSTANDINGVOLTAGE:100VAC. F:Female (W/oDC) UE 1:3.0Tye2317e 05:90° 0Ch-2.40F INSERTIONFORCE:3.57KgfMAX.LIFETEST:5,000CYCLES. (Straight,Reverse) A:PA9TL:LCP WITHDRAWAL FORCE: 1.02Kgf Min(INITIAL).0.80Kgf Min(AFTER TEST) 09:09PIN B:BlackUBlue DIMENSIONSMARKED()EXPRESSINGREFERENCE. B:BrassP:Phosphor Bronze 5:FullNiB:FullBLACKNi ENVIRONMENTAL:OPERATIONTEMPERATURE:-40C\~+85C H: Brass+Phosphor Bronze B:Brass U:SUS ALLBURRS SHALL NOTEXCEED0.05MM, S:SeleviteGoldBright TIN 1:GoldFLASH6:10U8:30U"9:1U" MAXIMUMGATEVESTIGEFLUSHORBELOW M: SeleviteGold Matte TIN PRODUCTCOMPLIANTTO ROHSAND HALOGENFREE.
UBF2A3.09PMXU5.BAR2H5（USB3.1AF90度反向沉板CH1.5）
NOTE:
FINISH CONTACT AREA:GOLD PLATING ON(SEE:HOWTO ORDER) 50U"NICKELPLATING OVERALL SOLDERAREA:100UMIN.MATTETINON,UNDER 50U"NICKEL PLATING OVERALL SHELL:50\~150U"MIN.WELDABLE NICKEL PLATING OVER ALL
ELECTRICAL CURRENTRATING:VBUS&GND PIN1.8A PER PIN.OTHER PINS: 0.25A PER PIN. VOLTAGERATING:30VDC. CONTACTRESISTANCE:VBUS&GNDPIN:30mΩMAXOTHERPIN:50mΩMAX. INSULATIONRESISTANCE:100OMΩMIN. DIELECTRICWITHSTANDING VOLTAGE:100VAC.
LIFETEST:5000CYCLES
UNLESSOTHERWISESPECIFIEDTOLERANCE: ASSHOWASGENERALTOLERANCE
DIMENSIONSMARKED<>EXPRESSINGREFERENCE.
ENVIRONMENTAL:OPERATIONTEMPERATURE:-40C\~+85C
ALLBURRSSHALLNOTEXCEED0.05MM, MAXIMUMGATEVESTIGEFLUSHORBELOW
PRODUCTCOMPLIANTTO ROHSAND HALOGEN FREE. ±0.05 13.80 ±0.25 24,00ACAILABLE 051 2.00 VACUUM PICK UP AREA 寸 PIN4 □ 事 90'0+089
1515515 1 70 5000 5 10.009 13.80 ± 0.05 2-0.3M 101/ -1.70MIN 12.50 ± 0.10 81 □ 1029 5/2 国 14 由 成 0.30 11.10±0.10 0.75±0.15 15.70 5.35±0.15 6.80±0.15 1.50 ±0.15 (11,75) DS NTTSE 8.78 中 中 1 0.0 000- 中 北 中 0.35±0.05 45020 LD 10.33 UBF2A3-09PMXU5-BAR2H5
USB 5:CH=1.5
F:Female 0:Rohs H: H.F
1:3.0Type 2:3.1Type 2:Foot/Straight
A3:AType R:90°，DIP
(Straight,Reverse) A:PA9TL:LCP
09:09PIN COLORSTYLEB:BlackU:Blue
B:BrassP:Phosphor Bronze 3:FullSn 4:FullGold5:F
S:SeleviteGold Bright TIN SHELLMATERIAL B:BraSs C:SpcC
M:SeleviteGoldMatte TIN 1:1U"7:15U"8:30U"
GUBF0M1.05BG1U5.BLV20(MicroUSB5PFAB型180度直插卷边不锈钢壳端子全金GFLCP黑）
NOTE:
MATERIAL
HOUSING:HIGHTEMPERATURETHERMOPLASTICWITHG.F,UL94V-0CONTACT:COPPERALLOY,T=0.15MMSHELL:COPPERALLOY,T=0.25MM
SPECIFICATION
CURRENTRATING:1,5PIN1.8AMAX/2,3,4PIN1AMAX.DIELECTRICWITHSTANDING
VOLTAGE:100V(AC)FOR1MIN
CONTACTRESISTANCE:30MΩMAX.
INSULATIONRESISTANCE:100MΩMIN
TOTALMATINGFORCE:3.57KGFMAX.
TOTALUNMATINGFORCE:1.0KGFMIN.
TEMPERATURERANGE:-30C\~80C
GUBF0M3.05BG1B6.BL030(MICROUSBBF5PSMT,LCP黑胶，全金GF,4.85牛角直边铜壳镀雾锡（7.25×4.85）
NOTE:
ELECTRICAL
CURRENTRATING:1.5A/CONTACTTERMINAL VOLTAGERATING:30VDC CONTACTRESISTANCE:30MILLIOHMSMAX DIELECTNICWITHSTANDINGVOITAGE:100VACATSEALEVOL LNSULATIONRESISTANCE:100MEGAOHMSMIN
MECHANICAL
CONNECTORMATEANDUNMATEFORCE
MATEFORCE:3.57KGF(MAX)UNMATEFORCE:1.02KGF(MIN)
TERMINALRETENION: 0.5KGF(MIN)
MATORIALHOUSING:HINGHTEMPERATUREPLASTIC,LCPWHITE/BLACKCONTACT:COPPERALLOYC2680SHELL:COPPERALLOY/SUS
INISHED
CONTACT:PLATEDGOLDINMATINGAREA; MATTETIN ON SOLDER TALL SSHELL:PLATED MATTETIN, SALTSPRAYTEST:24 HOURS
GUBFOC0.06BS1U5.BLS10A(USBC-TYPER-ASMT母座6PIN,LCP黑胶全金GF,外壳镀镍（有弹片)，卷装）
NOTE:
MATERIAL
MOLDING:LCPUL94V-0CONTACT:COPPERALLOY. FINISHED ONTACTAREA:PLATINGAu0.8u", SOLDER TAIL: PLATING Au 0.8u",ALL PLATING Ni 40u" SHELL: SUS201-1/2H,T=0.30±0.03mm 50u" NICKEL PLATING OVER ALL.
MECHANICAL
INSERTION:5\~20N. EXTRACTION:8\~20NAFTERTEST. DURABILITY:8000CYCLES
ELECTRICAL
CURRENT:1.5AVOLTAGE:20VMAXWITHSTANDINGVOLTAGE:100VACR.M.S.CONTACTRESISTANCE:40mΩMAX.INSULATIONRESISTANCE:100MΩMIN.
ENVIRONMENTAL
TEMPERATURERANGE-25C\~+85℃
GUBF0C0.16PM1U5.BLS20A（USBC-TYPER-ASMT母座16PIN,LCP黑胶半金雾锡GF,铁壳镀镍,卷装）
NOTE:
SPECIFICATION
CURRENTRATING:1.5AMAX
VOLTAGE:100VAC
TEMPERATURERANGE:-30C\~85℃
CONTACTRESISTANCE:40MILLIONHMMAX INSULATIONRESISTANCE:100MEGOHMSMIN. LNSERTIONFORCE:5N\~20N
UNMATINGFORCE:8N\~20N
DURABILITY:8,000CYCLES
DRAWINGSMARKED"\*"FORQIPDIMENSION.
GUBF0C3.16CXXU5.BXS20AUSBCFRASMT16PIN，LCP黑胶L=6.5沉板1.0卷装
NOTE:
MATERIALSPECIFICATION
HOUSING:HIGHTEMPERATURERESISTANTPA9TORLCPPLASTIC,UL94V-0.CONTACTS:COPPERALLOY(C1814)MIDPLATE:STAINLESSSTEEL(SUS301)FRONTSHELL:STAINLESSSTEEL(SUS304)
PLATINGSPECIFICATION
CONTACTS:Ni50u"MIN.UNDER PLATED OVERALL. AuPLATED ONTHEFUNCTIONALAREA OF CONTACT. (GOLDPLATINGTHICKNESSFOLLOWTHEP/N) PLATINGSPECIFICATIONSOFTHESOLDERAREAFOLLOWTHEP/N FRONT SHELL: Ni30u\*MIN. UNDER PLATED OVER ALL. MID PLATE: CLEAR ONLY
MECHANICALPERFORMANCE INSERTIONFORCE:0.5\~2.0kgf. REMOVAL FORCE: 0.8kgf-2.0kgf. DURABILITY:10000CYCLES.
ELECTRICALPERFORMANCE
CURRENTRATING:5.0AVOLTAGERATING:5.0VLLCR:VBUS&GNDPINSANDOTHERPINS:40mΩ/PINMAX.SHIELD:50mΩ/MAX.LLCRMAX.CHANGEOFALLPINS:10mΩINSULATIONRESISTANCE:100MΩMINDIELECTRICWITHSTANDVOLTAGE,AC100VFOR1MINUTE.
ENVIRONMENTALPERFORMANCEOPERATINGTEMPERATURE:-25C\~+85℃
IRREFLOW THEPEAKTEMPERATUREONTHEBOARD SHALLBEMAINTAINEDFOR10SECONDSAT260℃.
GUBF0C3.24BXXU5.BLS10AUSBCFRASMT24PIN，板0.8卷装
NOTE:
MATERIALSPECIFICATION
HOUSING:HIGHTEMPERATURERESISTANTPLASTIC,UL94V-0.CONTACTS:COPPERALLOYMIDPLATE:STAINLESSSTEELFRONT SHELL: STAINLESS STEEL EMIPLATE:STAINLESSSTEEL
PLATINGSPECIFICATION
CONTACTS:Ni 50u"MIN. UNDER PLATED OVERALL AuPLATED ONTHEFUNCTIONALAREA OF CONTACT. (GOLD PLATING THICKNESS FOLLOWTHE P/N) PLATING SPECIFICATIONS OF THE SOLDER AREA FOLLOW THE P/N FRONT SHELL: Ni30u\*MIN. UNDER PLATED OVER ALL. MID PLATE: CLEAR ONLY
MECHANICALPERFORMANCE INSERTIONFORCE:0.5-2.0kgf REMOVAL FORCE: 0.8kgf-2.0kgf.DURABILITY: 10000 CYCLES.
ELECTRICALPERFORMANCE
CURRENTRATING:5.0A VOLTAGERATING:5.0V LLCR:VBUS&GNDPINSAND OTHERPINS:40mΩ/PINMAX. SHIELD: 50mΩ/MAX.LLCR MAX. CHANGE OF ALL PINS:10mΩ INSULATIONRESISTANCE:100MΩMIN DIELECTRIC WITHSTANDVOLTAGE,AC 100VFOR1MINUTE.
ENVIRONMENTALPERFORMANCE
OPERATINGTEMPERATURE:-25'C\~+85℃IRREFLOWTHEPEAKTEMPERATURE ONTHEBOARDSHALLBEMAINTAINED FOR10 SECONDSAT260°C.
GUBF0C1.06CXXU5.BL020AUSBCF直立式SMT6PINLCP黑钢壳镀镍H=6.5
NOTE:
SPECIFICATION
CURRENTRATING:3.0AMAX
DIELECTRIC WITHSTANDINGVOLTAGE:100VACTEMPERATURERANGE:-30℃C\~85℃
CONTACTRESISTANCE:40MILLIONHMMAXINSULATIONRESISTANCE:100MEGOHMSMIN.LNSERTIONFORCE:5N\~20N
UNMATING FORCE:8N\~20N
DURABILITY:10000CYCLES
GUBF0C1.16CGXU5.BL010AUSBCF直立式SMT16PIN，LCP黑胶4脚外壳镀镍，H=6.4，有柱，卷装
S
NOTE:
MATERIALSPECIFICATION
HOUSING:HIGHTEMPERATURERESISTANTPLASTIC,UL94V-0.CONTACTS:COPPERALLOYMIDPLATE:STAINLESSSTEELFRONTSHELL:STAINLESSSTEELEMI PLATE:STAINLESSSTEEL
PLATINGSPECIFICATION
CONTACTS: Ni50u\*MIN. UNDERPLATEDOVERALL. AuPLATEDONTHEFUNCTIONALAREAOFCONTACT. (GOLD PLATING THICKNESS FOLLOW THE P/N) G/FPLATED ONTHESOLDERAREA FRONT SHELL: Ni30u\* MIN. UNDER PLATED OVER ALL. MID PLATE&EMI PLATE: CLEAR ONLY
MECHANICALPERFORMANCE INSERTIONFORCE:0.5-2.0kgf. REMOVALFORCE: 0.8kgf\~2.0kgf.DURABILITY:10000 CYCLES.
ELECTRICALPERFORMANCE
CURRENTRATING:5.0A VOLTAGERATING:5.0V LLCR:VBUS&GND PINSAND OTHERPINS:40mΩ/PINMAX. SHIELD: 50mΩ/MAX.LLCR MAX.CHANGE OF ALL PINS:10mΩ INSULATIONRESISTANCE:100MΩMIN DIELECTRIC WITHSTANDVOLTAGE,AC 100VFOR1MINUTE.
ENVIRONMENTALPERFORMANCE
OPERATINGTEMPERATURE:-25C\~+85C
IRREFLOWTHEPEAKTEMPERATUREONTHEBOARDSHALLBEMAINTAINEDFOR10 SECONDSAT260℃.
GUBF0C1-16CXXU5-BL010A F:Female 0:RoHs C1: Type C,Vertical 01:SMT/H6.4W/Pillar 16:16PIN L:LCP C:Copper Alloy B: Black G:FullGoldS:Selevite Gold Bright TIN 5: Full Ni M: SeleviteGoldMatteTIN SHELLMATERIAL U:SUS 3:FUNCTIONALAREA3u”otherG/F 5:FUNCTIONALAREA5u"otherG/F
GUBF0C2.24CXXU5.BL010TUSBCF24PIN夹板式LCP黑不锈钢壳镀镍H=10.45管装
0.40SBTYPECMALEUSBTYPECFEMALEAFTER ASSEMBLY8.34+0.02A1 A1200000000E 1R1.10 00000000000B12 B1 8.506.7010.00NOTE: 6.50
MATERIALSPECIFICATIONHOUSING:HIGHTEMPERATURERESISTANTPLASTIC(LCP),UL94V-0. 560CONTACTS:COPPERALLOY(C1814)T=0.12mmMIDPLATE:STAINLESSSTEEL(SUS301)T=0.20mmEMIPLATE:STAINLESSSTEEL(SUS301)T=0.10mmSHELL:STAINLESS STEEL(SUS304)T=0.30mm
PLATINGSPECIFICATIONCONTACTS:Ni50u"MIN.UNDERPLATEDOVERALL 0.50 0.70(4X)AUOLATEDTINTHHIFUNCTIONOLLAREAOFCONTACT 5.54 UTHCKNE5PLATINGSPECIFICATIONSOFTHESOLDERAREAFOLLOWTHEP/NFRONTSHELL:Ni30u\*MIN.UNDERPLATEDOVERALL.MID PLATE:Ni30u"MIN. UNDER PLATED OVERALL.Sn80u"MIN.PLATEDOVERALLEMIPLATE:CLEARONLY
MECHANICALPERFORMANCE INSERTIONFORCE:0.5\~2.0kgf. GUBF0C2-24CXXU5-BL010TREMOVALFORCE:0.8kgf\~2.0kgf. DURABILITY:10000CYCLES.
ELECTNCALTINRFORMVNCTAGERATING:5.0V E2:Type C,SpIntTe T:TUHSLLCR:VBUS&GNDPINSANDOTHERPINS:40mQ/PINMAX. 24:24PIN 01: H10.45SHIULDTIONREMASTALLCRMAX.CHANGEOFALLPINS:10mQ. C:COPPERALLOY L:LCPDIELECTRIC WITHSTANDVOLTAGE,AC 100VFOR1MINUTE. G:Full GoldS:SeleviteGold Bright TIN B:Black
ENVIRONMENTALPERFORMANCEOPERATINGTEMPERATURE:-25C\~+85C M:SeleviteGold Matte TIN 5: Full Ni
IRREFLOW THE PEAKTEMPERATURE ON THE BOARD SHALL 1:1U3:3U" U:SUS(SHELL)BEMAINTAINEDFOR10SECONDSAT260℃.
GUBF2C0.24CXXU5.BL110AUSB3.1CF24PINRA前插后贴LCP黑不锈钢壳镀镍L=8.65卷装
NOTE:
MATERIAL
MOLDING:LCPUL94V-0CONTACT:COPPERALLOY.G/FONCONTACTAREA，100u"MinTIN(LEADFREE)ONSOLDERAREA,NIUNDERPLATINGOVERALLSHELL:SUS304-H,T=0.30±0.03mm
50u" NICKELPLATING OVERALL.
SHILD:SUS304-H, T=0.12±0.03mm
MECHANICAL
INSERTION:5\~20N.EXTRACTION:8\~20N. DURABILITY:10000CYCLES
ELECTRICAL
CURRENT:5AMINFORVBUS;0.25AMINFOROTHER.
VOLTAGE:20VMAX WITHSTANDINGVOLTAGE:100VAC.
CONTACTRESISTANCE:40mΩMAX.
INSULATIONRESISTANCE:100MΩMIN.
ENVIRONMENTAL
TEMPERATURERANGE-55C\~+85C
NOTE:
MATERIAL
MOLDING:LCP UL94V-0
CONTACT:COPPERALLOY.G/FONCONTACTAREA,
100u"MinTIN(LEADFREE) ONSOLDERAREA
SHELL:SUS304-H, T=0.30±0.03mm
50u"NICKELPLATINGOVERALL
SHILD:SUS304-H,T=0.12±0.03mm
MECHANICAL INSERTION:5\~20N.EXTRACTION:8\~20N. DURABILITY:10000CYCLES
ELECTRICAL
CURRENT:5AMINFORVBUS;0.25AMINFOROTHER.
VOLTAGE:20VMAX WITHSTANDINGVOLTAGE:100VAC.
CONTACTRESISTANCE:40mΩMAX.
INSULATIONRESISTANCE:10OMΩMIN.
ENVIRONMENTAL TEMPERATURERANGE-55C\~+85°C
NOTE:
MECHANICAL INSERTION:5\~20N. EXTRACTION:8\~20N. DURABILITY:10000CYCLES
ELECTRICAL
CURRENT:5A MINFORVBUS;0.25AMINFOROTHER.
VOLTAGE:20VMAXWITHSTANDING VOLTAGE:100VAC.
CONTACTRESISTANCE:40mΩMAX.
INSULATIONRESISTANCE:100MΩMIN.
ENVIRONMENTAL TEMPERATURERANGE-55°C\~+85°C
GUBF0C4.24CXXU5.BLS13AUSBCF24PINRA单排SMT垫高4.3LCP黑双不锈钢壳镀镍脚距4.5L=8.048H卷装
08.34+0.02 A12 (LASER WELD AREA) 0.30（4X0.60(4X) 1.00(4X)210.80(2X) 0.60(4X)20（4X 20.60(2X)2.90 3.94 ALL CONTACT 6.60 P.C.B EDGE4.50 CONNECTORNOTE: 6.65 Nl .22 EDGE
MATERIALSPECIFICATION 1.95 URECOMMENDED PCB LAYOUT(TOP VIEW)HOUSING:HIGHTEMPERATURERESISTANTPLASTIC,UL94V-0.CONTACTS:COPPERALLOY(C1814)MIDPLATE:STAINLESSSTEEL(SUS301)FRONTSHELL:STAINLESSSTEEL(SUS304)TOPSHELL:STAINLESSSTEEL(SUS304) PLUG-
PLATINGSPECIFICATION AFTER MATINGCONTACTS:Ni50u"MIN.UNDERPLATEDOVERALLAuPLATEDONTHEFUNCTIONALAREA OFCONTACT.(GOLD PLATING THICKNESSFOLLOWTHEP/N)PLATING SPECIFICATIONS OFTHESOLDERAREAFOLLOWTHEP/NFROPTASHELL:Ni3OU"MIN.UNDERPLATEDOVERALL GUBF0C4-24CXXU5-BLS13A
MECHANICALPERFORMANCE INSERTIONFORCE:0.5\~2.0kgf. F:Female 3:RoHs/48HREMOVALFORCE: 0.8kgf-2.0kgf. DURABILITY:10000 CYCLES. C4:TypeC,R/A，Heighten S1: Heighten4.3
ELECTRICALPERFORMANCE 24:24PIN (L=8.0) Double ShellVOLTAGERATING:5VDC/AC(RMS.maX)CURRENTRATING:5.0A1.25AMPSFORCCPIN,0.25AMPS.FORALLOTHERCONTACT. C:COPPERALLOY L:LCPLLCR:VBUS&GNDPINSANDOTHERPINS:40mΩ/PINMAX. G: Full GoldS:SeleviteGold Bright TIN B:BlackSHIELD:50mΩ/MAX.LLCRMAX. CHANGE OFALL PINS:10mΩ. M:SeleviteGoldMatteTIN 5:FullNiDIELECTRICWITHSTANDVOLTAGE,AC100VFOR1MINUTE. INSULATIONRESISTANCE:100MΩ MIN 1:1U"3:3U" U:SUS(SHELL)
ENVIRONMENTALPERFORMANCEOPERATINGTEMPERATURE:-25C\~+85C
IRREFLOWTHEPEAKTEMPERATUREONTHEBOARDSHALLBEMAINTAINEDFOR10 SECONDSAT260℃.
GUBF2C3.24CXXU5.BL110AUSB3.1CFRA24PIN前插后贴LCP黑胶沉板CL0.28L=8.6双铁壳卷装
NOTE:
MATERIAL
MOLDING:LCPUL94V-0 CONTACT:COPPERALLOY. GOLDPLATEDMinONCONTACTAREA,100u" MinTIN(LEADFREE)ONSOLDERAREA, SHELL:SUS304-H,T=0.30±0.03mm 50u"NICKELPLATING OVERALL. SHILD:SUS304-H,T=0.12±0.03mm
MECHANICAL
INSERTION:5\~20N.EXTRACTION:8\~20N. DURABILITY:10000CYCLES
ELECTRICAL
CURRENT:3AMINFORVBUS;0.25AMINFOROTHER.
VOLTAGE:20VMAXVOLTAGE:5VMAXWITHSTANDINGVOLTAGE:100VAC.
CONTACTRESISTANCE:40mΩMAX.
INSULATIONRESISTANCE:100MΩMIN.
ENVIRONMENTAL
TEMPERATURERANGE-55C\~+85C
G50F1.133G35BN.01R00G5013W3母座
SATA7+15Pin 加高型H7.2DIPTYPE
DisplayPort20PinDIPTYPE
S
0.5MM公座H3.0-6.58-100PINS
0.5MM母座H3.0-6.58-100PINS
0.5MM间距H1.2抽屉下接
备忘录：
期待我们的合作，感谢有您！
Looking forward to our cooperation, thank you!
东莞市研达电子科技有限公司DONGGUANYANDAELECTRONICTECHNOLOGYCO.,LTD
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