创新材料 驱动未来
INNOVATIVE MATERIALS DRIVING THE FUTURE
PRODUCT MANUAL
2026版
产品手册
公司简介
浙江华正新材料股份有限公司(以下简称“华正新材”)成立于
2003年,是华立集团的控股成员企业,是国内最早从事研发生产
环氧树脂覆铜板的企业之一,连续获得五届“中国印制电路行业优
秀民族品牌企业”称号。
2017年1月3日,华正新材(股票代码:603186)正式在上海
证券交易所A股上市 。公司已通过ISO9001、ISO/TS16949质量管
理体系和ISO14001环境管理体系认证。主营覆铜板(包括粘结
片)、复合材料(包括功能性复合材料和交通物流用复合材料)和
膜材料等产品的设计、研发、生产及销售,产品均已通过中国CQC、
美国UL、日本JEL和SGS认证,并广泛应用于5G通讯、服务器、
数据中心、半导体封装、新能源汽车、智慧家电、医疗设备、轨
道交通、绿色物流等领域。
截止2024年底,华正新材拥有员工约2400多人,拥有国家专
利263项,其中发明专利98项,实用新型专利154项,外观11项,
主导或参与制定国家及行业标准20项。先后荣获中国驰名商标、
国家高新技术企业、中国印制电路行业优秀民族品牌、浙江省企业
技术中心、国家企业技术中心、浙江省重点企业研究院等称号。
迄今,华正新材拥有5个主要生产基地,业务覆盖100多个国
家和地区。展望未来,华正将继续秉持创新与专业精神双轮驱动,
始终与时代共呼吸,突破关键核心技术,打破技术垄断,致力于成
为高端电子基础材料和特种复合材料等新材料应用领域总体解决方
案的提供商。
01
企业历程
1989 前身:
华立达公司成立
2014 CNAS认可实验室
2015 导入BLM战略
2017.12 青山湖一期
智造基地投产
2003.03 华正新材成立
2017.01 沪市603186
登入资本市场
2021 成立日本子公司
华正新材料株式会社
成立韩国子公司
2020 青山湖二期建设
珠海基地建设
国家企业技术中心
2022 珠海基地一期正式投产
与电子材料院成立
合资公司“中科华正”
2018 高频高速材料
获得知名通信企业技术认证
2023 华正新材二十周年
珠海华正二期投产
02
通信材料
03
DK
3.50
3.00
2.65
2.55
2.20
HC348
(Dk3.48
Df 0.0037)
PTFE 玻纤
PTFE 无玻纤
热固性 玻纤布
HN22
(Dk2.20 Df 0.0009)
HN22X
(Dk2.20 Df 0.0021)
粘结片
在研
HC348D
(Dk3.48 Df 0.0030)
导热:0.8W/m•K
HC348T
(Dk3.90 Df 0.0026)
导热:1.2+W/m•K
H5#&
(Dk2.1~2.65)
天线
毫米波
功放
特种装备
HC298
(Dk2.98
Df 0.0030)
H5300S
(Dk2.94
Df 0.0010)
H5300
(Dk2.98
Df 0.0020)
AD. TLX. TLY Series RO4***G3 RO3***3/RO3***G2 R5*15
RO4***F TC3** TC3**plus
CL**-XT
F**se
RT***880
HB348
(Dk3.50
Df 0.0040)
HP28
(Dk2.80
Df 0.0017)
HN30X
(Dk3.00
Df 0.0010
HMW30
(Dk3.00
Df 0.0020)
H5350T
(Dk3.50
Df 0.0023)
导热:0.8W/m•K
H5350P
(Dk3.50
Df 0.0015)
导热:1.2W/m•K
H5350U
(Dk3.50
Df 0.0012)
导热:1.6+W/m•K
华正高频材料产品技术蓝图
通信材料
PTFE产品方案
大功率
华正材料型号: H5350T
Dk:3.50
Df:0.0020
导热系数:0.8W/m·K
超大功率
华正材料型号: H5350P
Dk:3.50
Df:0.0020
导热系数:1.2+W/m·K
AAU
华正材料型号:HN30X (PTFE)
77GHz
产品方案
卓越的电气性能,材料无玻璃布增强,所以具有很好
的均质特性(高频下稳定的介电常数、损耗低)
优异的耐化学性(耐酸碱及多数有机溶剂)
产品特性
Dk:3.0±0.04
Df:0.0010
TCDK:-5 ppm/℃
Z轴CTE:26 ppm/ ℃(-50~288℃)
华正材料型号 HMW30(热固性)
优异的可加工性
稳定一致的介电性能
产品方案
产品特性
Dk:3.00±0.04
Df:0.0020
Tg:200℃
优异的电气性
04
高频材料 / 功放、毫米波雷达应用
通信材料
05
ULL3
ULL2
ULL1
low Loss
Mid Loss
0.010
H2
H4
H6
H7
H8
Halogenated Halogen Free
HSD8
(L2-glass)
HSD9LG Q Switch/CPO:
224Gbps/lane
Switch/CPO:112Gbps/lane
Switch/CPO:56Gbps/lane
PCIe 6.0: Oak、venice
Switch/CPO:25Gbps/lane
PCIe 5.0: EGS、Birch
Switch/CPO:10Gbps/lane
PCIe 4.0: Whitley
PCIe 3.0: Purley
HSD8LG
K/K2/Q
HSD7LG/(K)
H190HF
H185HF
H175HFZ
HSD8(K)
H350/(K)
(Low CTE)
HSD7/(K)
H360(Z)
H9
0.004
0.002
0.0005
0.006
0.014
TBD
Hxx Q:Q-glass
Hxx K2:Better LowDk-glass
Hxx K: LowDk-glass
Hxxx: E-glass
华正高速材料产品技术蓝图
通信材料
06
高速材料市场应用
边缘服务器
空口
有源天线AAU
光传送网OTN 移动边缘计算MEC 网络功能虚拟化
集中式单元CU
分布式单元DU
用户面UP
控制面UP
光纤 光纤
光纤
OTN
SND
NFV
BBU-DU MEC
AUU BBU-CU Core-UP Core-UP
终端 基站
前传 中传 后传
边缘云 核心云
交换路由设备
Switch/Router
光模块
Optical modules
网关设备
BBU
光模块
Ai服务器/服务器
(Ai-server/Server)
交换路由设备
H175HFZ
H185HF
H190HF
H360(Z)
H350系列
HSD7LG系列
HSD8LG系列
HSD9LG
H175HFZ
H185HF
H190HF
H360(Z)
H350系列
HSD7LG系列
HSD8LG系列
H175HFZ
H185HF
H190HF
H360(Z)
H350系列
HSD7LG系列
H175HFZ
H185HF
H190HF
H360(Z)
H350系列
HSD7LG系列
HSD8LG系列
HSD9LG
H175HFZ
H185HF
H190HF
H360(Z)
H350系列
HSD7LG系列
HSD8LG系列
HSD9LG
H175HFZ
H185HF
H190HF
H360(Z)
H350系列
H175HFZ
H185HF
通信材料
07
150℃
2018 2019 2020 2021 2022
160℃ 170℃ 180℃ 190℃ Tg(℃)
2022
H150 (LF)
H1170 H175HFZ
H155HF
(Dk4.3 Df 0.010)
H170GR
(Dk3.4 Df 0.008)
H185HFL
(High Tg Low CTE HF)
Halogen Free
Lead Free
H151HF
(Mid.Tg HF)
(High Tg Low CTE HF)
(Low Dk/Df High Tg HF)
For AI-PC
(Low Df+High Rigidity Mid.Tg HF)
华正HDI材料产品技术蓝图
通信材料
08
高端消费电子
智能穿戴
H175HFZ H170GR
智能手机/平板
H151HF H175HFZ H170GR 185HFL
车载&车联网
H151HF H170GR H175HFZ H150(LF)
模组
H155HF H175HFZ H170GR 185HFL
笔记本电脑
H151HF H155HF H170GR
无卤素Halogen Free
有卤Halogen
VR/AR/智能穿戴
智能家居
H151HF H175HFZ H170GR H150(LF)
H155HF H175HFZ H170GR 185HFL
汽车电子材料
09
汽车电子华正材料一站式解决方案
电动化、智能化
高耐热性需求
低膨胀系数
耐高压需求
主要应用 电动化、智能化
汽车电子华正材料 Roadmap
车算及域控制 毫米波 车灯、HUD
Item
Tg
Z-CTE
T-288
DSC/TMA
ASTMDSM5470 w/m·k
50~260℃
Unclad
℃
%
Min
Dk
10GHZ
(RC 70%)
/
Df /
CTI
导热系数
C-96/20/65 V
157
2.3
>30
4.4
0.4
0.016
PLC3
185
2.0
>60
4.3
0.5
0.012
PLC3
153
2.7
>30
4.1
0.5
0.014
PLC3
180
1.8
>60
3.59
0.5
0.0112
PLC3
180
2.2
>60
3.47
0.5
0.0070
PLC3
215
2.0
>60
3.27
0.5
0.0038
PLC3
200
NA
>120
3.0
0.4
0.0016
PLC0
NA
NA
>120
3.0
0.55
0.0010
PLC0
152
25/55
>5
NA
2.2 3.0
NA
PLC0
152
25/55
>5
NA
2.2 3.0
NA
PLC0
168
2.3
>30
4.6
0.8
0.012
PLC0
热性能
电性能
特殊
应用
Test
Method Unit H150(LF)Z H1170Z H150HF H160HF H175HFZ H185HF H360(Z) HMW30 HN30X HA88 HC88
车灯、HUD
高可靠性
高导热需求
耐高压需求
车算及域控制
高算力需求
高可靠性
高多层HDI设计
毫米波
稳定性
一致性
超低损耗
汽车电子材料
10
汽车电子核心部件华正材料用材指南
汽车电子各域华正材料解决方案
动力总成域
FR4.0:H150(LF)Z,H1170Z
CTI600:H160HF
FR15.1:H175HFZ
FR4.0:H150(LF)Z,H1170Z
FR15.1:H175HFZ
FR4.0:H150(LF)Z,H1170Z
FR15.1:H175HFZ
IMS:HA88/HC88
FR4.0:H150(LF)Z,H1170Z
Low loss:
H175HFZ,H185HF,H360(Z)
PTFE:HN30X
PPO:HMW30
车身
电源 电机 电控
OBC
加热器
车灯 后视镜 车顶 空调 雨刮器 智能门 无钥匙启动
整车控制器
减速器 电驱桥
悬挂 气囊 制动
IVI 中控
娱乐系统
HUD
转向
电子停车 车内传感
激光雷达 摄像头
毫米波雷达
智能座舱域
GPS
电机控制 胎压监测 计算平台
底盘域 智能驾驶域
车灯系统
头灯、转向灯...等
HA88 T2/T3
绝缘层厚:45um~200um
HC88 T2/T3
绝缘层厚:45um~200um
自动驾驶
正向、角、舱内雷达..等
HN30X+中高TG混压
HMW30纯压+中高TG混压
车载运算
智能域控、通信模组...等
H175HFZ 通孔高多层三阶
以上HDI
HA4G 通孔高多层三阶
以上HDI+混压
H360(Z)通孔高多层三阶
以上HDI+混压
车身电子
摄像头、音影娱乐传感控
制、..等
H150HF 通孔、三阶及以
下HDI
H150(LF)Z 通孔、三阶及
以下HDI H1170Z 通孔、
三阶及以下HDI
电动模块
电机、电控、电池、充电模块..等
H150(LF)Z 通孔、厚铜6OZ / H1170Z 通孔、厚铜6OZ / H160HF 通孔、厚铜8OZ
汽车电子材料
11
智能驾驶计算单元华正材料解决方案
Property Test Condition
Typel Grade ML LL ULL1+
210 210 215
H175HFZ H185HF H360(Z)
特点:
◆优异的电性能
◆可靠的耐热和CAF能力
◆无铅兼容适用于混压方案
◆高多层通孔及高阶HDI应用
应用场景:
◆车载通信、车联网、智能域控
Tg(℃) DMA
Peel Strength (N/mm) 1oz(标配铜箔) 0.85 0.8 0.65
Dk(RC 70%) 10GHz SPDR 3.59 3.47 3.27
Df(RC 70%) 10GHz SPDR 0.0112 0.0070 0.0038
Moisture Absorption(%) D 24/23 0.10 0.8 0.65
TD(℃) Weight Loss 5% 385 385 408
Z-Axis(RC 55%)(%) 50~260℃ TMA 1.8 2.2 2.0
CTE X/Y-Axis (ppm/oC) < Tg, TMA 17/18 17/18 16/17
T288(min) TMA >60 >60 >60
< Tg, TMA 33 35 35
194 200 203
CTE Z-Axis (ppm/oC)
>Tg, TMA
◆H175HFZ 10L 三阶HDI ◆H175HFZ 16L 一阶HDI
◆H185HF纯压 16L四阶HDI
H360(Z)+H175HFZ 16L 四阶HDI
汽车电子材料
12
组合式前大灯/HUD抬头显示(铝基板)
汽车前照大灯(铜基板)
组合式前大灯/HUD抬头显示:
板材型号:HA88 T3S(铝基)
导热系数(ASTM-D5470):3.2W/m.k
绝缘层:Min 45um
Tg:180℃
MOT:150℃
尾灯/雾灯/辅助灯:
板材型号:HA88 T2/T3(铝基)
导热系数(ASTM-D5470):2.2/3W/m.k
绝缘层:50-75um
Tg:150℃
MOT:150℃
ADB矩阵式集成头灯(铜基板)
典型LED型号:
Luminleds-Altilon(热电分离LED)
镭射钻孔导热方案选择
板材型号:华正 HC88(铜基板)
关键技术:镭射钻孔+脉冲电镀
方案优势
相对比传统热电分离,焊盘位置平整度更高,解决由
于焊盘平整度问题导致的焊盘开裂和LED偏光
热电分离LED
镭射密集孔+电镀填孔
铜基板
典型LED型号:
Osram-Black Flag
方案匹配覆铜板材料
板材型号:华正 HC88(铜基板)
最薄绝缘层厚度:Min 45um
方案优势
超薄绝缘层,超低热阻。绝缘层:Min 45um
严格的品质控制,更好的可靠性
正负极LED
高导热绝缘层,绝缘层45um
铜/铝基板
多排阵列式矩阵车灯方案
◆设计20-200个像素点 ◆2-4排LED灯珠设计
单排阵列式矩阵车灯方案
◆设计5-20个像素点 ◆单排LED灯珠设计
高导热绝缘层50um
金属基板
LED
方案匹配材料方案:
材料型号:HC88 铜基板
导热系数(ASTM-D5470):3W/m.k
铜厚:1OZ
超低热阻绝缘层:50um
适用于单/多排阵列式车灯设计
导热材料
13
导热材料应用方案
室内/室外照明
电视灯条、舞台照明
Tg:110℃
MOT:140℃
绝缘层厚度:100um~150um
导热系数(ASTM D5470):1W/m·K、2W/m·K
HA80 T1/T2
汽车照明、电源控制
Tg:150℃/180℃
MOT:150℃
绝缘层厚度:45um~200um
导热系数(ASTM D5470):2.2W/m·K
3W/m·K、3.2W/m·K
HA88/HC88 T2/T3/T3S
电机控制器、高压充电机、功率模块
Tg:195℃
MOT:150℃
绝缘层厚度:130um、150um、195um
导热系数(ASTM D5470):5.7W/m·K
HA88/HC88 T6
导热材料
14
组合式前大灯/HUD抬头显示(铝基板)
可弯折基板
铝面控深技术加工 弯折区域
可弯折基板设计方案:
材料型号:HA88 E2(可弯折材料)
导热系数 (ASTM-D5470): 2.0W/m.k
铜厚:1-2oz
绝缘层厚度:100um
组合式前大灯/HUD抬头显示:
板材型号: HA88 T3S(铝基)
导热系数(ASTM-D5470):3.2W/m.k
绝缘层:Min 45um
Tg:180℃
MOT:150℃
尾灯/雾灯/辅助灯:
板材型号: HA88 T2/T3(铝基)
导热系数(ASTM-D5470):2.2/3W/m.k
绝缘层:50-75um
Tg:150℃
MOT:150℃
载板材料
15
BT材料技术蓝图
显示/照明用类BT材料HW20、HB20、HI10L
14
0.020 0.015 0.010 0.008 0.006 0.004 0.002
12
10
8
6
4
2
HVM
LVM
RD
HW20
HB20
HI10L
HI10LF K
HI07L
HI05L
HI03L T
HI03L HI05L T
HI10L T
Mini LED
X/Y CTE(ppm/℃)
Df(1GHz)
Chip RGB
5G AiP
5G RF
FC BGA
RF
RMIC
Memory(DDR4、
SSD、MCU......)
HI10L K DDR5
产品特色
无铅无卤材料、BT树脂基材料
低X/Y CTE:9-13ppm/℃
耐热性好(DMA) :≥190℃-260℃
高模量:23GPa-27GPa
优异及厚度均匀性:±2.5%
白料具备优异耐黄变,可见光发射率高(≥85%)
良好的冲压和钻孔能力
应用领域
HW20:Chip LED、Mini 背光
HB20、HI10L:Mini RGB
IC载板用BT材料HB20、HI10L、HI07L、HI05L
产品特色
无铅无卤材料、BT树脂基材料
低X/Y CTE:7-13ppm/℃
耐热性好(DMA) :230-300℃
高模量:27GPa-32GPa
优异及厚度均匀性:±2.5%
良好的冲压和钻孔能力
应用领域
HB20、HI10L:Memory、MEMS、VCM音圈马达、PMIC等
HI07L:FC BGA、RF、PMIC等
Mini LED背光显示应用
Mini RGB显示器件应用
IC Substrate
TF卡
Memory
PMIC
RF
MEMS...
PMIC
UDP卡
DDR
载板材料
16
CBF材料技术蓝图
50
0.020 0.015 0.010 0.008 0.005 0.002 0.001
40
30
20
10
8
5
可提供样品材料
RD
CBF-018
CBF-004
CBF-014A/CBF-013
注,CBF背胶铜箔命名规则CBF-xxxRCC
CBF-014A for VCM or ECP
CBF-018/013/004 For FC BGA X/Y CTE(ppm/℃)
Df(1GHz)
CBF-LE17
CBF-002
感光胶膜
FO PLP 导热胶膜
CBF定义
CBF(Creative Build-up Film)积层薄膜是一种薄膜状热固性绝缘封装基板材料
产品特色
绝缘性高
具有一定的柔性、无玻纤
高频低介电、低损耗、高Tg
高结合力(满足金属喷溅及化学铜工艺)
填充性能良好
除胶渣工艺后粗糙度低、传输损耗低,可靠性良好
镭射钻孔小孔加工性能良好、真圆度和垂直度高
适用于SAP半加成法生产L/S≤15/15μm的多层封装基板
有助于电子系统的小型化、轻薄化、多功能,高性能发展
CBF材料(RCC)
CBF材料(Normal)
BOPP(25μm)
PET release film(38μm)
CBF Materials(15~100 μm)
Protection film
Copper foil(2/3/12/35...μm)
CBF Materials(15~100 μm)
应用场景
FC BGA载板(CBF) ECP电源管理载板(CBF)
VCM音圈马达(CBF RCC)
Die
PRODUCTS
Basic Material
Automotive
Material
Product Series UL Type Features Tg(°C) Td(°C) page
Product Series UL Type Features Tg(°C) Td(°C) page
High-end
consumer
electronics
H150(LF)Z
H160HF
H150HF
H1170Z
H175HFZ-15
HA4G
H160HF-15
H150(LF)
H150(LF)Q
H1170
H1170Q
H140A
H140A M
H1600HF
H1600A
H2600
H2600A
H2135
157
168
153
185
180
190
168
157
157
185
180
134
134
136
136
126
127.2
128
358
352
360
360
385
430
352
358
358
360
385
310
325
342
342
335
310
330
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
FR-4.0, High Performance, Mid-Tg, Lead-free
FR-4.1,CTI 600, Halogen Free
FR-4.1, Mid-Tg, Halogen Free
FR-4.0, High Performance, High-Tg, Lead-free
FR-15.1, High Tg, Halogen-free,MOT150°C
FR-4.1, High Tg, Low CTE, Halogen-free
FR-4.1 Halogen-free,Upper-Mid-Tg,CTI600,MOT150°C
FR-4.0, Mid-Tg for Lead free
FR-4.0, Mid-Tg for Lead free, Automotive
FR-4.0 High Tg for Lead free
FR-4.0, High Performance, Automotive-used Materials
FR-4.0, Conventional FR-4
FR-4.0, Conventional FR-4
FR4.1, Halogen Free,CTI600
FR4-4.0, Normal FR4, CTI600
CEM-3, Halogen-Free,CTI600
CEM-3, High CTI600
CEM-3.0 CTI600
H151HF
H155HF
H170GR
H170HF
H185HF
FR-4.1, Halogen-free, Mid-Tg
FR-4.1, Halogen-free, Mid-Tg, Mid-Loss
FR-4.1, High Tg, Halogen Free & Low Dk/Df Material
FR-4.1,Halogen-free, Upper-Mid-Tg,Lower Df
FR-4.1,Halogen Free, Low Loss & High Reliability Material
153
168
175
165
190
360
386
386
386
430
38
39
40
41
42
17
UL Type Features Tg(°C) MOT(°C) page
Thermal
Conductive
Material
Product Series
110
112
85
150
150
180
195
140
140
150
150
150
150
150
43
44
45
46
47
48
49
Thermal Conductivity 1.0W/m·K
Thermal Conductivity 2.0W/m·K
Thermal Conductivity 2.0W/m·K, Low Storage Modulus
Thermal Conductivity 2.2W/m·K, Excellent Reliability
Thermal Conductivity 3.0W/m·K, Excellent Reliability
Thermal Conductivity 3.2W/m·K, Superior Heat Dissipation
Thermal Conductivity 5.7W/m·K, Superior Heat Dissipation
HA80 T1
HA80 T2
HA88/HC88
T3
HA88/HC88
T3S
HA88/HC88
T6
HA88 E2
HA88/HC88
T2
PRODUCTS
18
Product Series UL Type Features Tg(°C) CTE page
High Tg, Low X, Y/Z Axis Thermal
Expansion Coefficient Material
High Tg, Low X, Y/Z Axis Thermal
Expansion Coefficient Material
High Tg, Halogen-free and Low X, Y/Z Axis
Thermal ExpansionCoefficient Material
HI10L
HI07L
HI10L FK
Crebest
Build-up Film
High Speed
Material
Product Series UL Type Features Tg(°C) CTE page
UL Type Features Dk@
10GHz
Df@
10GHz Product Series page
H175HF
H175HFZ
H180HF
H185HFL
H190HF
H360
H360(Z)
H350
H350(K)
HSD7
HSD7(K)
HSD7JA(K)
HSD7LG
HSD7LG(K)
HSD8(K)
HSD8
HSD8(C)
HSD8LG K
HSD8LG K2
4.3
4.2
3.9
3.9
3.9
3.65
3.65
3.70
3.45
3.53
3.30
3.17
3.90
3.37
3.25
3.12
3.12
3.25
3.20
0.012
0.010
0.007
0.007
0.0055
0.0048
0.0045
0.0042
0.0021
0.0035
0.0023
0.0019
0.0044
0.0025
0.0014
0.0012
0.0012
0.0015
0.0013
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
FR-4.1, High Tg, Halogen Free & Mid Loss Material
FR-4.1, High Tg, Halogen Free & Mid Loss Material
FR4.1, Halogen Free, Low Loss & High Reliability Material
FR-4.1, High Tg, Low CTE, Halogen-free
FR4.1, Halogen Free, Very Low Loss & High Reliability Material
Very Low Loss & Heat Resistance Material
Very Low Loss & Heat Resistance Material
Ultra Low Loss & Heat Resistance Low CTE Material
Ultra Low Loss & Heat Resistance Low CTE Material
Ultra Low Loss & Heat Resistance Material
Ultra Low Loss & Heat Resistance Material
Ultra Low Loss & Heat Resistance Material
Halogen-free Ultra-low Loss & Heat Resistance Material
Halogen-free Ultra-low Loss & Heat Resistance Material
Extreme Low Loss & Heat Resistance Material
Extreme Low Loss & Heat Resistance Material
Extreme Low Loss & Heat Resistance Material
Extreme Low Loss & Heat Resistance Material
Extreme Low Loss & Heat Resistance Material
175
175
180
CBF-013
CBF-014A
CBF-004
29
29
20
63-65
66-68
69-71
CBF-018 180 37 60-62
Low CTE, Low Df, low Ra Crebest
Build-up Film for IC Substrates
Mid-CTE, Low Ra, High peel strength
Crebest Build-up Film for IC Substrates
Mid-CTE, Low Ra, High peel strength Crebest
Build-up Film for IC Substrates
High Tg, Low Ra, High peel strength Crebest
Build-up Film for IC Substrates
Package
Substrate
210
230
220
13-15
11-13
12-14
50
51
52
High Tg, Low X, Y/Z Coefficient of
Thermal Expansion White Material
High Tg, Low X, Y/Z Axis Thermal
Expansion Coefficient Material
High Tg, Low X, Y/Z Axis Thermal
Expansion Coefficient Material
High Tg, Halogen Free, Low X,Y/Z-axis CTE
Black Colored BT Laminate for IC Package
High Tg, Halogen Free, Low X,Y/Z-axis CTE
Black Colored BT Laminate for IC Package
High Tg, Halogen Free, Low X,Y/Z-axis CTE
Black Colored BT Laminate for IC Package
High Tg, Halogen Free, Low X,Y/Z-axis CTE
BT Laminate for Chip LED Substrates and IC Package
HW20-M2
HB20-M1
HB20-M2
HI07L T
HI10L K
HI10L T
HI05L T
9-11
7-9
<11
4-7
9-11
7-9
3-5
260
290
260
290
260
260
280
53
54
55
56
57
58
59
PRODUCTS
19
UL Type Features Dk@
10GHz
Df@
10GHz Product Series page
High Frequency
Material
H5350T
HC298
HC348
HC348D
HMW30
HN30X
3.53
3.50
2.98
3.48
3.42
3.57
3.11
3.00
3.00
0.0025
0.004
0.0030
0.0040
0.0038
0.0035
0.0020
0.0010
0.0015
101
102
103
104
105
106
107
108
109
Thermal Conductive RF PCB Used Laminate Material
High Frequency,RF-PP (Thermosetting Resin)
High Frequency,RF-CCL(Thermosetting Resin)
High Frequency,RF-CCL(Thermosetting Resin)
High Frequency,RF-CCL(Thermosetting Resin)
High Frequency,RF-CCL (Thermosetting Resin)
High Frequency,RF-CCL(Thermosetting Resin)
High Frequency,RF-CCL(PTFE without Glass fiber
High Frequency,RF-PP (Thermosetting Resin)
HB348
高频粘结片
HC348
特征码C
HP28
高频粘结片
H5300S
H5350P
2.94
3.56
0.0012
0.0020
99
100
PTFE with Glass Reinforced RF Circuit Material
High Thermal Conductive RF
PCB Used Laminate Material
High Frequency
Material
H5220
H5255
H5265
H5300H
2.20
2.55
2.65
2.98
0.0009
0.0018
0.0018
0.0020
95
96
97
98
PTFE with Glass Reinforced RF Circuit Material
PTFE with Glass Reinforced RF Circuit Materia
PTFE with Glass Reinforced RF Circuit Materia
PTFE with Glass Reinforced RF Circuit Material
UL Type Features Dk@
10GHz
Df@
10GHz Product Series page
HSD8LG Q
HSD9LG Q
HSD9LG K2
HSD6LG
3.09
3.05
3.16
3.92
0.0011
0.00065
0.0011
0.0045
91
92
93
94
Extreme Low Loss & Heat Resistance Materia
Extreme Low Loss & Heat Resistance Material
Extreme Low Loss & Heat Resistance Material
Halogen-free Ultra-low Loss & Heat Resistance Material
High Speed
Material
H150(LF)Z
20
FR-4.0 High Performance, Mid-Tg, Lead-free
◆耐CAF能力 CAF resistance performance
◆兼容无铅制程 Lead-free compatible
◆优异的耐热性 Excellent thermal reliability
产品特性 FEATURES
产品性能GENERAL PROPERTIES
◆汽车电子、工业设备
Automotive electronics、Industrial equipment
◆厚铜电源 Power supplier and Heavy Copper
◆Mini LED
◆通讯设备 Communication equipment
产品应用 APPLICATIONS
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
157
-
-
35
213
2.3
-
6.25*108
6.12*107
125
57
-
570
465
0.10
358
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.4
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min -
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 30
TMA(Etched) min 40
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.3
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC70%)
介质损耗
Df-Loss Tangent (RC70%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.016
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H160HF
21
FR-4.1 Halogen-free,Upper-Mid-Tg,CTI600
◆兼容无铅制程并具有耐CAF能力
Lead-free compatible and excellent CAF resistance
◆高压耐CAF性能
High voltage CAF resistance performance
◆不含卤素、锑、红磷等成分 Halogen, antimony and red phosphorous free
产品特性 FEATURES
产品性能GENERAL PROPERTIES
◆厚铜电源 Power supplier and Heavy Copper
◆电动汽车电子元器件 EV vehicle electronic
components
◆汽车充电桩 Car charging
产品应用 APPLICATIONS
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
168
-
-
37
210
2.3
-
1.00*107
1.75*109
160
45
-
565
455
0.12
352
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.6
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min -
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 15
TMA(Etched) min 30
IEC-60112 C-96/20/65 Rating PLC 0
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm 1.05
1.25
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.012
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H150HF
22
FR-4.1 Halogen-free, Mid-Tg
◆耐CAF能力 CAF resistance performance
◆兼容无铅制程 Lead-free compatible
◆优良的机械加工性能 Excellent mechanical process ability
◆不含卤素、锑、红磷等成分 Halogen, antimony and red
phosphorous free
产品特性 FEATURES
◆显示器,模组 ,固态硬盘 LCD,Module,SSD
◆游戏机 Game machine
◆汽车电子 Automotive electronics
◆消费电子 Communication equipment
产品应用 APPLICATIONS
产品性能GENERAL PROPERTIES
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
153
-
-
45
225
2.7
-
5.10*109
5.21*107
150
57
-
606
485
0.12
360
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.1
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min -
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 30
TMA(Etched) min 60
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.19
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.014
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H1170Z
23
FR-4.0 High Performance, High-Tg, Lead-free
◆耐CAF性能 CAF resistance performance
◆优异的耐热性 Excellent thermal reliability
◆优良的通孔可靠性 Excellent through-hole reliability
◆优良的机械加工性能 Excellent mechanical process
ability
产品特性 FEATURES
产品性能GENERAL PROPERTIES
◆汽车电子 Automotive electronics
◆厚铜电源 Power supplier and Heavy Copper
◆通信设备 Communication equipment
◆适用于高多层PCB Also suitable for highmult-
ilayer PCBs
产品应用 APPLICATIONS
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
185
-
-
35
184
2.0
-
3.20*108
9.80*107
122
58
-
565
455
0.10
360
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.4
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min -
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 30
TMA(Etched) min 50
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.2
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.016
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H175HFZ-15
FR-4.1 High Tg, Halogen-free,MOT150
◆MOT150
◆高压耐CAF性能 High voltage CAF resistance
performance
◆优异的耐TCT性能 Excellent TCT resistance
◆不含卤素、锑、红磷等成分 Halogen, antimony and red
phosphorous free
产品特性 FEATURES
◆厚铜电源 Power supplier and Heavy Copper
◆电动汽车电子元器件 EV vehicle electronic
components
◆适用于高多层PCB Also suitable for high-
multilayer PCBs
产品应用 APPLICATIONS
24
产品性能GENERAL PROPERTIES
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
180
175
210
33
194
1.8
/
4.70*1010
3.54*10 8
130
60
/
550
450
0.10
385
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.3
SPDR method 10GHz C-24/23/50 4.2
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min >30
2.4.24.1
TMA(Etched) min >60
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ 12.5
N/mm 0.85
1.25
2.4.8 1 oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (XY-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 /
2.5.5.9 1GHz C-24/23/50 / 0.0091
SPDR method 10GHz C-24/23/50 0.0100
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
HA4G
25
Low Loss & Low CTE & Halogen Free
产品特性 FEATURES 产品应用 APPLICATIONS
◆适用于高可靠性、优异CAF表现求应用场景
For high-reliability and excellent CAF performance
applications
◆X/Y/Z 三轴低热膨胀系数(CTE)Low CTE for
X/Y/Z-axis direction
更低的损耗 Low Df for excellent electrical performance
◆汽车及功率能源模块 Automotive and power
energy modules
◆移动设备 Mobile device
◆高速服务器 High-speed server
◆网络及电信设备 Network and telecom
产品性能GENERAL PROPERTIES
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
190
230
270
26
130
1.25
/
>1010
>109
180
30
/
630
520
0.10
430
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.0
SPDR method 10GHz C-24/23/50 3.9
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min >30
2.4.24.1
TMA(Etched) min >60
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >60
2.4.24.5 <Tg,TMA ppm/℃ 10
N/mm 0.8
1.1
2.4.8 1 oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (XY-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 /
2.5.5.9 1GHz C-24/23/50 / 0.005
SPDR method 10GHz C-24/23/50 0.007
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H160HF-15
26
FR-4.1 Halogen-free,Upper-Mid-Tg,CTI600,MOT150℃
◆兼容无铅制程并具有耐CAF能力
Lead-free compatible and excellent CAF resistance
◆高压耐CAF性能
High voltage CAF resistance performance
◆不含卤素、锑、红磷等成分 Halogen, antimony and red phosphorous free
产品特性 FEATURES
产品性能GENERAL PROPERTIES
◆厚铜电源 Power supplier and Heavy Copper
◆电动汽车电子元器件 EV vehicle electronic
components
◆汽车充电桩 Car charging
产品应用 APPLICATIONS
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
168
-
-
37
210
2.3
-
1.00*107
1.75*109
160
45
-
565
455
0.12
352
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.6
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min -
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 15
TMA(Etched) min 30
IEC-60112 C-96/20/65 Rating PLC 0
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.25
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.012
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H150(LF)
27
FR-4.0 Mid-Tg, Lead-free
◆耐CAF性能 CAF resistance performance
◆兼容无铅制程 Lead-free compatible
◆卓越的PCB加工性 Excellent PCB process ability
◆优良的通孔可靠性 Excellent through-hole reliability
产品特性 FEATURESFEATURES
产品性能GENERAL PROPERTIES
◆仪器仪表 Instrumentation
◆计算机和笔记本电脑 Computer and NB
◆消费电子 Consumer electronics
◆汽车电子 Automotive electronics
产品应用 APPLICATIONS
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
157
-
-
55
276
3.3
-
6.25*108
6.12*107
125
57
-
570
465
0.10
358
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.4
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min 60
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 30
TMA(Etched) min 40
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.45
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC70%)
介质损耗
Df-Loss Tangent (RC70%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.016
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H150(LF)Q
28
(FR-4.0)Mid-Tg, Lead-free, Automotive-used Materials
◆耐CAF能力 CAF resistance performance
◆兼容无铅制程 Lead-free compatible
◆优异的耐热性 Excellent thermal reliability
产品特性 FEATURES
产品性能GENERAL PROPERTIES
◆汽车电子专用材料 Specified for automotive
electronics
产品应用 APPLICATIONS
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
157
-
-
55
276
3.3
-
6.25*108
6.12*107
125
57
-
570
465
0.10
358
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.4
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min 60
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 30
TMA(Etched) min 50
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.45
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC70%)
介质损耗
Df-Loss Tangent (RC70%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.016
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H1170
29
FR-4.0 High Tg, High Performance, Lead-free
◆耐CAF性能 CAF resistance performance
◆优异的耐热性 Excellent thermal reliability
◆优良的通孔可靠性 Excellent through-hole reliability
◆优良的机械加工性能 Excellent mechanical process
ability
产品特性 FEATURES
◆工业设备 Industrial equipment
◆通讯 Communication
◆汽车电子 Automotive electronics
◆适用于高多层PCB Suitable for high multilayer
PCB
产品应用 APPLICATIONS
产品性能GENERAL PROPERTIES
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
185
-
-
45
270
2.9
-
3.20*108
9.80*107
122
58
-
565
455
0.10
360
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.4
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min -
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 30
TMA(Etched) min 50
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.35
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.016
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H1170Q
30
FR-4.0 High Performance, Automotive-used Materials
◆耐CAF性能 CAF resistance performance
◆优异的耐热性 Excellent thermal reliability
◆优良的通孔可靠性 Excellent through-hole reliability
◆优良的机械加工性能 Excellent mechanical process
ability
产品特性 FEATURES
◆汽车电子专用材料 Specified for automotive
electronics
◆适用于高多层PCB Also suitable for high-mu-
ltilayer PCBs
产品应用 APPLICATIONS
产品性能GENERAL PROPERTIES
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
180
184
210
33
194
1.8
-
4.70*1010
3.54*108
130
60
-
550
450
0.10
385
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.2
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min 60
2.4.24.1
TMA(Etched) min 60
TMA(Clad) min 30
TMA(Etched) min 60
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.25
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.010
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H140A
31
FR-4.0 Conventional FR-4
◆DICY固化 DICY cured
◆UV阻挡/AOI兼容 UV Blocking/AOI Compatible
◆不建议用于2 OZ内层铜,HDI和6层及以上的多层板
Not recommended for Inner copper above 2oz,
HDI and high multi-layer boards above 6 layers
产品特性 FEATURES
产品性能GENERAL PROPERTIES
◆电脑、仪器仪表、录像机 Computer, Instrumenta-
tion, VCR
◆消费类电子产品 Consumption electronics
◆游戏机 Game machine
产品应用 APPLICATIONS
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
134
-
-
60
300
4.3
-
5.07*109
5.16*107
131
58
-
580
485
0.15
310
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.8
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min -
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 10
TMA(Etched) min 15
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >120
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.9
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.015
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H140A M
32
FR-4.0 Conventional FR-4
◆UV阻挡/AOI兼容 UV Blocking/AOI Compatible
◆优良的机械加工性能 Excellent mechanical
process ability
产品特性 FEATURES
◆电脑、仪器仪表、摄像机 Computer, Instrumentat-
ion, VCR
◆电子产品、游戏机 Electronics, Game machine
产品应用 APPLICATIONS
产品性能GENERAL PROPERTIES
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
134
-
-
55
290
3.8
-
5.07*109
5.16*107
131
58
-
580
485
0.11
325
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.4
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min -
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 15
TMA(Etched) min 20
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >120
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.6
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.014
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H1600HF
33
FR4.1 Halogen Free,CTI600
◆耐漏电起痕指数≥600V CTI600
◆卓越的PCB加工性 Excellent PCB process ability
◆UV阻挡 UV Blocking
◆不建议阻焊返工 Not recommended for solder mask rework
产品特性 FEATURES
◆显示器、电源基板、冰箱、洗衣机等
Display, power base, refrigerator, washing
machine, etc
◆不适合有CAF要求的产品 Not suitable for ap-
plications with CAF requirements
产品应用 APPLICATIONS
产品性能GENERAL PROPERTIES
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
136
-
-
-
-
3.9
-
5.10*108
5.26*107
120
57
-
570
470
0.16
342
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.6
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min -
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 2
TMA(Etched) min -
IEC-60112 C-96/20/65 Rating PLC 0
288°C, solder dip sec >120
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.5
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.016
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H1600A
34
FR-4.0 Normal FR4, CTI600
◆耐漏电起痕指数≥600V CTI600
◆卓越的PCB加工性 Excellent PCB process ability
◆UV阻挡 UV Blocking
◆不建议阻焊返工 Not recommended for solder mask rework
产品特性 FEATURES 产品应用 APPLICATIONS
产品性能GENERAL PROPERTIES
◆显示器、电源基板、冰箱、洗衣机等
Display, power base, refrigerator, washing
machine, etc
◆不适合有CAF要求的产品 Not suitable for ap-
plications with CAF requirements
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
136
-
-
-
-
3.9
-
5.10*108
5.26*107
120
57
-
570
470
0.16
342
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.6
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min -
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 2
TMA(Etched) min -
IEC-60112 C-96/20/65 Rating PLC 0
288°C, solder dip sec >120
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.6
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.016
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H2600
35
CEM-3 Halogen-Free,CTI600
◆优异的可加工性能 Excellent processing performance
◆不含卤素、锑、红磷 Halogen, antimony and
red phosphorus free
◆耐漏电起痕指数≥600V High CTI600
◆不建议阻焊返工 Not recommended for solder mask rework
产品特性 FEATURES 产品应用 APPLICATIONS
产品性能GENERAL PROPERTIES
◆显示器、电源基板、冰箱、洗衣机等
Display, power base, refrigerator, w-
ashing machine, etc
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
126
-
-
-
-
-
-
2.31*10 8
2.37*106
120
55
-
380
310
0.17
335
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.7
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min -
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 5
TMA(Etched) min -
IEC-60112 C-96/20/65 Rating PLC 0
288°C, solder dip sec >60
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.5
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.016
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H2600A
36
CEM-3 CTI600
◆耐漏电起痕指数≥600V High CTI600
◆优异的可加工性能 Excellent processing performance
◆电性能与FR-4.0相当 Electrical properties similar to FR-4
◆不建议阻焊返工 Not recommended for solder mask rework
产品特性 FEATURES 产品应用 APPLICATIONS
产品性能GENERAL PROPERTIES
◆显示器、电源基板、冰箱、洗衣机等
Display, power base, refrigerator,
washing machine, etc
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
127.2
-
-
62
350
4.4
-
2.62*108
2.21*106
120
55
-
385
290
0.16
310
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.8
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min 10
2.4.24.1
TMA(Etched) min -
TMA(Clad) min -
TMA(Etched) min -
IEC-60112 C-96/20/65 Rating PLC 0
288°C, solder dip sec >60
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.6
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.017
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H2135
CEM-3
◆优异的可加工性能 Excellent processing performance
◆电性能与FR-4相当 Electrical properties similar to FR-4
◆不建议阻焊返工 Not recommended for solder mask
rework
产品特性 FEATURES
◆家用电器 Household appliances
产品应用 APPLICATIONS
37
产品性能GENERAL PROPERTIES
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
128
-
-
60
350
4.5
-
2.67*108
2.67*106
120
55
-
380
280
0.12
330
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.7
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min 5
2.4.24.1
TMA(Etched) min -
TMA(Clad) min -
TMA(Etched) min -
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >60
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.6
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.016
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H151HF
FR-4.1 Mid-Tg Halogen-free
◆耐CAF能力 CAF resistance performance
◆良好的尺寸稳定性 Good dimensional stability
◆兼容无铅制程 Lead-free compatible
产品特性 FEATURES
产品性能GENERAL PROPERTIES
◆智能手机,平板,笔记本电脑 Smartphone,
Tablet,Notebook
◆存储模组 SSD,Module
◆可穿戴设备 Wearable smart devices
产品应用 APPLICATIONS
38
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
153
-
-
45
225
2.7
-
5.10*109
5.21*108
150
57
-
606
485
0.10
360
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.1
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min 60
2.4.24.1
TMA(Etched) min 60
TMA(Clad) min 60
TMA(Etched) min 60
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm -
1.19
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.014
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H155HF
39
FR-4.1 Halogen-free,Upper-Mid-Tg, Mid-Loss
◆耐CAF能力 CAF resistance performance
◆兼容无铅制程 Lead-free compatible
◆不含卤素、锑、红磷等成分 Halogen, antimony and
red phosphorous free
◆损耗低于普通中Tg 无卤素材料 lower loss than normal Mid-Tg HF material
产品特性 FEATURES
◆笔记本电脑,平板电脑 Notebook,Tablet
◆存储,模组 SSD,Module
◆可穿戴设备 Wearable smart devices
产品应用 APPLICATIONS
产品性能GENERAL PROPERTIES
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
168
-
-
27
235
2.6
-
5.70*109
5.54*107
130
60
-
580
475
0.11
386
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.27
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min -
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 30
TMA(Etched) min 60
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ -
N/mm 1.10
1.25
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.010
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H170GR
FR-4.1 High Tg, Halogen Free & Low Dk/Df Material
◆兼容无铅制程 Lead-free compatible
◆高Tg无卤 High-Tg Halogen-free
◆UV阻挡/AOI兼容 UV-Blocking/AOI compatible
◆良好的尺寸稳定性 Good dimensional stability
产品特性 FEATURES
◆智能手机,平板,笔记本电脑Smartphone,
Tablet,Notebook
◆存储,模组 SSD,Module
◆可穿戴设备 Wearable smart devices
◆AI PC AI笔记本电脑
产品应用 APPLICATIONS
40
产品性能GENERAL PROPERTIES
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
175
168
-
37
223
2.2
-
4.50*1010
3.10*109
130
60
-
550
480
0.12
386
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 3.32
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min >60
2.4.24.1
TMA(Etched) min >60
TMA(Clad) min >60
TMA(Etched) min >60
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ 12.5
N/mm 1.05
-
2.4.8 0.5 oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC70%)
介质损耗
Df-Loss Tangent (RC70%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (XY-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.009
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H170HF
41
FR-4.1 Halogen-free, Upper-Mid-Tg,Lower Df
◆较强的刚性和耐热性 Excellent Rigidity and thermal
resistance
◆较低的吸水率、优秀的耐CAF性能 Low water absorption
Excellent CAF resistance
◆不含卤素、锑、红磷等成分 Halogen Free,Antimony and red phosphorus free
产品特性 FEATURES
◆笔记本电脑,平板电脑 Notebook,Tablet
◆内存模组、固态存储 Module,SSD
◆可穿戴智能设备 Wearable smart devices
产品应用 APPLICATIONS
产品性能GENERAL PROPERTIES
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
165
158
-
27
235
2.6
-
5.70*109
5.54*107
130
60
-
580
475
0.11
386
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.41
SPDR method 10GHz C-24/23/50 -
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min -
2.4.24.1
TMA(Etched) min -
TMA(Clad) min 30
TMA(Etched) min 60
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ 13
N/mm -
1.3
2.4.8 1oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T260
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (X/Y-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 -
2.5.5.9 1GHz C-24/23/50 / 0.011
SPDR method 10GHz C-24/23/50 -
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
H185HF
42
FR-4.1 Halogen Free, Low Loss & High Reliability Material
产品特性 FEATURES
产品性能GENERAL PROPERTIES
产品应用 APPLICATIONS
◆优异的耐热性 Excellent thermal reliability
◆优秀的耐CAF性能 Excellent CAF resistance
performance
◆较低的Dk/Df Lower Dk/Df
◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性
Lower Z-axis CTE, offering superior PTH reliability
◆服务器、交换机、基站 Server, Switch, Base
station
◆背板、线卡 Backplane, Line cards
◆商用路由器 Office Routers
℃
℃
℃
ppm/℃
ppm/℃
%
MΩ·cm
MΩ
sec
KV
N/mm2
%
℃
180
175
210
35
200
2.2
/
4.13*109
2.52*108
135
65
/
630
520
0.12
385
DSC
TMA
DMA
<Tg,TMA
>Tg,TMA
50~260℃,TMA
1MHz C-24/23/50
C-96/35/90
D48/50+D0.5/23
D48/50+D0.5/23
As received
E-1/105+D-24/23
TGA(5%W.L)
2.4.25
2.4.24
2.4.24.4
2.4.13.1
2.4.24
2.5.5.9
2.5.5.9 1GHz C-24/23/50 / 4.08
SPDR method 10GHz C-24/23/50 3.90
2.5.17.1
2.5.1
2.5.6
2.4.4
2.6.2.1
2.4.24.6
TMA(Clad) min >30
2.4.24.1
TMA(Etched) min >60
IEC-60112 C-96/20/65 Rating PLC 3
288°C, solder dip sec >180
2.4.24.5 <Tg,TMA ppm/℃ 12
N/mm 0.70
1.00
2.4.8 1 oz As received
检测方法
IPC-TM-650
测试条件
Test Condition
单位
Unit
典型值
Typical value
耐热性-T288
热应力-Thermal Stress
热膨胀系数-CTE (Z-axis)
介电常数
Dk-Permittivity(RC50%)
介质损耗
Df-Loss Tangent (RC50%)
体积电阻-Volume Resistivity
表面电阻-Surface Resistivity
耐电弧性-Arc Resistance
击穿电压-Dielectric Breakdown
相对漏电起痕指数-CTI
吸水率-Water Absorption
耐燃性-Flammability UL-94 A&E-24/125 / V0
热分解温度-TD
(Decomposition Temperature)
弯曲强度Flexural Strength
Warp
Fill
玻璃态转化温度-TG
热膨胀系数-CTE (XY-axis)
项目
Item
剥离强度(HTE)-Peel Strength
剥离强度(RTF)-Peel Strength
剥离强度(HVLP)-Peel Strength
2.5.5.9 1MHz C-24/23/50 /
2.5.5.9 1GHz C-24/23/50 / 0.0051
SPDR method 10GHz C-24/23/50 0.007
热性能
Thermal
电性能
Electrical
物理性能
Physical
属性
Property
HA80 T1
◆良好的导热性能 Excellent Thermal Conductivity
◆高耐热性 Excellent Solder Heat Endurance
◆高可靠性 Excellent Reliability
◆备注:如果需要非标产品,请联系我们。
Note: If non-standard specifications are required, please contact us.
产品特性 FEATURES
产品性能GENERAL PROPERTIES
产品规格PRODUCT SPECIFICATIONS
◆室内外照明 Indoor/Outdoor Lighting
◆电视背光/Mini LED TV Lightbar/Mini LED
产品应用 APPLICATIONS
项目Item
典型值/Typical Value
HA80 T1
100μm 110μm 150μm
43
ASTM D 5470
1.0
110
140
400
0.24
5.4
10⁷
10⁸
120
1.35
22
50
600
V-0
300
1.000 1.100 1.500
0.155 0.171 0.233
6.0 6.5 7.0
W/m·K
K·cm²/W
℃/W
℃
℃
℃
%
kVAC
—
MΩ
MΩ·cm
s
N/mm
ppm/℃
ppm/℃
V
—
s
ASTM D 5470
DSC
UL796
TGA
IPC-TM-650 2.6.2.1
IPC-TM-650 2.5.6
IPC-TM-650 2.5.5.2
IPC-TM-650 2.5.17.1
IPC-TM-650 2.5.17.1
IPC-TM-650 2.5.1
IPC-TM-650 2.4.8
<Tg
>Tg
IEC60112
UL94
288℃, Solder Dip
导热系数-Thermal Conductivity
玻璃态转化温度-Tg
最高操作温度-MOT
热分解温度-Td
吸水率-Water Absorption
击穿电压-Breakdown Voltage
介电常数-Dielectric Constant
表面电阻率-Surface Resistivity
体积电阻率-Volume Resistivity
耐电弧性-Arc Resistance
剥离强度-Peel Strength (1oz)
相对漏电起痕指数-CTI
耐燃性-Flammability
热应力-Thermal Stress
热阻-Thermal Resistance
热膨胀系数-CTE
标准尺寸(mm)-Standard Size (mm) 460*610/500*600/510*610/520*620
920*1220/1000*1200/1020*1220/1040*1240
铜箔厚度(oz)-Copper Foil (oz) H/1/2/3/4/5/6/9/15
绝缘层厚度(μm)-Dielectric Thickness (μm) 100±15/110±15/150±20
5052铝板厚度(mm)-Al 5052 Thickness (mm) 0.8/1.0/1.2/1.4/1.5/1.6/1.8/2.0/2.5/3.0
1060铝板厚度(mm)-Al 1060 Thickness (mm) 0.5/0.8/1.0/1.2/1.5/2.0
金属板公差-Thickness Tolerance of Metal Base ±0.05 mm (≤2.0 mm)/±0.10 mm (>2.0 mm)
PE:<80℃
Standard Size (mm) PET:<180℃
Polyimide:<260℃
项目
Item
检测方法
Test method
单位
Unit
保护膜-Protective Film
HA80 T2
◆良好的导热性能 Excellent Thermal Conductivity
◆高耐热性 Excellent Solder Heat Endurance
◆高可靠性 Excellent Reliability
◆备注:如果需要非标产品,请联系我们。
Note: If non-standard specifications are required, please contact us.
产品特性 FEATURES
产品性能GENERAL PROPERTIES
产品规格PRODUCT SPECIFICATIONS
◆室内外照明 Indoor/Outdoor Lighting
◆电视背光/Mini LED TV Lightbar/Mini LED
产品应用 APPLICATIONS
项目Item
典型值/Typical Value
HA80 T2
100μm 120μm 150μm
44
ASTM D 5470
2.0
112
140
400
0.22
6.0
10⁷
10⁸
120
1.35
20
47
600
V-0
300
0.500 0.600 0.750
0.078 0.093 0.116
6.0 6.5 7.0
W/m·K
K·cm²/W
℃/W
℃
℃
℃
%
kVAC
—
MΩ
MΩ·cm
s
N/mm
ppm/℃
ppm/℃
V
—
s
ASTM D 5470
DSC
UL796
TGA
IPC-TM-650 2.6.2.1
IPC-TM-650 2.5.6
IPC-TM-650 2.5.5.2
IPC-TM-650 2.5.17.1
IPC-TM-650 2.5.17.1
IPC-TM-650 2.5.1
IPC-TM-650 2.4.8
<Tg
>Tg
IEC60112
UL94
288℃, Solder Dip
导热系数-Thermal Conductivity
玻璃态转化温度-Tg
最高操作温度-MOT
热分解温度-Td
吸水率-Water Absorption
击穿电压-Breakdown Voltage
介电常数-Dielectric Constant
表面电阻率-Surface Resistivity
体积电阻率-Volume Resistivity
耐电弧性-Arc Resistance
剥离强度-Peel Strength (1oz)
相对漏电起痕指数-CTI
耐燃性-Flammability
热应力-Thermal Stress
热阻-Thermal Resistance
热膨胀系数-CTE
标准尺寸(mm)-Standard Size (mm) 460*610/500*600/510*610/520*620
920*1220/1000*1200/1020*1220/1040*1240
铜箔厚度(oz)-Copper Foil (oz) H/1/2/3/4/5/6/9/15
绝缘层厚度(μm)-Dielectric Thickness (μm) 100±15/120±15/150±20
5052铝板厚度(mm)-Al 5052 Thickness (mm) 0.8/1.0/1.2/1.4/1.5/1.6/1.8/2.0/2.5/3.0
1060铝板厚度(mm)-Al 1060 Thickness (mm) 0.5/0.8/1.0/1.2/1.5/2.0
金属板公差-Thickness Tolerance of Metal Base ±0.05 mm (≤2.0 mm)/±0.10 mm (>2.0 mm)
PE:<80℃
Standard Size (mm) PET:<180℃
Polyimide:<260℃
项目
Item
检测方法
Test method
单位
Unit
保护膜-Protective Film
HA88 E2
◆低模量,耐焊裂,高可靠性 Low Storage Modulus,
Welding Crack Resistant ,Excellent Reliability
◆优异的电气性能 Excellent Electrical Performance
产品特性 FEATURES
产品性能GENERAL PROPERTIES
◆汽车前照灯 Automotive Headlamp
◆可弯折应用 Bendable Substrate Application
产品应用 APPLICATIONS
典型值
Typical Value
45
100
2.0
0.500
0.078
85
150
405
0.22
5.0
6.0
10⁸
10⁸
120
3.0
0.03
1.6
26
70
600
V-0
300
绝缘层厚度-Dielectric Thickness
导热系数-Thermal Conductivity
玻璃态转化温度-Tg
最高操作温度-MOT
热分解温度-Td
吸水率-Water Absorption
击穿电压-Breakdown Voltage
介电常数-Dielectric Constant (1MHz)
表面电阻率-Surface Resistivity
体积电阻率-Volume Resistivity
耐电弧性-Arc Resistance
剥离强度-Peel Strength (1oz)
相对漏电起痕指数-CTI
耐燃性-Flammability
热应力-Thermal Stress
Microscope
ASTM D 5470
DMA
UL796
TGA
IPC-TM-650 2.6.2.1
IPC-TM-650 2.5.6
IPC-TM-650 2.5.5.2
IPC-TM-650 2.5.17.1
IPC-TM-650 2.5.17.1
IPC-TM-650 2.5.1
IPC-TM-650 2.4.8
<Tg
>Tg
IEC60112
UL94
288℃, Solder Dip
μm
W/m·K
K·cm²/W
℃/W
℃
℃
℃
%
kVAC
—
MΩ
MΩ·cm
s
GPa
GPa
N/mm
ppm/℃
ppm/℃
V
—
s
储能模量
Storage Modulus
25℃
125℃
ASTM D 5470
IPC TM650 2.4.24.4
热阻-Thermal Resistance
热膨胀系数-CTE
项目
Item
检测方法
Test method
单位
Unit
◆备注:如果需要非标产品,请联系我们。
Note: If non-standard specifications are required, please contact us.
产品规格PRODUCT SPECIFICATIONS
项目Item HA88 E2
标准尺寸(mm)-Standard Size (mm) 460*610/500*600/510*610/520*620
920*1220/1000*1200/1020*1220/1040*1240
铜箔厚度(oz)-Copper Foil (oz) H/1/2/3/4/5/6/9/15
绝缘层厚度(μm)-Dielectric Thickness (μm) 100±15
5052铝板厚度(mm)-Al 5052 Thickness (mm) 0.8/1.0/1.2/1.4/1.5/1.6/1.8/2.0/2.5/3.0
1060铝板厚度(mm)-Al 1060 Thickness (mm) 0.5/0.8/1.0/1.2/1.5/2.0
金属板公差-Thickness Tolerance of Metal Base ±0.05 mm (≤2.0 mm)/±0.10 mm (>2.0 mm)
4045铝板厚度(mm)-Al 4045 Thickness (mm) 1.0/1.5
PE:<80℃
Standard Size (mm) PET:<180℃
Polyimide:<260℃
保护膜-Protective Film
HA88/HC88 T2
◆良好的导热性能 Excellent Thermal Conductivity
◆高耐热性 Excellent Solder Heat Endurance
◆高可靠性 Excellent Reliability
◆优异的电气性能 Excellent Electrical Performance
产品特性 FEATURES
产品性能GENERAL PROPERTIES
◆汽车前照灯 Automotive Headlamp
◆车载抬头显/汽车尾灯 Automotive HUD/Tail light
◆电源控制 Power Control
◆算力硬件 Computing Hardware
产品应用 APPLICATIONS
典型值/Typical Value
46
2.2
50μm 75μm 100μm 125μm 150μm 175μm 200μm
0.227 0.341 0.455 0.568 0.682 0.795 0.909
0.035 0.053 0.070 0.088 0.106 0.123 0.141
3.5 4.0 4.5 5.0 5.5 6.0 6.5
150
150
400
0.22
6.2
107
10⁸
120
1.58
25
55
600
V-0
300
导热系数-Thermal Conductivity
玻璃态转化温度-Tg
最高操作温度-MOT
热分解温度-Td
吸水率-Water Absorption
击穿电压-Breakdown Voltage
介电常数-Dielectric Constant (1MHz)
表面电阻率-Surface Resistivity
体积电阻率-Volume Resistivity
耐电弧性-Arc Resistance
剥离强度-Peel Strength (1oz)
相对漏电起痕指数-CTI
耐燃性-Flammability
热应力-Thermal Stress
ASTM D 5470
DSC
UL796
TGA
IPC-TM-650 2.6.2.1
IPC-TM-650 2.5.6
IPC-TM-650 2.5.5.2
IPC-TM-650 2.5.17.1
IPC-TM-650 2.5.17.1
IPC-TM-650 2.5.1
IPC-TM-650 2.4.8
<Tg
>Tg
IEC60112
UL94
288℃, Solder Dip
W/m·K
K·cm²/W
℃/W
℃
℃
℃
%
kVAC
—
MΩ
MΩ·cm
s
N/mm
ppm/℃
ppm/℃
V
—
s
热阻-Thermal Resistance ASTM D 5470
热膨胀系数-CTE
项目
Item
检测方法
Test method
单位
Unit
◆备注:如果需要非标产品,请联系我们。
Note: If non-standard specifications are required, please contact us.
产品规格PRODUCT SPECIFICATIONS
项目Item HA88/HC88 T2
标准尺寸(mm)-Standard Size (mm) 460*610/500*600/510*610/520*620
920*1220/1000*1200/1020*1220/1040*1240
铜箔厚度(oz)-Copper Foil (oz) H/1/2/3/4/5/6/9/15
绝缘层厚度(μm)-Dielectric Thickness (μm) 50±10/75±10/100±15/125±15/150±20/175±25/200±30
5052铝板厚度(mm)-Al 5052 Thickness (mm) 0.8/1.0/1.2/1.4/1.5/1.6/1.8/2.0/2.5/3.0
1060铝板厚度(mm)-Al 1060 Thickness (mm) 0.5/0.8/1.0/1.2/1.5/2.0
金属板公差-Thickness Tolerance of Metal Base ±0.05 mm (≤2.0 mm)/±0.10 mm (>2.0 mm)
4045铝板厚度(mm)-Al 4045 Thickness (mm) 1.0/1.5
6061铝板厚度(mm)-Al 6061 Thickness (mm) 1.6
C1100铜板厚度(mm)-Cu C1100 Thickness (mm) 0.8/1.0/1.5/1.8/2.0/3.0
PE:<80℃
Standard Size (mm) PET:<180℃
Polyimide:<260℃
保护膜-Protective Film
HA88/HC88 T3
◆良好的导热性能 Excellent Thermal Conductivity
◆高耐热性 Excellent Solder Heat Endurance
◆高可靠性 Excellent Reliability
◆优异的电气性能 Excellent Electrical Performance
产品特性 FEATURES
产品性能GENERAL PROPERTIES
◆汽车前照灯 Automotive Headlamp
◆车载抬头显/汽车尾灯 Automotive HUD/Tail light
◆电源控制 Power Control
◆算力硬件 Computing Hardware
产品应用 APPLICATIONS
典型值/Typical Value
47
3.0
50μm 75μm 100μm 125μm 150μm 175μm 200μm
0.167 0.250 0.333 0.417 0.500 0.583 0.667
0.026 0.039 0.052 0.065 0.078 0.090 0.103
3.5 4.0 4.5 5.0 5.5 6.0 6.5
150
150
410
0.21
6.4
107
10⁸
120
1.34
23
53
600
V-0
300
导热系数-Thermal Conductivity
玻璃态转化温度-Tg
最高操作温度-MOT
热分解温度-Td
吸水率-Water Absorption
击穿电压-Breakdown Voltage
介电常数-Dielectric Constant (1MHz)
表面电阻率-Surface Resistivity
体积电阻率-Volume Resistivity
耐电弧性-Arc Resistance
剥离强度-Peel Strength (1oz)
相对漏电起痕指数-CTI
耐燃性-Flammability
热应力-Thermal Stress
ASTM D 5470
DSC
UL796
TGA
IPC-TM-650 2.6.2.1
IPC-TM-650 2.5.6
IPC-TM-650 2.5.5.2
IPC-TM-650 2.5.17.1
IPC-TM-650 2.5.17.1
IPC-TM-650 2.5.1
IPC-TM-650 2.4.8
<Tg
>Tg
IEC60112
UL94
288℃, Solder Dip
W/m·K
K·cm²/W
℃/W
℃
℃
℃
%
kVAC
—
MΩ
MΩ·cm
s
N/mm
ppm/℃
ppm/℃
V
—
s
热阻-Thermal Resistance ASTM D 5470
热膨胀系数-CTE
项目
Item
检测方法
Test method
单位
Unit
◆备注:如果需要非标产品,请联系我们。
Note: If non-standard specifications are required, please contact us.
产品规格PRODUCT SPECIFICATIONS
项目Item HA88/HC88 T3
标准尺寸(mm)-Standard Size (mm) 460*610/500*600/510*610/520*620
920*1220/1000*1200/1020*1220/1040*1240
铜箔厚度(oz)-Copper Foil (oz) H/1/2/3/4/5/6/9/15
绝缘层厚度(μm)-Dielectric Thickness (μm) 50±10/75±10/100±15/125±15/150±20/175±25/200±30
5052铝板厚度(mm)-Al 5052 Thickness (mm) 0.8/1.0/1.2/1.4/1.5/1.6/1.8/2.0/2.5/3.0
1060铝板厚度(mm)-Al 1060 Thickness (mm) 0.5/0.8/1.0/1.2/1.5/2.0
金属板公差-Thickness Tolerance of Metal Base ±0.05 mm (≤2.0 mm)/±0.10 mm (>2.0 mm)
4045铝板厚度(mm)-Al 4045 Thickness (mm) 1.0/1.5
6061铝板厚度(mm)-Al 6061 Thickness (mm) 1.6
C1100铜板厚度(mm)-Cu C1100 Thickness (mm) 0.8/1.0/1.5/1.8/2.0/3.0
PE:<80℃
Standard Size (mm) PET:<180℃
Polyimide:<260℃
保护膜-Protective Film
HA88/HC88 T3S
◆良好的导热性能 Excellent Thermal Conductivity
◆高耐热性 Excellent Solder Heat Endurance
◆高可靠性 Excellent Reliability
◆优异的电气性能 Excellent Electrical Performance
产品特性 FEATURES
产品性能GENERAL PROPERTIES
◆汽车前照灯 Automotive Headlamp
◆车载抬头显/汽车尾灯 Automotive HUD/Tail light
◆功率控制 Power Control
◆算力硬件 Computing Hardware
产品应用 APPLICATIONS
典型值/Typical Value
48
3.2
45μm 50μm 75μm 100μm 125μm 150μm
0.141 0.156 0.234 0.313 0.391 0.469
0.022 0.024 0.036 0.048 0.061 0.073
3.0 3.5 4.0 4.5 5.0 5.5
180
150
410
0.2
6.7
107
10⁸
120
1.20
15
45
600
V-0
300
导热系数-Thermal Conductivity
玻璃态转化温度-Tg
最高操作温度-MOT
热分解温度-Td
吸水率-Water Absorption
击穿电压-Breakdown Voltage
介电常数-Dielectric Constant (1MHz)
表面电阻率-Surface Resistivity
体积电阻率-Volume Resistivity
耐电弧性-Arc Resistance
剥离强度-Peel Strength (1oz)
相对漏电起痕指数-CTI
耐燃性-Flammability
热应力-Thermal Stress
ASTM D 5470
TMA
UL796
TGA
IPC-TM-650 2.6.2.1
IPC-TM-650 2.5.6
IPC-TM-650 2.5.5.2
IPC-TM-650 2.5.17.1
IPC-TM-650 2.5.17.1
IPC-TM-650 2.5.1
IPC-TM-650 2.4.8
<Tg
>Tg
IEC60112
UL94
288℃, Solder Dip
W/m·K
K·cm²/W
℃/W
℃
℃
℃
%
kVAC
—
MΩ
MΩ·cm
s
N/mm
ppm/℃
ppm/℃
V
—
s
热阻-Thermal Resistance ASTM D 5470
热膨胀系数-CTE
项目
Item
检测方法
Test method
单位
Unit
◆备注:如果需要非标产品,请联系我们。
Note: If non-standard specifications are required, please contact us.
产品规格PRODUCT SPECIFICATIONS
项目Item HA88/HC88 T3S
标准尺寸(mm)-Standard Size (mm) 460*610/500*600/510*610/520*620
920*1220/1000*1200/1020*1220/1040*1240
铜箔厚度(oz)-Copper Foil (oz) H/1/2/3/4/5/6/9/15
绝缘层厚度(μm)-Dielectric Thickness (μm) 45±8/50±10/75±10/100±15/125±15/150±20
5052铝板厚度(mm)-Al 5052 Thickness (mm) 0.8/1.0/1.2/1.4/1.5/1.6/1.8/2.0/2.5/3.0
1060铝板厚度(mm)-Al 1060 Thickness (mm) 0.5/0.8/1.0/1.2/1.5/2.0
金属板公差-Thickness Tolerance of Metal Base ±0.05 mm (≤2.0 mm)/±0.10 mm (>2.0 mm)
4045铝板厚度(mm)-Al 4045 Thickness (mm) 1.0/1.5
6061铝板厚度(mm)-Al 6061 Thickness (mm) 1.6
C1100铜板厚度(mm)-Cu C1100 Thickness (mm) 0.8/1.0/1.5/1.8/2.0/3.0
PE:<80℃
Standard Size (mm) PET:<180℃
Polyimide:<260℃
保护膜-Protective Film
HA88/HC88 T6
◆良好的导热性能 Excellent Thermal Conductivity
◆高耐热性 Excellent Solder Heat Endurance
◆高可靠性 Excellent Reliability
◆优异的电气性能 Excellent Electrical Performance
产品特性 FEATURES
产品性能GENERAL PROPERTIES
◆车载充电机 EV On Board Charger
◆电源控制 Power Control
◆功率模块 Power Module
产品应用 APPLICATIONS
典型值/Typical Value
49
5.7
130μm 150μm 195μm
0.228 0.263 0.342
0.035 0.041 0.053
6.0 6.5 7.5
195
150
410
0.15
7.0
107
10⁸
120
1.2
13
47
600
V-0
300
导热系数-Thermal Conductivity
玻璃态转化温度-Tg
最高操作温度-MOT
热分解温度-Td
吸水率-Water Absorption
击穿电压-Breakdown Voltage
介电常数-Dielectric Constant (1MHz)
表面电阻率-Surface Resistivity
体积电阻率-Volume Resistivity
耐电弧性-Arc Resistance
剥离强度-Peel Strength (1oz)
相对漏电起痕指数-CTI
耐燃性-Flammability
热应力-Thermal Stress
ASTM D 5470
TMA
UL796
TGA
IPC-TM-650 2.6.2.1
IPC-TM-650 2.5.6
IPC-TM-650 2.5.5.2
IPC-TM-650 2.5.17.1
IPC-TM-650 2.5.17.1
IPC-TM-650 2.5.1
IPC-TM-650 2.4.8
<Tg
>Tg
IEC60112
UL94
288℃, Solder Dip
W/m·K
K·cm²/W
℃/W
℃
℃
℃
%
kVAC
—
MΩ
MΩ·cm
s
N/mm
ppm/℃
ppm/℃
V
—
s
热阻-Thermal Resistance ASTM D 5470
热膨胀系数-CTE
项目
Item
检测方法
Test method
单位
Unit
◆备注:如果需要非标产品,请联系我们。
Note: If non-standard specifications are required, please contact us.
产品规格PRODUCT SPECIFICATIONS
项目Item HA88/HC88 T6
标准尺寸(mm)-Standard Size (mm) 480*580/500*600
铜箔厚度(oz)-Copper Foil (oz) H/1/2/3/4/5/6/9/15
绝缘层厚度(μm)-Dielectric Thickness (μm) 130±15/150±20/195±30
5052铝板厚度(mm)-Al 5052 Thickness (mm) 0.8/1.0/1.2/1.4/1.5/1.6/1.8/2.0/2.5/3.0
1060铝板厚度(mm)-Al 1060 Thickness (mm) 0.5/0.8/1.0/1.2/1.5/2.0
金属板公差-Thickness Tolerance of Metal Base ±0.05 mm (≤2.0 mm)/±0.10 mm (>2.0 mm)
4045铝板厚度(mm)-Al 4045 Thickness (mm) 1.0/1.5
6061铝板厚度(mm)-Al 6061 Thickness (mm) 1.6
C1100铜板厚度(mm)-Cu C1100 Thickness (mm) 0.8/1.0/1.5/1.8/2.0/3.0
PE:<80℃
Standard Size (mm) PET:<180℃
Polyimide:<260℃
保护膜-Protective Film




