2026华正手机端画册双语版 - 电子画册在线预览、各类电子画册在线制作-云展网平台

HW20-M2

High Tg, Low X, Y/Z Coefficient of Thermal Expansion White Material

◆优异的耐CAF性能 Excellent CAF resistance

◆低X、Y/Z轴热膨胀系数高Tg(210℃,DMA）Low X,Y/Z

axis thermal expansion coefficient High Tg(210℃,DMA)

◆白色类BT树脂物材料 White BT resin material

产品特性 FEATURES

◆集成电路组件 Integrated circuit components

◆芯片LED基板 Chip LED substrate

◆Mini LED Mini LED

产品应用 APPLICATIONS

◆Specimen thickness: 0.8mmSpecification sheet:

试样厚度：0.8mm

IPC-4101E/126 is for your reference only

规格表：IPC-4101E/126仅供参考

产品性能GENERAL PROPERTIES

V-0

0.03

210

390

＞60

10S/6 Cycles pass

180

2.2

13-15

5-10

0.7

＜0.3

45KV/mm

5.8

0.02

≥1.05N/mm(1oz)

≥1.05N/mm(1 oz)

℃

min

PPM/℃

W/(m·k）

UL-94

DMA

5% Weight Loss

TMA

288℃, Solder dip

Before Tg

After Tg

50-260℃

Before Tg

After Tg

ASTM D5470

D-24/23

D-48/50+D-0.5/23

@1GHz

288℃/10S

耐燃性-Flammability

绝缘层最小厚度/Minimum thickness

玻璃态转化温度-TG

热分解温度-TD

耐热性-T260

耐热性-T288

热应力-Thermal Stress

导热系数Thermal conductivity

吸水率-Water Absorption

击穿电压-Dielectric Breakdown

介电常数-Permittivity

损耗因子-Loss Tangent

弯曲强度-Flexural Strength

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

E-24/125

Mpa

MΩ-cm

MΩ

Gpa

480/480

≥103

热膨胀系数-CTE (Z-axis)

热膨胀系数-CTEX/Y-axis CTE

剥离强度-Peel Strength

弹性模数Modulus of elasticity 23

N/mm

项目

Item

检测方法

IPC-TM-650

单位

Unit

典型值

Typical value

High Tg, Low X,Y/Z-axis CTE Black Colored BT Laminate for

Chip LED Substrates and IC Package

HB20-M1

◆Lead-free compatible Halogen free material.

◆BT like resin material

◆Lower X,Y/Z-axis CTE

◆High glass transition temperature, High heat resistance (230℃,DMA)

◆Keeping high modulus in high temperature

◆Good punching & Drilling ability

◆Excellent Anti-CAF resistance

◆Excellent in Thickness Uniformity

◆Excellent in index and Color consistency

FEATURES

GENERAL PROPERTIES

◆Mini&Micro LED

◆Mini &Micro display (HDI)

◆Mini RGB PKG

(1010, F1010, etc)

◆IC Package

◆Memory

◆MEMS

◆CSP

APPLICATIONS

Test item Test condition Unit HB20-M1

UL号/UL No. -

DMA

TMA

After Tg

50-260℃

Before Tg

After Tg

D-24/23

288℃/10s

@10GHz

E-24/125

- E136069

℃

min

PPM/℃

N/mm

MΩ

Mpa

Gpa

Flammability UL-94 - V-0

0.03

≥230

＜150

Before Tg PPM/℃ ＜25

<2.0

11-13

5-10

<0.35

≥0.8（TOZ）

4.3

0.010

≥103

480/480

Minimum thickness

Td(5%loss) 10℃/min@N_2 ℃ ＞390

T288

Thermal Stress 288℃ solder dip - 6 cycles pass

Z-axis CTE

X/Y-axis CTE

Moisture Absorption

Dielectric Breakdown D-48/50+D-0.5/23 KV 45KV/mm

Thermal conductivity ASTM D5470 W/(m ·K) 0.5

Peel Strength

Dielectric constant

Dissipation Factor

Surface resistivity

Volume Resistivity E-24/125 MΩ.cm ≥103

Bending strength(LW/CW)

Young's modulus

＞60

High Tg, Low X,Y/Z-axis CTE Black Colored BT Laminate for

Chip LED Substrates and IC Package

HB20-M2

◆Lead-free compatible Halogen free material.

◆BT like resin material

◆Lower X,Y/Z-axis CTE

◆High glass transition temperature, High heat resistance (220℃,DMA)

◆Keeping high modulus in high temperature

◆Good punching & Drilling ability

◆Excellent Anti-CAF resistance

◆Excellent in Thickness Uniformity

◆Excellent in index and Color consistency

FEATURES

GENERAL PROPERTIES

◆Mini&Micro LED

◆Mini &Micro display (HDI)

◆Mini RGB PKG

(1010, F1010, etc)

◆IC Package

◆Memory

◆MEMS

◆CSP

APPLICATIONS

Test item Test condition Unit HB20-M2

UL No. -

DMA

TMA

Before Tg

50-260℃

Before Tg

D-24/23

288℃/10s

@1GHz

E-24/125

- E136069

℃

min

PPM/℃

N/mm

Mpa

Gpa

UL燃烧等级/Flammability UL-94 - V-0

0.03

220

2.0

After Tg PPM/℃ 150

12-14

After Tg PPM/℃ 5-10

＜0.3

≥0.6N/mm（TOZ）

4.5

0.012

≥103

480/480

绝缘层最小厚度

Minimum thickness

Td(5%loss) 10℃/min@N_2 ℃ 390

T288

TMA min

＞60

T260

Thermal Stress 288℃ solder dip - 6 cycles pass

Z-axis CTE

X/Y-axis CTE

吸水率/Moisture Absorption

绝缘强度/Dielectric Breakdown D-48/50+D-0.5/23 KV 45KV/mm

Thermal conductivity ASTM D5470 W/(m ·K) 0.5

剥离强度/Peel Strength

介电常数/Dielectric constant

Dissipation Factor

表面电阻/Surface resistivity

体积电阻率/Volume Resistivity E-24/125 Ω-cm ≥103

Bending strength(LW/CW)

弯曲模量/Bending modulus

High Tg, Halogen Free, Low X,Y/Z-axis CTE

Black Colored BT Laminate for IC Package

HI10L

◆Lead-free compatible Halogen free material.

◆BT like resin material

◆Lower X,Y/Z-axis CTE

◆High glass transition temperature, High heat resistance (260℃,DMA)

◆Keeping high modulus in high temperature

◆Good punching & Drilling ability

◆Excellent Anti-CAF resistance

◆Excellent in Thickness Uniformity

◆Excellent in index and Color consistency

FEATURES

GENERAL PROPERTIES

◆IC Package

◆RF

◆Memory

◆MEMS

◆BTC

◆PMIC

◆Module

◆Mini&Micro LED

◆Mini &Micro display (HDI)

◆Mini RGB PKG

(1010, F1010, etc)

APPLICATIONS

Test item Test condition Unit HI10L

UL号/UL No. -

DMA

TMA

After Tg

50-260℃

Before Tg

After Tg

D-24/23

288℃/10s

@10GHz

E-24/125

- E136069

℃

min

PPM/℃

N/mm

MΩ

Mpa

Gpa

UL燃烧等级/Flammability UL-94 - V-0

0.03

≥260

＜125

Before Tg PPM/℃ ＜25

<1.0

9-11

1-4

<0.35

≥0.8（TOZ）

4.3

0.008

≥106

490/510

绝缘层最小厚度

Minimum thickness

Td(5%loss) 10℃/min@N_2 ℃ ＞400

T288

Thermal Stress 288℃ solder dip - Pass

Z-axis CTE

X/Y-axis CTE

吸水率/Moisture Absorption

绝缘强度/Dielectric Breakdown D-48/50+D-0.5/23 KV 45

Thermal conductivity ASTM D5470 W/(m ·K) 0.5

剥离强度/Peel Strength

介电常数/Dielectric constant

Dissipation Factor

表面电阻/Surface resistivity

体积电阻率/Volume Resistivity E-24/125 MΩ.cm ≥104

抗弯强度/Bending strength (LW/CW)

弯曲模量/Bending modulus

≥60

High Tg, Halogen Free, Low X,Y/Z-axis CTE

BT Laminate for Chip LED Substrates and IC Package

HI07L

◆Lead-free compatible Halogen free material.

◆BT like resin material

◆Lower X,Y/Z-axis CTE

◆High glass transition temperature, High heat resistance (≥300℃,DMA)

◆Keeping high modulus in high temperature

◆Good punching & Drilling ability

◆Excellent Anti-CAF resistance

◆Excellent in Thickness Uniformity

FEATURES

GENERAL PROPERTIES

◆FC BGA

◆CPU & GPU

◆FPGA 、ASIC

◆IC Package

◆RF Switch

◆Low Noise Amplifier(LNA)

◆Power Amplifier(PA)

APPLICATIONS

Test item Test condition Unit HI07L

UL No. -

DMA

TMA

Before Tg

After Tg

50-260℃

Pull

Compression

D-24/23

288℃/10s

@10GHz

E-24/125

℃

min

PPM/℃

N/mm

MΩ

MΩ.cm

Gpa

UL Flammability UL-94 - V-0

0.03

≥300

＞60

＜25

<100

<1.2

7-9

10-12

≤0.4

≥0.8

4.4

0.008

>1X108

>1X107

Minimum thickness

Td(5%loss) 10℃/min@N_2 ℃ ＞400

T288

Thermal Stress 288℃ solder dip - Pass

Z-axis CTE

X/Y-axis CTE

Moisture Absorption

Peel Strength

Dielectric constant

Dissipation Factor

Surface resistivity

Volume Resistivity

Bending modulus

High Tg, Halogen Free, LOW DK GLASS,Low X,Y/Z-axis CTE

BT Laminate for 5G RF and Antenna module

HI10L FK

◆Lead-free compatible Halogen free material.

◆BT based material

◆Lower X,Y/Z-axis CTE

◆High glass transition temperature, High heat resistance (270℃,DMA)

◆Keeping high modulus in high temperature

◆Good punching & Drilling ability

◆Excellent Anti-CAF resistance

◆Excellent in Thickness Uniformity

◆Excellent in Dk and Df

FEATURES

GENERAL PROPERTIES

◆IC Substrate（5G RF）

◆IC Substrate（5G Aip）

◆IC Substrate（CPU/GPU）

◆Optical module

APPLICATIONS

Test item Test condition Unit HI10L FK

UL号/UL No. -

DMA

TMA

Before Tg

After Tg

Before Tg

After Tg

D-24/23

288℃/10s

@1GHz

C-96/20/65

- -

℃

min

PPM/℃

N/mm

Mpa

Gpa

UL燃烧等级/Flammability UL-94 - V-0

0.03

＞260

＜30

100-150

＜11

2-5

＜0.35

≥0.7

3.4

＜0.003

1X106

370

绝缘层最小厚度

Minimum thickness

Td(5%loss) 10℃/min@N_2 ℃ ＞400

T288

TMA min

＞60

T260

Thermal Stress 288℃ solder dip - Pass

Z-axis CTE

X/Y-axis CTE

吸水率/Moisture Absorption

Thermal conductivity ASTM D5470 W/(m ·K) 0.5

剥离强度/Peel Strength

介电常数/Dielectric constant

Dissipation Factor

表面电阻/Surface resistivity

体积电阻率/Volume Resistivity C-96/20/65 Ω-cm 1X106

抗弯强度/Bending strength (LW/CW)

杨氏模量/Young's modulus

High Tg, Halogen Free, Low X,Y/Z-axis CTE

BT Laminate for Chip LED Substrates and IC Package

HI07L T

◆Lead-free compatible Halogen free material.

◆BT like resin material

◆Lower X,Y/Z-axis CTE

◆High glass transition temperature, High heat resistance (≥300℃,DMA)

◆Keeping high modulus in high temperature

◆Good punching & Drilling ability

◆Excellent Anti-CAF resistance

◆Excellent in Thickness Uniformity

FEATURES

GENERAL PROPERTIES

◆FC BGA

◆CPU & GPU

◆FPGA 、ASIC

◆IC Package

◆RF Switch

◆Low Noise Amplifier(LNA)

◆Power Amplifier(PA)

APPLICATIONS

Test item Test condition Unit HI07L T

UL Flammability UL-94

DMA

TMA

Before Tg

After Tg

50-260℃

Pull

Compression

D-24/23

288℃/10s

@10GHz

E-24/125

℃

min

PPM/℃

N/mm

MΩ

MΩ.cm

Gpa

V-0

≥290

≥60

0.6

4-7

7-10

≤0.4

≥0.8

4.3±0.2

<0.01

>1X108

>1X107

Minimum thickness

Td(5%loss) 10℃/min@N_2 ℃ ≥400

T288

Thermal Stress 288℃ solder dip - Pass

Z-axis CTE

X/Y-axis CTE

Moisture Absorption

Peel Strength

Dielectric constant

Dissipation Factor

Surface resistivity

Volume Resistivity

Bending modulus

High Tg, Halogen Free, Low X,Y/Z-axis CTE

Black Colored BT Laminate for IC Package

HI10L K

◆Lead-free compatible Halogen free material.

◆BT like resin material

◆Lower X,Y/Z-axis CTE

◆High glass transition temperature, High heat resistance (260℃,DMA)

◆Keeping high modulus in high temperature

◆Good punching & Drilling ability

◆Excellent Anti-CAF resistance

◆Excellent in Thickness Uniformity

◆Excellent in index and Color consistency

FEATURES

GENERAL PROPERTIES

◆IC Package

◆Memory

◆MEMS

◆CSP

◆Mini&Micro LED

◆Mini &Micro display (HDI)

◆Mini RGB PKG

(1010, F1010, etc)

APPLICATIONS

Test item Test condition Unit HI10L K

UL号/UL No. -

DMA

TMA

After Tg

50-260℃

Before Tg

After Tg

D-24/23

288℃/10s

@10GHz

E-24/125

- E136069

℃

min

PPM/℃

N/mm

MΩ

Mpa

Gpa

UL燃烧等级/Flammability UL-94 - V-0

0.03

≥260

＜125

Before Tg PPM/℃ ＜25

<1.0

9-11

1-4

＜0.3

≥0.8（TOZ）

3.4

0.008

≥106

450/510

绝缘层最小厚度

Minimum thickness

Td(5%loss) 10℃/min@N_2 ℃ ＞400

T288

Thermal Stress 288℃ solder dip - Pass

Z-axis CTE

X/Y-axis CTE

吸水率/Moisture Absorption

绝缘强度/Dielectric Breakdown D-48/50+D-0.5/23 KV 45

Thermal conductivity ASTM D5470 W/(m ·K) 0.5

剥离强度/Peel Strength

介电常数/Dielectric constant

Dissipation Factor

表面电阻/Surface resistivity

体积电阻率/Volume Resistivity E-24/125 MΩ.cm ≥104

抗弯强度/Bending strength (LW/CW)

弯曲模量/Bending modulus

≥60

High Tg, Halogen Free, Low X,Y/Z-axis CTE

Black Colored BT Laminate for IC Package

HI10L T

◆Lead-free compatible Halogen free material.

◆BT like resin material

◆Lower X,Y/Z-axis CTE

◆High glass transition temperature, High heat resistance (260℃,DMA)

◆Keeping high modulus in high temperature

◆Good punching & Drilling ability

◆Excellent Anti-CAF resistance

◆Excellent in Thickness Uniformity

◆Excellent in index and Color consistency

FEATURES

GENERAL PROPERTIES

◆IC Package

◆Memory

◆MEMS

◆CSP

◆Mini&Micro LED

◆Mini &Micro display (HDI)

◆Mini RGB PKG

(1010, F1010, etc)

APPLICATIONS

Test item Test condition Unit HI10L T

UL号/UL No. -

DMA

TMA

After Tg

50-260℃

Before Tg

After Tg

D-24/23

288℃/10s

@10GHz

E-24/125

℃

min

PPM/℃

N/mm

MΩ

Mpa

Gpa

UL燃烧等级/Flammability UL-94 - V-0

0.03

≥260

＜125

Before Tg PPM/℃ ＜25

<1.0

7-9

1-4

<0.35

≥0.8（TOZ）

4.0

0.008

≥106

490/520

绝缘层最小厚度

Minimum thickness

Td(5%loss) 10℃/min@N_2 ℃ ＞400

T288

Thermal Stress 288℃ solder dip - Pass

Z-axis CTE

X/Y-axis CTE

吸水率/Moisture Absorption

绝缘强度/Dielectric Breakdown D-48/50+D-0.5/23 KV 45

Thermal conductivity ASTM D5470 W/(m ·K) 0.5

剥离强度/Peel Strength

介电常数/Dielectric constant

Dissipation Factor

表面电阻/Surface resistivity

体积电阻率/Volume Resistivity E-24/125 MΩ.cm ≥104

抗弯强度/Bending strength (LW/CW)

弯曲模量/Bending modulus

≥60

High Tg, Halogen Free, Low X,Y/Z-axis CTE

Black Colored BT Laminate for IC Package

HI05L T

◆Lead-free compatible Halogen free material.

◆BT based material

◆Lower X,Y/Z-axis CTE

◆High glass transition temperature, High heat resistance (280℃,DMA)

◆Keeping high modulus in high temperature

◆Good punching & Drilling ability

◆Excellent Anti-CAF resistance

◆Excellent in Thickness Uniformity

FEATURES

GENERAL PROPERTIES

◆FC CSP

◆CPU & GPU

◆FPGA 、ASIC

◆IC Package

◆RF Switch

◆Low Noise Amplifier(LNA)

◆Power Amplifier(PA)

APPLICATIONS

Test item Test condition Unit HI05L T

UL号/UL No. -

DMA

TMA

Before Tg

After Tg

Pull

Compression

D-24/23

288℃/10s

@10GHz

E-24/125

℃

min

PPM/℃

N/mm

MΩ

Gpa

UL燃烧等级/Flammability UL-94 - V-0

0.025

≥280

10-30

20-60

3-5

<10

≤0.3

≥0.8

4.0±0.3

＜0.008

>1X108

≥26

绝缘层最小厚度

Minimum thickness

Td(5%loss) 10℃/min@N_2 ℃ ≥400

T288 ≥30

Thermal Stress 288℃ solder dip - Pass

Z-axis CTE

X/Y-axis CTE

吸水率/Moisture Absorption

剥离强度/Peel Strength

介电常数/Dielectric constant

介电损耗/Dissipation Factor

表面电阻/Surface resistivity

体积电阻/Volume Resistivity E-24/125 MΩ.cm >1X107

杨氏模量/Young's modulus

Gpa

弯曲模量/Bending modulus ≥30

CBF-018

◆Lead-free

◆High Tg

◆Low Ra

◆High thickness uniformity

◆High roundness of laser drilling

◆Excellent capacity of SAP

◆High peel strength for fine-lines

FEATURES

Two-stage vacuum hot-press machine

Device：

1. Before hot-pressing，remove the inner BOPP protect film

2. Vacuum stage, 100℃ + 5 kgf + vacuum 30s, pressing 60s

3. Leveling stage, 100℃+5kgf+leveling 60s

Recommended process conditions：

APPLICATIONS

RECOMMENDED HOT-PRESSING PROCESS

STANDARD SIZE

STRUCTURES

High Tg, Low Ra, High peel strength Crebest Build-up Film for IC

Substrates

Standard size Wideness 506mm, coiled shape

25 μm

30 μm

35 μm

40 μm

Typical thickness

CBF is suitable for processing package substrates with fine-line circuits by SAP (Semi-Additive PCB Process). CBF as advanced packaging materials, can be used in FCBGA, FCCSP,

Embedding, etc..

Release film CBF-018 Protect film

CBF-018

GENERAL PROPERTIES

PERFORMANCE TEST DATA

High Tg, Low Ra, High peel strength Crebest Build-up Film for IC

Substrates

DMA—Tg DMA—R.T. tensile test

Property

Normal thickness

Curing condition

Min.Melting temperature

Min.Melting viscosity

Td@N2

Tg(DMA)

Tg(Tensile TMA)

CTE x-y (30-150℃)

CTE x-y (150-240℃)

Young’s Modulus

Tensile Strength

Elongation

Dk (5 GHz/10GHz)

Df (5 GHz/10GHz)

Test Method Typical Value

Dynamic Rheometer

(Anton Paar MCR302)

TGA (HT DSC HSS2)

25/30/35/40/90 μm

Half-curing 100℃@30 min

170℃@30 min

100℃@30 min

180℃@90 min Post-curing

Tensile Model (TA DMA Q800)

Tensile Model (NETZSCH TMA 402 F1)

Tensile Model

(TMA, NETZSCH TMA 402 F1)

Tensile Model (TA DMA Q800)

SPDR (Keysight E5071C ENA)

113℃

26 Pa·s

385℃

180℃

160℃

37 ppm/K

120 ppm/K

6.0 GPa

94 MPa

5.0%

3.32/3.39

0.018/0.018

CBF-018

TGA——Td95% TMA——CTE

Desmear performance Peel strength (with Cu)

High Tg, Low Ra, High peel strength Crebest Build-up Film for IC

Substrates

Remark:

◆Any specific requirement could be available upon request.

◆The above data are for your reference only.

◆If need more information, please contact Shenzhen CREBEST Electronic Materials Co.,

Ltd through Jack Zhang at 15919232997/jida.zhang@hzccl.com.

SPDR——Dk/Df

Number Freq(MHz) Dk Df Number Freq(MHz) Dk Df

0.018

3.34

3.28

3.36

3.33

3.31

3.32

3.39

3.41

3.35

3.38

3.42

3.39

Ave.

5 GHz 10 GHz

CBF-013

◆Lead-free

◆Mid-CTE

◆High Tg

◆Low Ra

◆High thickness uniformity

◆High roundness of laser drilling

◆Excellent capacity of SAP

◆High peel strength for fine-lines

FEATURES

Two-stage vacuum press machine

Device：

1. Before hot-pressing，remove the inner BOPP protect film

2. Vacuum stage, 100℃ + 5 kgf + vacuum 30s, pressing 60s

3. Leveling stage, 100℃ + 5 kgf + leveling 60s

Recommended process conditions：

APPLICATIONS

RECOMMENDED HOT-PRESSING PROCESS

STANDARD SIZE

STRUCTURES

Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC

Substrates

Standard size Wideness 506mm, coiled shape

25 μm

30 μm

35 μm

40 μm

Typical thickness

CBF is suitable for processing package substrates with fine-line circuits by SAP (Semi-Additive PCB Process). CBF as advanced packaging materials, can be used in FCBGA, FCCSP,

Embedding, etc..

Release film CBF-013 Protect film

CBF-013

GENERAL PROPERTIES

PERFORMANCE TEST DATA

Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC

Substrates

DMA—Tg DMA—R.T. tensile test

Property

Normal thickness

Curing condition

Min.Melting temperature

Min.Melting viscosity

Td@N2

Tg(DMA)

Tg(Tensile TMA)

CTE x-y (30-150℃)

CTE x-y (150-240℃)

Young’s Modulus

Tensile Strength

Elongation

Dk (5 GHz/10GHz)

Df (5 GHz/10GHz)

Test Method Typical Value

Dynamic Rheometer

(Anton Paar MCR302)

TGA (HT DSC HSS2)

25/30/35/40/ μm

Half-curing 100℃@30 min

180℃@30 min

100℃@30 min

180℃@90 min Post-curing

Tensile Model (TA DMA Q800)

Tensile Model (NETZSCH TMA 402 F1)

Tensile Model

(TMA, NETZSCH TMA 402 F1)

Tensile Model (TA DMA Q800)

SPDR (Keysight E5071C ENA)

100℃

14 Pa·s

385℃

175℃

160℃

29 ppm/K

110 ppm/K

9.0 GPa

107 MPa

3.35/3.35

0.015/0.015

CBF-013

TGA——Td95% TMA——CTE

Desmear performance

SPDR——Dk/Df

Peel strength (with Cu)

Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC

Substrates

Number Freq(MHz) Dk Df

10 GHz

Number Freq(MHz) Dk Df

Ave.

3.32

3.37

3.35

3.33

3.35

3.37

3.35

3.34

3.35

0.015

5 GHz

Remark:

◆Any specific requirement could be available upon request.

◆The above data are for your reference only.

◆If need more information, please contact Shenzhen CREBEST Electronic Materials Co.,

Ltd through Jack Zhang at 15919232997/jida.zhang@hzccl.com.

CBF-014A

◆Lead-free

◆Mid-CTE

◆High Tg

◆Low Ra

◆Good thickness uniformity

◆High roundness of laser drilling

◆Excellent capacity of SAP

◆High peel strength for fine-lines

FEATURES

Two-stage vacuum press machine

Equipment：

1. Before hot-pressing，remove the inner BOPP protect film

2. Vacuum stage, 105℃+5kgf+vacuum 60s

3. Leveling stage, 105℃+5kgf+leveling 60s

Recommended process conditions：

APPLICATIONS

RECOMMENDED HOT-PRESSING PROCESS

STANDARD SIZE

STRUCTURES

Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC

Substrates

Standard size Wideness 506mm, coiled shape

25 μm

30 μm

35 μm

40 μm

90 μm

Typical thickness

CBF is suitable for processing package substrates with fine-line circuits by SAP (Semi-Additive PCB Process). CBF as advanced packaging materials, can be used in FCBGA, FCCSP,

Embedding, etc.

Release film CBF-014A Protect film

CBF-014A

GENERAL PROPERTIES

PERFORMANCE TEST DATA

Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC

Substrates

DMA—Tg DMA—R.T. tensile test

Property

Normal thickness

Curing condition

Min.Melting temperature

Min.Melting viscosity

Td@N2

Tg(DMA)

Tg(Tensile TMA)

CTE x-y (30-150℃)

CTE x-y (150-240℃)

Thermal conductivity

Young’s Modulus

Tensile Strength

Elongation

Dk (5 GHz/10GHz)

Df (5 GHz/10GHz)

Test Method Typical Value

Dynamic Rheometer

(Anton Paar MCR302)

TGA (HT DSC HSS2)

Water absorption - < 0.5%

388℃

175℃

165℃

29 ppm/K

110 ppm/K

25/30/35/40/90 μm

Half-curing 100℃@30 min

180℃@30 min

100℃@30 min

180℃@60 min Post-curing

Tensile Model (TA DMA Q800)

Tensile Model (NETZSCH TMA 402 F1)

ASTM D5470-17 (Longwin, LW9389 TIM) 0.5 W/(mK)

Flame retardant UL 94V standard V0

7.5 GPa

84 MPa

3.1%

Tensile Model

(TMA, NETZSCH TMA 402 F1)

Tensile Model (TA DMA Q800)

SPDR (Keysight E5071C ENA)

Breakdown strength (DC/AC) programmable withstanding voltage

tester (CS9917CX, Allwin Instrument)

105℃

37.5 μm, ~10 kV/ ~7 kV

3.28/3.28

0.012/0.012

21 Pa·s

CBF-014A

TGA——Td95% TMA——CTE

Desmear performance

Breakdown strength

SPDR——Dk/Df

Peel strength (with Cu)

Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC

Substrates

Number Freq(MHz) Dk Df Number Freq(MHz) Dk Df

0.012

3.26

3.29

3.27

3.30

3.27

3.28

3.22

3.23

3.32

3.33

3.32

3.28

Ave.

5 GHz 10 GHz

Remark:

◆Any specific require could be available upon request.

◆The above data is for your reference only.

◆If need more information, please contact Shenzhen CREBEST Electronic Materials Co. Ltd

(深圳中科华正半导体材料有限公司) through Jack Zhang at 15919232997/jida.zhang@hzc

cl.com.

CBF-004

◆Lead-free

◆Low CTE

◆High Tg

◆Low Ra

◆Low dielectric loss

◆High roundness of laser drilling

◆Excellent capacity of SAP

◆High peel strength for fine-lines

FEATURES

Two-stage vacuum press machine

Device：

1. Before hot-pressing，remove the inner BOPP protect film

2. Vacuum stage, 100℃ + 5 kgf + vacuum 30s, pressing 60s

3. Leveling stage, 100℃ + 5 kgf + leveling 60s

Recommended process conditions：

APPLICATIONS

RECOMMENDED HOT-PRESSING PROCESS

STANDARD SIZE

STRUCTURES

Low CTE, Low Df, low Ra Crebest Build-up Film for IC Substrates

Standard size Wideness 506mm, coiled shape

25 μm

30 μm

35 μm

90 μm

Thickness

CBF is suitable for processing package substrates with fine-line circuits by SAP (Semi-Additive PCB Process). CBF as advanced packaging materials, can be used in FCBGA, FCCSP,

Embedding, etc..

Release film CBF-004 Protect film

CBF-004

GENERAL PROPERTIES

PERFORMANCE TEST DATA

DMA—Tg DMA—R.T. tensile test

Property

Normal thickness

Curing condition

Min.Melting temperature

Min.Melting viscosity

Td@N2

Tg(DMA)

Tg(Tensile TMA)

CTE x-y (30-150℃)

CTE x-y (150-240℃)

Young’s Modulus

Tensile Strength

Elongation

Dk (5 GHz/10GHz)

Df (5 GHz/10GHz)

Test Method CBF-004

Dynamic Rheometer

(Anton Paar MCR302)

TGA (HT DSC HSS2)

25/30/35/40/90 μm

Semi-curing 130℃@30 min

180℃@30 min

130℃@30 min

190℃@90 min Post-curing

Tensile Model (TA DMA Q800)

Tensile Model (NETZSCH TMA 402 F1)

Tensile Model

(TMA, NETZSCH TMA 402 F1)

Tensile Model (TA DMA Q800)

SPDR (Keysight E5071C ENA)

130℃

200 Pa·s

390℃

180℃

160℃

20 ppm/K

80 ppm/K

12 GPa

90 MPa

1.5%

3.3/3.4

0.0045/0.0045

Low CTE, Low Df, low Ra Crebest Build-up Film for IC Substrates

CBF-004

TGA——Td95% TMA——CTE

Desmear performance

SPDR——Dk/Df

Peel strength (with Cu)

Number Freq(MHz) Thickness(mm) Dk Df

0.005376

0.005103

0.005028

0.005118

0.005171

0.0052

3.216034

3.347095

3.225112

3.276175

3.272771

3.27

Ave.

0.035

5 GHz

Remark:

◆Any specific require could be available upon request.

◆The above data is for your reference only.

◆Please contact Shenzhen CREBEST Electronic Materials Co., Ltd if need more Lami-

nates.

Low CTE, Low Df, low Ra Crebest Build-up Film for IC Substrates

H175HF

FR-4.1 High Tg, Halogen Free & Mid Loss Material

◆耐CAF能力 CAF resistance performance

◆符合Mid-loss材料插损需求 Suitable for Mid-loss

insertion requirements

◆优良的可靠性 Excellent Reliability

产品特性 FEATURES

◆服务器、交换机、基站、电脑周边设备

Server, Switch, Base station, Computer

peripherals

产品应用 APPLICATIONS

产品性能GENERAL PROPERTIES

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

175

168

205

193

2.1

4.70*1010

3.54*10 8

130

550

450

0.12

385

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 4.42

SPDR method 10GHz C-24/23/50 4.30

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 18-20

N/mm 0.85

1.15

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC50%)

介质损耗

Df-Loss Tangent (RC50%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0105

SPDR method 10GHz C-24/23/50 0.0120

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

H175HFZ

FR-4.1 Halogen-free, High Reliability& Mid Loss Material

◆耐CAF能力 CAF resistance performance

◆符合Mid-loss材料插损需求 Suitable for Mid-

loss insertion requirements

◆优良的可靠性 Excellent Reliability

◆更低的Z轴热膨胀系数 Lower Z-axis CTE

产品特性 FEATURES

◆服务器、交换机、基站、线卡 Server,Switch,

Base station ,Line cards

◆厚铜电源 Power supplier and Heavy Copper

◆EV,PEV,HEV,OBC,MDC汽车电子元器件

EV,PEV,HEV,OBC,MDC Automotive electronic

components

产品应用 APPLICATIONS

产品性能GENERAL PROPERTIES

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

180

184

210

194

1.8

4.70*1010

3.54*10 8

130

550

450

0.10

385

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 4.3

SPDR method 10GHz C-24/23/50 4.2

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 12.5

N/mm 0.85

1.15

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC50%)

介质损耗

Df-Loss Tangent (RC50%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0091

SPDR method 10GHz C-24/23/50 0.0100

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

H180HF

FR-4.1 Halogen Free, Low Loss & High Reliability Material

◆优异的耐热性 Excellent thermal reliability

◆优秀的耐CAF性能 Excellent CAF resistance

performance

◆较低的Dk/Df Lower Dk/Df

◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性

Lower Z-axis CTE, offering superior PTH reliability

产品特性 FEATURES

产品性能GENERAL PROPERTIES

◆服务器、交换机、基站 Server, Switch, Base

station

◆背板、线卡 Backplane, Line cards

◆商用路由器 Office Routers

产品应用 APPLICATIONS

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

180

175

210

200

2.2

4.13

4.13*109

2.52*108

630

520

0.12

385

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 4.09

SPDR method 10GHz C-24/23/50 3.90

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 12

N/mm 0.70

1.00

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC50%)

介质损耗

Df-Loss Tangent (RC50%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.005

SPDR method 10GHz C-24/23/50 0.007

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

H185HFL

Low Loss & Low CTE & Halogen Free

产品特性 FEATURES

产品性能GENERAL PROPERTIES

产品应用 APPLICATIONS

◆适用于高可靠性、优异CAF表现求应用场景

For high-reliability and excellent CAF performance applications

◆X/Y/Z 三轴低热膨胀系数（CTE）

Low CTE for X/ Y/ Z-axis direction

◆更低的损耗 Low Df for excellent electrical performance

◆符合 RoHS 环保标准 RoHS Compliant

◆汽车及功率能源模Automotive and

power energy modules

◆移动设备 Mobile device

◆高速服务器 High-speed server

◆网络及电信设备 Network and telecom

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

190

230

270

130

1.25

＞1010

＞109

180

24-26

23-26

0.10

430

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 4.0

SPDR method 10GHz C-24/23/50 3.90

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >60

2.4.24.5 ＜Tg，TMA ppm/℃ 10

N/mm 0.8

1.1

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC50%)

介质损耗

Df-Loss Tangent (RC50%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.005

SPDR method 10GHz C-24/23/50 0.007

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

H190HF

FR4.1 Halogen Free, Very Low Loss & High Reliability Material

◆较低的Dk/Df Lower Dk/Df

◆更优异的耐热性 High heat resistance

◆更低的Z轴热膨胀系数 Lower Z-axis CTE

◆更低的吸水率 Lower moisture absorption

产品特性 FEATURES

产品性能GENERAL PROPERTIES

◆超高速网络设备 High Speed Network equipment

◆服务器、交换机、存储、路由器 Server, Switch,

Storage and Routers

◆光通讯产品等 Optical Modulus, etc.

产品应用 APPLICATIONS

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

175

185

200

209

1.8

4.81*109

2.72*108

135

535

485

0.12

395

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 4.07

SPDR method 10GHz C-24/23/50 3.90

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞60

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 13

N/mm 0.60

0.75

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC50%)

介质损耗

Df-Loss Tangent (RC50%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0034

SPDR method 10GHz C-24/23/50 0.0055

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

H360

Very Low Loss & Heat Resistance Material

◆优异的耐热性 Excellent thermal reliability

◆优秀的耐CAF性能 Excellent anti-CAF performance

◆较低的Dk/Df Lower Dk/Df

◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性

Lower Z-axis CTE, offering superior PTH reliability

产品特性 FEATURES

产品性能GENERAL PROPERTIES

◆超高速网络设备 Ultra high speed network

equipment

◆服务器、交换机、存储 Server, Switch, Storage

◆高性能计算机 High performance computing

◆光通信产品 Optical communication products

产品应用 APPLICATIONS

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

180

208

258

2.5

2.21*109

1.56*108

125

0.55

420

380

0.11

395

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.72

SPDR method 10GHz C-24/23/50 3.65

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞60

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 13

N/mm 0.60

0.75

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC54%)

介质损耗

Df-Loss Tangent (RC54%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0023

SPDR method 10GHz C-24/23/50 0.0048

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

H360(Z)

Very Low Loss & Heat Resistance Material

产品性能GENERAL PROPERTIES

◆优异的耐热性 Excellent thermal reliability

◆优秀的耐CAF性能 Excellent anti-CAF performance

◆较低的Dk/Df Lower Dk/Df

产品特性 FEATURES

◆服务器、交换机、存储 Server, Switch, Storage

◆高性能计算机 High performance computing

◆光通信产品 Optical communication products

产品应用 APPLICATIONS

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

190

215

203

2.0

2.21*109

1.56*108

120

0.65

525

485

0.08

408

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.71

SPDR method 10GHz C-24/23/50 3.65

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞60

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 10

N/mm 0.65

0.75

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC56%)

介质损耗

Df-Loss Tangent (RC56%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0031

SPDR method 10GHz C-24/23/50 0.0045

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

H350

Ultra Low Loss & Heat Resistance Material

◆优异的耐热性 Excellent thermal reliability

◆优秀的耐CAF性能 Excellent anti-CAF performance

◆较低的Dk/Df Lower Dk/Df

◆更低的热膨胀系数 Lower CTE

产品特性 FEATURES

◆超高速网络设备 Ultra high speed network

equipment

◆服务器、交换机、存储 Server, Switch, Storage

◆高性能计算机 High performance computing

◆光通信产品 Optical communication products

产品应用 APPLICATIONS

产品性能GENERAL PROPERTIES

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

175

185

207

180

2.0

1.0*109

1.0*108

120

0.60

500

480

0.08

403

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.90

SPDR method 10GHz C-24/23/50 3.70

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 7

N/mm 0.56

0.65

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC55%)

介质损耗

Df-Loss Tangent (RC55%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0037

SPDR method 10GHz C-24/23/50 0.0042

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

H350(K)

Ultra Low Loss & Heat Resistance Material

产品特性 FEATURES 产品应用 APPLICATIONS

◆优异的耐热性 Excellent thermal reliability

◆优秀的耐CAF性能 Excellent anti-CAF performance

◆较低的Dk/Df Lower Dk/Df

◆更低的热膨胀系数 Lower CTE

◆超高速网络设备 Ultra high speed network

equipment

◆服务器、交换机、存储 Server, Switch, Storage

◆高性能计算机 High performance computing

◆光通信产品 Optical communication products

产品性能GENERAL PROPERTIES

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

175

185

207

180

2.0

1.0*109

1.0*108

120

0.60

500

480

0.08

403

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.44

SPDR method 10GHz C-24/23/50 3.42

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 7

N/mm 0.56

0.65

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC58%)

介质损耗

Df-Loss Tangent (RC58%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0017

SPDR method 10GHz C-24/23/50 0.0021

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

HSD7

Ultra Low Loss & Heat Resistance Material

产品特性 FEATURES

产品性能GENERAL PROPERTIES

产品应用 APPLICATIONS

◆优异的耐热性 Excellent thermal reliability

◆优秀的耐CAF性能 Excellent anti-CAF performance

◆较低的Dk/Df Lower Dk/Df

◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性

Lower Z-axis CTE, offering superior PTH reliability

◆超高速网络设备 Ultra high speed network

equipment

◆服务器、交换机、存储 Server, Switch, Storage

◆高性能计算机 High performance computing

◆光通信产品 Optical communication products

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

195

220

230

2.3

1.0*109

1.0*108

120

0.65

420

390

0.08

405

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.54

SPDR method 10GHz C-24/23/50 3.53

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 12.3

N/mm 0.70

0.65

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC59%)

介质损耗

Df-Loss Tangent (RC59%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0031

SPDR method 10GHz C-24/23/50 0.0035

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

HSD7(K)

Ultra Low Loss & Heat Resistance Material

产品特性 FEATURES

产品性能GENERAL PROPERTIES

产品应用 APPLICATIONS

◆优异的耐热性 Excellent thermal reliability

◆优秀的耐CAF性能 Excellent anti-CAF performance

◆较低的Dk/Df Lower Dk/Df

◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性

Lower Z-axis CTE, offering superior PTH reliability

◆超高速网络设备 Ultra high speed network

equipment

◆交换机、路由器、存储 Switch, Routers, Storage

◆高性能计算机、AI计算 High performance co-

mputing、AI computing

◆光通信产品 Optical communication products

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

195

220

230

2.3

1.0*109

1.0*108

120

0.65

420

390

0.08

405

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.32

SPDR method 10GHz C-24/23/50 3.30

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 11.9

N/mm 0.70

0.65

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC61%)

介质损耗

Df-Loss Tangent (RC61%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0019

SPDR method 10GHz C-24/23/50 0.0023

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

HSD7JA(K)

Ultra Low Loss & Heat Resistance Material

产品特性 FEATURES

产品性能GENERAL PROPERTIES

产品应用 APPLICATIONS

◆优异的耐热性 Excellent thermal reliability

◆优秀的耐CAF性能 Excellent anti-CAF performance

◆较低的Dk/Df Lower Dk/Df

◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性

Lower Z-axis CTE, offering superior PTH reliability

◆超高速网络设备 Ultra high speed network

equipment

◆交换机、路由器、存储 Switch, Routers, Storage

◆高性能计算机、AI计算 High performance co-

mputing、AI computing

◆光通信产品 Optical communication products

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

195

217

240

2.5

1.0*109

1.0*108

120

＞50

0.71

380

360

0.06

410

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.19

SPDR method 10GHz C-24/23/50 3.17

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 12.5

N/mm 0.60

0.65

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC68%)

介质损耗

Df-Loss Tangent (RC68%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0018

SPDR method 10GHz C-24/23/50 0.0019

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

HSD7LG

Halogen-free Ultra-low Loss & Heat Resistance Material

产品特性 FEATURES

产品性能GENERAL PROPERTIES

产品应用 APPLICATIONS

◆较低的Dk/Df Lower Dk/Df

◆优异的耐热性 Excellent thermal reliability

◆优秀的耐CAF性能 Excellent anti-CAF performance

◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性

Lower Z-axis CTE, offering superior PTH reliability

◆AI服务器、交换机、存储、路由器

AI Server, switch, storage, routers

◆光通信产品 Optical communication products

◆AI计算、AI服务器 AI computing、AI Server

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

200

225

200

1.8

1.0*1010

1.0*108

120

＞50

0.54

420

380

0.07

410

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.93

SPDR method 10GHz C-24/23/50 3.90

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 10.1

N/mm 0.69

0.75

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC53%)

介质损耗

Df-Loss Tangent (RC53%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0037

SPDR method 10GHz C-24/23/50 0.0044

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

HSD7LG(K)

Halogen-free Ultra-low Loss & Heat Resistance Material

产品特性 FEATURES

产品性能GENERAL PROPERTIES

产品应用 APPLICATIONS

◆较低的Dk/Df Lower Dk/Df

◆优异的耐热性 Excellent thermal reliability

◆优秀的耐CAF性能 Excellent anti-CAF performance

◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性

Lower Z-axis CTE, offering superior PTH reliability

◆交换机、存储、路由器 Switch, storage, routers

◆光通信产品 Optical communication products

◆AI计算、AI服务器 AI computing、AI Server

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

200

225

200

1.8

1.0*1010

1.0*108

120

＞50

0.54

420

380

0.07

410

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.40

SPDR method 10GHz C-24/23/50 3.37

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 9.1

N/mm 0.69

0.75

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC55%)

介质损耗

Df-Loss Tangent (RC55%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0021

SPDR method 10GHz C-24/23/50 0.0025

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

HSD8(K)

◆更低的损耗 Extreme Low Loss

◆优异的耐热性 Excellent thermal resistance

◆更低的Z轴热膨胀系数 Low Z axis CTE

◆更低的吸水率、优秀的耐CAF性能、优异的可靠性

Low water absorption, excellent anti-CAF, high reliability

产品特性 FEATURES

◆交换机、服务器 Switch, Server

◆路由器、AI计算 Router、AI computing

◆测量仪器 Measuring instrument

产品应用 APPLICATIONS

Extreme Low Loss & Heat Resistance Material

产品性能GENERAL PROPERTIES

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

199

226

145

1.5

4.93*109

3.72*108

135

0.55

384

350

0.10

406

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.31

SPDR method 10GHz C-24/23/50 3.25

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 9.6

N/mm 0.55

0.60

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC68%)

介质损耗

Df-Loss Tangent (RC68%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0011

SPDR method 10GHz C-24/23/50 0.0014

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

HSD8

◆更低的损耗 Extreme Low Loss

◆优异的耐热性 Excellent thermal resistance

◆更低的Z轴热膨胀系数 Low Z axis CTE

◆更低的吸水率、优秀的耐CAF性能、优异的可靠性

Low water absorption, excellent anti-CAF, high reliability

产品特性 FEATURES

◆交换机、服务器 Switch, Server

◆路由器、AI计算 Router、AI computing

◆测量仪器 Measuring instrument

产品应用 APPLICATIONS

Extreme Low Loss & Heat Resistance Material

产品性能GENERAL PROPERTIES

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

199

226

145

1.5

4.93*109

3.72*108

135

0.55

384

350

0.10

406

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.19

SPDR method 10GHz C-24/23/50 3.12

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 9.5

N/mm 0.55

0.60

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC69%)

介质损耗

Df-Loss Tangent (RC69%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0009

SPDR method 10GHz C-24/23/50 0.0012

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

HSD8(C)

◆低介电常数、介质损耗 Low Dk、Df

◆优异的耐热性 Excellent thermal resistance

◆更低的Z轴热膨胀系数 Low Z axis CTE

◆较低的吸水率、耐CAF性能好、高可靠性

Low water absorption, excellent anti-CAF, high reliability

◆无铅制程兼容 Compatible with Lead-free process

产品特性 FEATURES

◆交换机、服务器 Switch, Server

◆路由器、AI计算 Router、AI computing

◆测量仪器 Measuring instrument

产品应用 APPLICATIONS

Extreme Low Loss & Heat Resistance Material

产品性能GENERAL PROPERTIES

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

199

216

165

1.5

4.93*109

3.72*108

135

0.55

455

425

0.10

385

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.19

SPDR method 10GHz C-24/23/50 3.15

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 9.5

N/mm 0.55

0.60

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC68%)

介质损耗

Df-Loss Tangent (RC68%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0009

SPDR method 10GHz C-24/23/50 0.0012

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

HSD8LG K

◆更低的损耗、更低的热膨胀系数

Extreme Low Loss、Lower CTE

◆优异的耐热性、无卤素成分

Excellent thermal resistance、Halogen Free

◆更低的吸水率、优秀的耐CAF性能、优异的可靠性

Low water absorption, excellent anti-CAF, high reliability

产品特性 FEATURES

◆交换机、服务器 Switch, Server

◆路由器、AI计算 Router、AI computing

◆测量仪器 Measuring instrument

产品应用 APPLICATIONS

Extreme Low Loss & Heat Resistance Material

产品性能GENERAL PROPERTIES

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

198

226

145

1.5

4.95*109

4.72*108

135

0.65

355

345

0.10

409

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.31

SPDR method 10GHz C-24/23/50 3.25

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 4.8

N/mm 0.60

0.60

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC64%)

介质损耗

Df-Loss Tangent (RC64%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0012

SPDR method 10GHz C-24/23/50 0.0015

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

HSD8LG K2

◆更低的损耗 Extreme Low Loss

◆优异的耐热性 Excellent thermal resistance

◆更低的热膨胀系数 Lower CTE

◆更低的吸水率、优秀的耐CAF性能、优异的可靠性

Low water absorption, excellent anti-CAF, high reliability

◆无卤素成分 Halogen Free

产品特性 FEATURES

◆交换机、服务器 Switch, Server

◆路由器、AI计算 Router、AI computing

◆测量仪器 Measuring instrument

产品应用 APPLICATIONS

Extreme Low Loss & Heat Resistance Material

产品性能GENERAL PROPERTIES

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

200

223

140

1.8

4.95*109

4.72*108

135

0.65

360

350

0.10

408

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.19

SPDR method 10GHz C-24/23/50 3.15

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 4.6

N/mm 0.60

0.60

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC66%)

介质损耗

Df-Loss Tangent (RC66%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0010

SPDR method 10GHz C-24/23/50 0.0013

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

HSD8LG Q

◆更低的损耗、更低的热膨胀系数

Extreme Low Loss、Lower CTE

◆优异的耐热性、无卤素成分

Excellent thermal resistance、Halogen Free

◆更低的吸水率、优秀的耐CAF性能、优异的可靠性

Low water absorption, excellent anti-CAF, high reliability

产品特性 FEATURES

◆交换机、服务器 Switch, Server

◆路由器、AI计算 Router、AI computing

◆测量仪器 Measuring instrument

产品应用 APPLICATIONS

Extreme Low Loss & Heat Resistance Material

产品性能GENERAL PROPERTIES

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

200

221

145

1.5

4.90*109

4.82*108

135

0.65

365

355

0.10

408

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.14

SPDR method 10GHz C-24/23/50 3.09

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 3.1

N/mm 0.60

0.60

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC65%)

介质损耗

Df-Loss Tangent (RC65%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0009

SPDR method 10GHz C-24/23/50 0.0011

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

HSD9LG Q

◆更低的损耗、更低的热膨胀系数

Extreme Low Loss、Lower CTE

◆优异的耐热性、无卤素成分

Excellent thermal resistance、Halogen Free

◆更低的吸水率、优秀的耐CAF性能、优异的可靠性

Low water absorption, excellent anti-CAF, high reliability

产品特性 FEATURES

◆交换机、服务器 Switch, Server

◆路由器、AI计算 Router、AI computing

◆测量仪器 Measuring instrument

产品应用 APPLICATIONS

Extreme Low Loss & Heat Resistance Material

产品性能GENERAL PROPERTIES

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

190

221

140

1.6

4.17*109

3.45*108

135

0.55

310

315

0.10

400

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.06

SPDR method 10GHz C-24/23/50 3.05

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 5.5

N/mm 0.60

0.60

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC70%)

介质损耗

Df-Loss Tangent (RC70%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.00062

SPDR method 10GHz C-24/23/50 0.00065

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

HSD9LG K2

◆更低的损耗、更低的热膨胀系数

Extreme Low Loss、Lower CTE

◆优异的耐热性、无卤素成分

Excellent thermal resistance、Halogen Free

◆更低的吸水率、优秀的耐CAF性能、优异的可靠性

Low water absorption, excellent anti-CAF, high reliability

产品特性 FEATURES

◆交换机、服务器 Switch, Server

◆路由器、AI计算 Router、AI computing

◆测量仪器 Measuring instrument

产品应用 APPLICATIONS

Extreme Low Loss & Heat Resistance Material

产品性能GENERAL PROPERTIES

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

190

221

140

1.6

4.17*109

3.45*108

135

0.55

310

315

0.10

400

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.20

SPDR method 10GHz C-24/23/50 3.16

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞30

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 6.2

N/mm 0.60

0.60

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC70%)

介质损耗

Df-Loss Tangent (RC70%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0009

SPDR method 10GHz C-24/23/50 0.0011

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

HSD6LG

Halogen-free Ultra-low Loss & Heat Resistance Material

产品特性 FEATURES 产品应用 APPLICATIONS

◆较低的Dk/Df Lower Dk/Df

◆优异的耐热性 Excellent thermal reliability

◆优秀的耐CAF性能 Excellent anti-CAF performance

◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性

Lower Z-axis CTE, offering superior PTH reliability

◆服务器、交换机、存储、路由器

Server, switch, storage, routers

◆汽车毫米波雷达

Millimeter wave radar for Automotive

◆高性能计算机

High performance computing

产品性能GENERAL PROPERTIES

℃

ppm/℃

MΩ·cm

MΩ

sec

N/mm2

℃

200

225

240

2.2

1*1010

1*108

120

＞50

0.55

420

380

0.07

410

DSC

TMA

DMA

＜Tg，TMA

＞Tg，TMA

50~260℃，TMA

1MHz C-24/23/50

C-96/35/90

D48/50+D0.5/23

As received

E-1/105+D-24/23

TGA(5%W.L)

2.4.25

2.4.24

2.4.24.4

2.4.13.1

2.4.24

2.5.5.9

2.5.5.9 1GHz C-24/23/50 / 3.66

SPDR method 10GHz C-24/23/50 3.92

2.5.17.1

2.5.1

2.5.6

2.4.4

2.6.2.1

2.4.24.6

TMA(Clad) min ＞60

2.4.24.1

TMA(Etched) min ＞60

IEC-60112 C-96/20/65 Rating PLC 3

288°C, solder dip sec >180

2.4.24.5 ＜Tg，TMA ppm/℃ 10

N/mm 0.54

0.55

2.4.8 1 oz As received

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

耐热性-T288

热应力-Thermal Stress

热膨胀系数-CTE (Z-axis)

介电常数

Dk-Permittivity(RC62%)

介质损耗

Df-Loss Tangent (RC62%)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

耐电弧性-Arc Resistance

击穿电压-Dielectric Breakdown

相对漏电起痕指数-CTI

吸水率-Water Absorption

耐燃性-Flammability UL-94 A&E-24/125 / V0

热分解温度-TD

(Decomposition Temperature)

弯曲强度Flexural Strength

Warp

Fill

玻璃态转化温度-TG

热膨胀系数-CTE (XY-axis)

项目

Item

剥离强度(HTE)-Peel Strength

剥离强度(RTF)-Peel Strength

剥离强度(HVLP)-Peel Strength

2.5.5.9 1MHz C-24/23/50 /

2.5.5.9 1GHz C-24/23/50 / 0.0033

SPDR method 10GHz C-24/23/50 0.0045

热性能

Thermal

电性能

Electrical

物理性能

Physical

属性

Property

PTFE with Glass Reinforced RF Circuit Material

H5220

◆Dk/Df在不同频率和温度下保持稳定 Consistent and

Stable Dk/Df over Frequency and Temperature

◆低损耗因子 Low Dielectric Loss Tangent

◆低吸水率 Low Moisture Absorption

◆卓越的性价比 Excellent Price Performance Value

产品特性 FEATURES

产品性能GENERAL PROPERTIES

◆基站天线 Base Station Antennas

◆卫星通讯 Satellite Communications

◆滤波器、耦合器、低噪声放大器 Filers, Couplers,

LNAs

◆功率放大器 Power Amplifiers

◆相控阵天线 Phased Array Antennas

◆航空电子和航空航天 Avionics and Aerospace

产品应用 APPLICATIONS

10GHz/23℃

CTE (30-260℃)

C-96/35/90

100℃

D-24/23

C-48/23/50

C-48/23/50, E-24/125

介电常数-Dk

介质损耗-Df

热膨胀系数-CTE (X)

热膨胀系数-CTE (Y)

热膨胀系数-CTE (Z)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

导热系数-Thermal Conductivity

吸水率-Water Absorption

热分解温度-TD

剥离强度-Peel strength

(Hoz Cu)

耐燃性-Flammability

2.5.5.5

2.4.24C

2.5.17.1

ASTM-D5470

2.6.2.1A

2.4.24.6

2.4.8

UL94

ppm / ℃

MΩ·cm

MΩ

W/m·K

℃

N/mm

2.20+/-0.04

0.0009

220

108

0.27

<0.1

>500

≥1.2

产品规格PRODUCT SPECIFICATIONS

厚度

Standard Thickness

常规尺寸

Standard Panel Size

标配铜箔

Standard Copper Foil

0.020\"(0.508mm) ±0.002\"

0.030\"(0.762mm) ±0.002\"

0.040\"(1.016mm) ±0.002\"

0.060\"(1.524mm) ±0.004\"

41\"*49\" (1041mmx1245mm)

37\"*49\" (940mmx1245mm)

18\"*24\" (457mmx610mm)

1/2 OZ (17μm)

1 OZ (35μm)

项目

Item

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

PTFE with Glass Reinforced RF Circuit Material

H5255

◆Dk/Df在不同频率和温度下保持稳定 Consistent and

Stable Dk/Df over Frequency and Temperature

◆低损耗因子 Low Dielectric Loss Tangent

◆低吸水率 Low Moisture Absorption

◆卓越的性价比 Excellent Price Performance Value

产品特性 FEATURES

◆基站天线 Base Station Antennas

◆卫星通讯 Satellite Communications

◆滤波器、耦合器、低噪声放大器 Filers, Couplers,

LNAs

◆功率放大器 Power Amplifiers

◆相控阵天线 Phased Array Antennas

◆航空电子和航空航天 Avionics and Aerospace

产品应用 APPLICATIONS

产品性能GENERAL PROPERTIES

10GHz/23℃

CTE (30-260℃)

C-96/35/90

100℃

D-24/23

C-48/23/50

介电常数-Dk

介质损耗-Df

热膨胀系数-CTE (X)

热膨胀系数-CTE (Y)

热膨胀系数-CTE (Z)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

导热系数-Thermal Conductivity

吸水率-Water Absorption

热分解温度-TD

剥离强度-Peel strength

(Hoz Cu)

耐燃性-Flammability

2.5.5.5

2.4.24C

2.5.17.1

ASTM-D5470

2.6.2.1A

2.4.24.6

2.4.8

UL94

ppm / ℃

MΩ·cm

MΩ

W/m·K

℃

N/mm

2.55+/-0.05

0.0018

200

108

0.27

<0.1

>500

≥1.2

产品规格PRODUCT SPECIFICATIONS

厚度

Standard Thickness

常规尺寸

Standard Panel Size

标配铜箔

Standard Copper Foil

0.030\"(0.762mm) ±0.002\"

0.040\"(1.016mm) ±0.002\"

0.060\"(1.524mm) ±0.004\"

41\"*49\" (1041mmx1245mm)

37\"*49\" (940mmx1245mm)

18\"*24\" (457mmx610mm)

1/2 OZ (17μm)

1 OZ (35μm)

项目

Item

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

PTFE with Glass Reinforced RF Circuit Material

H5265

产品性能GENERAL PROPERTIES

10GHz/23℃

CTE (30-260℃)

C-96/35/90

100℃

D-24/23

C-48/23/50

介电常数-Dk

介质损耗-Df

热膨胀系数-CTE (X)

热膨胀系数-CTE (Y)

热膨胀系数-CTE (Z)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

导热系数-Thermal Conductivity

吸水率-Water Absorption

热分解温度-TD

剥离强度-Peel strength

(Hoz Cu)

耐燃性-Flammability

2.5.5.5

2.4.24C

2.5.17.1

ASTM-D5470

2.6.2.1A

2.4.24.6

2.4.8

UL94

ppm / ℃

MΩ·cm

MΩ

W/m·K

℃

N/mm

2.65+/-0.05

0.0018

160

108

0.30

<0.1

>500

≥1.2

产品规格PRODUCT SPECIFICATIONS

厚度

Standard Thickness

常规尺寸

Standard Panel Size

标配铜箔

Standard Copper Foil

0.030\"(0.762mm) ±0.002\"

0.040\"(1.016mm) ±0.002\"

0.060\"(1.524mm) ±0.004\"

41\"*49\" (1041mmx1245mm)

37\"*49\" (940mmx1245mm)

18\"*24\" (457mmx610mm)

1/2 OZ (17μm)

1 OZ (35μm)

项目

Item

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

◆Dk/Df在不同频率和温度下保持稳定 Consistent and

Stable Dk/Df over Frequency and Temperature

◆低损耗因子 Low Dielectric Loss Tangent

◆低吸水率 Low Moisture Absorption

◆卓越的性价比 Excellent Price Performance Value

产品特性 FEATURES

◆基站天线 Base Station Antennas

◆卫星通讯 Satellite Communications

◆滤波器、耦合器、低噪声放大器 Filers, Couplers,

LNAs

◆功率放大器 Power Amplifiers

◆相控阵天线 Phased Array Antennas

◆航空电子和航空航天 Avionics and Aerospace

产品应用 APPLICATIONS

PTFE with Glass Reinforced RF Circuit Material

H5300H

产品性能GENERAL PROPERTIES

10GHz/23℃

CTE (30-260℃)

C-96/35/90

100℃

D-24/23

C-48/23/50

介电常数-Dk

介质损耗-Df

热膨胀系数-CTE (X)

热膨胀系数-CTE (Y)

热膨胀系数-CTE (Z)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

导热系数-Thermal Conductivity

吸水率-Water Absorption

热分解温度-TD

剥离强度-Peel strength

(Hoz Cu)

耐燃性-Flammability

2.5.5.5

2.4.24C

2.5.17.1

ASTM-D5470

2.6.2.1A

2.4.24.6

2.4.8

UL94

ppm / ℃

MΩ·cm

MΩ

W/m·K

℃

N/mm

2.98+/-0.05

0.0020

108

0.30

<0.15

>500

≥1.20

产品规格PRODUCT SPECIFICATIONS

厚度

Standard Thickness

常规尺寸

Standard Panel Size

标配铜箔

Standard Copper Foil

0.020\"(0.508mm) ±0.002\"

0.030\"(0.762mm) ±0.002\"

0.040\"(1.016mm) ±0.002\"

0.060\"(1.524mm) ±0.004\"

41\"*49\" (1041mmx1245mm)

37\"*49\" (940mmx1245mm)

18\"*24\" (457mmx610mm)

1/2 OZ (17μm)

1 OZ (35μm)

项目

Item

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

◆Dk/Df在不同频率和温度下保持稳定 Consistent and

Stable Dk/Df over Frequency and Temperature

◆低损耗因子 Low Dielectric Loss Tangent

◆低吸水率 Low Moisture Absorption

◆卓越的性价比 Excellent Price Performance Value

产品特性 FEATURES

◆基站天线 Base Station Antennas

◆卫星通讯 Satellite Communications

◆天线馈电网络 Antenna Feed Networks

◆DAS & CPE 天线 DAS & CPE Antenna

◆射频无源元件 RF Passive Components

产品应用 APPLICATIONS

PTFE with Glass Reinforced RF Circuit Material

H5300S

◆Dk/Df在不同频率和温度下保持稳定 Consistent and

Stable Dk/Df over Frequency and Temperature

◆低损耗因子 Low Dielectric Loss Tangent

◆低吸水率 Low Moisture Absorption

◆卓越的性价比 Excellent Price Performance Value

产品特性 FEATURES

◆基站天线 Base Station Antennas

◆卫星通讯 Satellite Communications

◆天线馈电网络 Antenna Feed Networks

◆DAS & CPE 天线 DAS & CPE Antenna

◆射频无源元件 RF Passive Components

产品应用 APPLICATIONS

产品性能GENERAL PROPERTIES

产品规格PRODUCT SPECIFICATIONS

厚度

Standard Thickness

常规尺寸

Standard Panel Size

标配铜箔

Standard Copper Foil

0.0051\"(0.130mm)±0.0007\"

0.0094\"(0.239mm)±0.0007\"

0.020\"(0.508mm) ±0.001\"

0.030\"(0.762mm) ±0.001\"

0.040\"(1.016mm) ±0.002\"

0.050\"(1.270mm) ±0.003\"

0.060\"(1.524mm) ±0.004\"

2.79

2.89

2.92

2.94

2.97

2.98

36\"*48\" (914mm×1219mm)

18\"*24\" (457mm×610mm)

1/2 OZ (17μm)

1 OZ (35μm)

可选埋阻铜箔

介电常数

10GHz/23℃

10GHz (-40-150℃)

CTE (30-260℃)

C-96/35/90

100℃

D-24/23

C-48/23/50

介电常数-Dk

介质损耗-Df

温漂-TCDK

热膨胀系数-CTE (X)

热膨胀系数-CTE (Y)

热膨胀系数-CTE (Z)

体积电阻-Volume Resistivity

表面电阻-Surface Resistivity

导热系数-Thermal Conductivity

吸水率-Water Absorption

热分解温度-TD

剥离强度-Peel strength

(Hoz Cu)

耐燃性-Flammability

2.5.5.5

2.4.24C

2.5.17.1

ASTM-D5470

2.6.2.1A

2.4.24.6

2.4.8

UL94

ppm / ℃

MΩ·cm

MΩ

W/m·K

℃

N/mm

2.94+/-0.05

0.0012

-9

108

0.55

<0.2

>500

≥0.80

项目

Item

检测方法

IPC-TM-650

测试条件

Test Condition

单位

Unit

典型值

Typical value

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